CDHV2512AG20M0G0500HN1 [VISHAY]

Thick Film Chip Dividers, High Voltage;


型号：	CDHV2512AG20M0G0500HN1
厂家：	VISHAY
描述：	Thick Film Chip Dividers, High Voltage
文件：	总5页 (文件大小：132K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CDHV

Vishay Techno

www.vishay.com

Thick Film Chip Dividers, High Voltage

FEATURES

• High voltage up to 3000 V

• Typical resistance ratios of 250:1 to a maximum

resistance ratio of 500:1

Available

• Flow solderable

• Tape and reel packaging available

• Termination style: 3-sided wraparound termination or

single termination flip chip available

• Suitable for solderable, epoxy bondable, or wire bondable

applications

LINKS TO ADDITIONAL RESOURCES

• Termination material: solder-coated nickel barrier or

solder coated non-magnetic terminations standard; gold,

palladium silver, platinum gold, platinum silver or platinum

palladium gold terminations available

3D Models

Footprints

• Multiple styles, termination materials and configurations,

allow wide design flexibility

• Epoxy bondable or wire bondable non-magnetic

terminations available

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Note

This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts

with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

STANDARD ELECTRICAL SPECIFICATIONS

MAXIMUM

WORKING

VOLTAGE ⁽¹⁾

TEMPERATURE

COEFFICIENT ⁽⁴⁾

(-55 °C to +155 °C)

ppm/°C

POWER RATING

RESISTANCE

RANGE ⁽²⁾

GLOBAL

MODEL

CASE

SIZE

TOLERANCE ⁽³⁾

ꢀ

TCR TRACKING

ppm/°C

P_{70 °C}

CDHV 2512

2512

3000

20M to 20G

1, 2, 5, 10, 20

100

50 (typical)

Notes

(1)

Continuous working voltage shall be P x R or maximum working voltage, whichever is less

Resistance values below 1 GΩ are calibrated at 100 V_DC, and values of 1 GΩ and above are calibrated at 1000 V_DC. Calibration at other

voltages available upon request

Contact factory for tighter tolerances

Reference only: not for all values specified. Consult factory for your value

(2)

(3)

(4)

VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL

RESISTANCE (Ω)

RATIO (TYPICAL)

VCR (ppm/V)

TCR (ppm/°C) -55 °C to +155 °C

20M

250:1

100

150

200

150M

800M

300:1

500:1

Note

•

Contact factory for other ratios

Revision: 19-May-2021

Document Number: 68020

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CDHV

Vishay Techno

www.vishay.com

GLOBAL PART NUMBER INFORMATION

New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format)

GLOBAL

MODEL

TERM

STYLE

TERM

MATERIAL

RESISTANCE

VALUE (R₁)

RATIO

SOLDER

TOLERANCE

PACKAGING

(R₁+ R₂) / R₂TOLERANCE TERMINATION

CDHV =

A =

F = nickel barrier

M = MΩ

G = GΩ

F = 1 %

G = 2 %

3 digit

significant

G = 2 %

H = 3 %

E = Sn100

B = bulk

CDHV2512 3-sided G = non-magnetic

F = Sn95/Ag5, (250 pcs max.)

B = top

only

A = palladium

silver

B = platinum gold

C = gold

D = platinum

silver

E = platinum

palladium gold

20M0 = 20 MΩ

J = 5 % figure, followed J = 5 %

HSD

N = no solder

S = Sn62 /

Pb36 / Ag2,

HSD

F = T / R

(full reel)

800M = 800 MΩ K = 10 % by a multiplier

1G00 = 1 GΩ

M = 20 %

0500 = 50:1

2500 = 250:1

3000 = 300:1

5000 = 500:1

1 = T / R

(1000 pcs)

5 = T / R

(500 pcs)

T = T / R

(250 pcs min.)

W =

T = Sn90 / Pb10

waffle tray

Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted)

CDHV2512

2005

2500

HISTORICAL

MODEL

TERM

STYLE

TERM

MATERIAL

RESISTANCE

VALUE (R₁)

RATIO

(R₁+ R₂) / R₂

RATIO

TOLERANCE

SOLDER

TERMINATION

TOLERANCE

Note

•

For additional information on packaging, refer to the “Surface Mount Resistor Packaging” document (www.vishay.com/doc?31543)

MATERIAL SPECIFICATIONS

Resistive element

Encapsulation

Substrate

Ruthenium oxide

Glass

96 % alumina

Solder-coated nickel barrier or solder coated non-magnetic terminations standard.

Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations available.

Termination

Solder finish

Pure tin or tin / lead solder alloys standard. Tin / silver or tin / lead / silver solder alloys available.

ENVIRONMENTAL SPECIFICATIONS

Operating temperature

-55 °C to +155 °C

Life

Less than 0.5 % change when tested at full rated power

Note

•

Reference only: not for all values specified. Consult factory for your size and value

Revision: 19-May-2021

Document Number: 68020

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CDHV

Vishay Techno

www.vishay.com

DIMENSIONS in inches (millimeters)

Style B

Style A

Style A Bottom

(3-sided wraparound)

LENGTH (L)

TERMINATION

WIDTH (W)

THICKNESS (T)

0ꢁ005 (0ꢁ127)

0ꢁ005

0ꢁ006 (0ꢁ152)

Style A

(3-sided wraparound)

0.250

0.126

0.025

0.040

0.046

Style B

0.240

0.025

0.040

(top only)

DERATING CURVE

120

100

-55

-25

25 50

75 100 125

175

155

Ambient Temperature in °C

Note

Reference only: not for all values specified. Consult factory for your specific value

•

Revision: 19-May-2021

Document Number: 68020

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CDHV

Vishay Techno

www.vishay.com

TERMINATION

MATERIAL

TERMINATION

STYLE

TERMINATION STYLE /

MATERIAL CODE

SOLDER TERMINATION

CODE

TYPE

3-sided (wraparound)

Top only (flip chip)

3-sided (wraparound)

Top only (flip chip)

E or T (standard);

F or S (optional) ⁽¹⁾

Solderable

Nickel barrier

E or T (standard);

F or S (optional) ⁽¹⁾

Solderable

Non-magnetic

Epoxy bondable /

solderable

N (standard);

Platinum palladium gold

Gold

Top only (flip chip)

F or S (optional) ⁽²⁾

Wire bondable /

epoxy bondable

Palladium silver ⁽³⁾

Platinum gold

Epoxy bondable

Top only (flip chip)

Platinum silver

Notes

(1)

(2)

(3)

Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are

also available

Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring

solderable mounting

While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.

If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then

the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for

solderability and/or solder joint issues

SCHEMATIC

R₂

R₁

Pin 2

R₁

Pin 3

R₂

V_IN

V_OUT

Pin 1

Revision: 19-May-2021

Document Number: 68020

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice

www.vishay.com

Vishay

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical

requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements

about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product

with the properties described in the product specification is suitable for use in a particular application. Parameters provided in

datasheets and / or specifications may vary in different applications and performance may vary over time. All operating

parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.

Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited

to the warranty expressed therein.

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Revision: 09-Jul-2021

Document Number: 91000

CDHV2512AG20M0G0500HN1 [VISHAY]

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