BAV303-GS08 [VISHAY]

DIODE 0.25 A, 250 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, MICROMELF-2, Signal Diode;
BAV303-GS08
型号: BAV303-GS08
厂家: VISHAY    VISHAY
描述:

DIODE 0.25 A, 250 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, MICROMELF-2, Signal Diode

二极管
文件: 总6页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAV300 / 301 / 302 / 303  
VISHAY  
Vishay Semiconductors  
Small Signal Switching Diodes, High Voltage  
Features  
• Silicon Epitaxial Planar Diodes  
• Saving space  
• Hermetic sealed parts  
• Fits onto SOD-323 / SOT-23 footprints  
• Electrical data identical with the devices  
BAV100...BAV103 / BAV200...BAV203  
9612315  
Applications  
General purposes  
Mechanical Data  
Case: MicroMELF Glass Case  
Weight: approx. 12 mg  
Cathode Band Color: Black  
Packaging Codes/Options:  
GS18 / 10 k per 13" reel (8 mm tape), 10 k/box  
GS08 / 2.5 k per 7" reel (8 mm tape), 12.5 k/box  
Parts Table  
Part  
Type differentiation  
Ordering code  
Remarks  
Tape and Reel  
BAV300  
BAV301  
BAV302  
BAV303  
V
V
V
V
= 60 V  
BAV300-GS18 or BAV300-GS08  
RRM  
RRM  
RRM  
RRM  
= 120 V  
= 200 V  
= 250 V  
BAV301-GS18 or BAV301-GS08  
BAV302-GS18 or BAV302-GS08  
BAV303-GS18 or BAV303-GS08  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Absolute Maximum Ratings  
T
= 25 °C, unless otherwise specified  
Parameter  
amb  
Test condition  
Part  
Symbol  
Value  
Unit  
V
Peak reverse voltage  
BAV300  
V
V
V
V
60  
120  
200  
250  
50  
RRM  
RRM  
RRM  
RRM  
BAV301  
BAV302  
BAV303  
BAV300  
BAV301  
BAV302  
BAV303  
V
V
V
Reverse voltage  
V
V
V
V
V
R
R
R
R
100  
150  
200  
250  
1
V
V
V
Forward current  
I
mA  
A
F
Peak forward surge current  
Forward peak current  
t = 1 s, T = 25 °C  
I
FSM  
p
j
f = 50 Hz  
I
625  
mA  
FM  
Document Number 85545  
Rev. 1.8, 14-May-04  
www.vishay.com  
1
BAV300 / 301 / 302 / 303  
Vishay Semiconductors  
VISHAY  
Thermal Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
Symbol  
Value  
500  
Unit  
K/W  
Junction ambient  
mounted on epoxy-glass hard  
tissue, Fig. 4  
R
thJA  
2
35 µm copper clad, 0.9 mm  
copper area per electrode  
Junction temperature  
T
175  
°C  
°C  
j
Storage temperature range  
T
- 65 to + 175  
stg  
Electrical Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
= 100 mA  
Part  
Symbol  
Min  
Typ.  
Max  
1
Unit  
V
Forward voltage  
Reverse current  
I
V
F
F
V
V
V
V
= 50 V  
BAV300  
BAV301  
BAV302  
BAV303  
BAV300  
BAV301  
BAV302  
BAV303  
BAV300  
I
I
I
I
I
I
I
I
100  
100  
100  
100  
15  
nA  
nA  
nA  
nA  
µA  
µA  
µA  
µA  
V
R
R
R
R
R
= 100 V  
= 150 V  
= 200 V  
R
R
R
R
R
R
R
T = 100 °C, V = 50 V  
j
R
T = 100 °C, V = 100 V  
15  
j
R
T = 100 °C, V = 150V  
15  
j
R
T = 100 °C, V = 200V  
15  
j
R
Breakdown voltage  
I
= 100 µA, t /T = 0.01,  
V
V
60  
R
p
(BR)  
t = 0.3 ms  
p
I
= 100 µA, t /T = 0.01,  
BAV301  
120  
V
R
p
(BR)  
t = 0.3 ms  
p
BAV302  
BAV303  
V
V
200  
250  
V
V
(BR)  
(BR)  
Diode capacitance  
V
= 0, f = 1 MHz  
C
r
1.5  
5
pF  
R
D
Differential forward resistance  
Reverse recovery time  
I
= 10 mA  
F
f
I
= I = 30 mA, i = 3 mA,  
t
rr  
50  
ns  
F
R
R
R = 100 Ω  
L
www.vishay.com  
2
Document Number 85545  
Rev. 1.8, 14-May-04  
BAV300 / 301 / 302 / 303  
VISHAY  
Vishay Semiconductors  
Typical Characteristics (Tamb = 25 °C unless otherwise specified)  
1000  
0.71  
1.3  
1.27  
100  
0.152  
Scattering Limit  
10  
9.9  
0.355  
25  
1
V
= V  
RRM  
R
0.1  
10  
0.01  
200  
0
40  
80  
120  
160  
2.5  
24  
T - Junction Temperature ( °C )  
j
94 9084  
95 10329  
Fig. 1 Reverse Current vs. Junction Temperature  
Fig. 4 Board for R  
definition (in mm)  
thJA  
1000  
T = 25°C  
j
100  
Scattering Limit  
10  
1
0.1  
2.0  
0
0.4  
V
0.8  
1.2  
1.6  
- Forward Voltage ( V )  
94 9085  
F
Fig. 2 Forward Current vs. Forward Voltage  
1000  
100  
T = 25°C  
j
10  
1
100  
0.1  
1
10  
I
- Forward Current ( mA )  
94 9089  
F
Fig. 3 Differential Forward Resistance vs. Forward Current  
Document Number 85545  
Rev. 1.8, 14-May-04  
www.vishay.com  
3
BAV300 / 301 / 302 / 303  
Vishay Semiconductors  
VISHAY  
Package Dimensions in mm (Inches)  
ISO Method E  
9612072  
Reflow Soldering  
Wave Soldering  
1.2 (0.047)  
0.8 (0.031)  
1.4 (0.055)  
0.8 (0.031)  
0.9 (0.035)  
0.9 (0.035)  
0.8 (0.031)  
2.4 (0.094)  
1.0 (0.039)  
2.8 (0.109)  
www.vishay.com  
4
Document Number 85545  
Rev. 1.8, 14-May-04  
BAV300 / 301 / 302 / 303  
VISHAY  
Vishay Semiconductors  
Ozone Depleting Substances Policy Statement  
It is the policy of Vishay Semiconductor GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and  
operatingsystems with respect to their impact on the health and safety of our employees and the public, as  
well as their impact on the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are  
known as ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs  
and forbid their use within the next ten years. Various national and international initiatives are pressing for an  
earlier ban on these substances.  
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the  
use of ODSs listed in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments  
respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting  
substances and do not contain such substances.  
We reserve the right to make changes to improve technical design  
and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each  
customer application by the customer. Should the buyer use Vishay Semiconductors products for any  
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all  
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal  
damage, injury or death associated with such unintended or unauthorized use.  
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423  
Document Number 85545  
Rev. 1.8, 14-May-04  
www.vishay.com  
5
Legal Disclaimer Notice  
Vishay  
Notice  
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,  
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied, by  
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's  
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express  
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness  
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Vishay for any damages resulting from such improper use or sale.  
Document Number: 91000  
Revision: 08-Apr-05  
www.vishay.com  
1

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