BYV38 [VISHAY]

Fast Silicon Mesa Rectifiers; 快速硅梅萨整流器
BYV38
型号: BYV38
厂家: VISHAY    VISHAY
描述:

Fast Silicon Mesa Rectifiers
快速硅梅萨整流器

整流二极管
文件: 总4页 (文件大小:45K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BYV37.BYV38  
Vishay Telefunken  
Fast Silicon Mesa Rectifiers  
Features  
Glass passivated junction  
Hermetically sealed package  
Low reverse current  
Soft recovery characteristics  
Applications  
94 9539  
Fast ”soft recovery” rectifier  
Absolute Maximum Ratings  
T = 25 C  
j
Parameter  
Reverse voltage  
Test Conditions  
Type  
BYV37  
BYV38  
Symbol  
Value  
800  
1000  
50  
Unit  
V
V
V
R
V
R
Peak forward surge current  
t =10ms,  
p
I
A
FSM  
half sinewave  
Average forward current  
Junction and storage temperature range  
T =40 C  
amb  
I
2
A
C
FAV  
T =T  
j
–65...+175  
stg  
Maximum Thermal Resistance  
T = 25 C  
j
Parameter  
Junction ambient  
Test Conditions  
Symbol  
Value  
45  
100  
Unit  
K/W  
K/W  
l=10mm, T =constant  
R
thJA  
R
thJA  
L
on PC board with spacing 25mm  
Electrical Characteristics  
T = 25 C  
j
Parameter  
Test Conditions  
Type  
Symbol Min  
Typ Max Unit  
Forward voltage  
Reverse current  
I =1A  
V
1.0  
1.1  
5
150  
300  
V
A
A
ns  
pF  
F
F
I
I
R
T =150 C  
j
R
Reverse recovery time I =0.5A, I =1A, i =0.25A  
Diode Capacitance  
t
rr  
C
D
F
R
R
V =4V, f=1MHz  
R
15  
Document Number 86045  
Rev. 2, 24-Jun-98  
www.vishay.de FaxBack +1-408-970-5600  
1 (4)  
BYV37.BYV38  
Vishay Telefunken  
Characteristics (Tj = 25 C unless otherwise specified)  
120  
100  
80  
60  
40  
20  
0
2.5  
2.0  
1.5  
1.0  
0.5  
0
V =V  
half sinewave  
R
R RM  
R
thJA  
=45K/W  
l=10mm  
l
l
R
=100K/W  
thJA  
PCB: d=25mm  
T =constant  
L
30  
0
20 40 60 80 100 120 140 160 180  
– Ambient Temperature ( °C )  
0
5
10  
15  
20  
25  
15773  
T
amb  
94 9552  
l – Lead Length ( mm )  
Figure 1. Max. Thermal Resistance vs. Lead Length  
Figure 4. Max. Average Forward Current vs.  
Ambient Temperature  
500  
10  
V
= V  
RRM  
R
450  
400  
350  
300  
250  
200  
150  
100  
50  
T =175°C  
j
R
=
thJA  
1
0.1  
45K/W  
100K/W  
160K/W  
T =25°C  
j
0.01  
BYV38  
0.001  
BYV37  
150  
0.0001  
0
25  
50  
75  
100  
125  
175  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
– Forward Voltage ( V )  
15774  
T – Junction Temperature ( °C )  
j
15772  
V
F
Figure 2. Max. Reverse Power Dissipation vs.  
Junction Temperature  
Figure 5. Max. Forward Current vs. Forward Voltage  
1000  
35  
V
= V  
RRM  
f=1MHz  
R
30  
25  
20  
15  
10  
5
100  
10  
1
0
25  
50  
75  
100  
125  
150  
175  
0.1  
1.0  
V – Reverse Voltage ( V )  
R
10.0  
100.0  
15775  
T – Junction Temperature ( °C )  
15776  
j
Figure 3. Max. Reverse Current vs.  
Junction Temperature  
Figure 6. Typ. Diode Capacitance vs. Reverse Voltage  
www.vishay.de FaxBack +1-408-970-5600  
Document Number 86045  
Rev. 2, 24-Jun-98  
2 (4)  
BYV37.BYV38  
Vishay Telefunken  
Dimensions in mm  
3.6 max.  
94 9538  
Sintered Glass Case  
SOD 57  
Weight max. 0.5g  
Cathode Identification  
technical drawings  
according to DIN  
specifications  
0.82 max.  
26 min.  
26 min.  
4.2 max.  
Document Number 86045  
Rev. 2, 24-Jun-98  
www.vishay.de FaxBack +1-408-970-5600  
3 (4)  
BYV37.BYV38  
Vishay Telefunken  
Ozone Depleting Substances Policy Statement  
It is the policy of Vishay Semiconductor GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and operating  
systems  
with respect to their impact on the health and safety of our employees and the public, as well as their impact on  
the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as  
ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and  
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban  
on these substances.  
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of  
ODSs listed in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting  
substances and do not contain such substances.  
We reserve the right to make changes to improve technical design and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each customer application  
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the  
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or  
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.  
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423  
www.vishay.de FaxBack +1-408-970-5600  
Document Number 86045  
Rev. 2, 24-Jun-98  
4 (4)  

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