CHP2010K6044FF131 [VISHAY]

Fixed Resistor, Metal Glaze/thick Film, 1W, 6040000ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2010,;
CHP2010K6044FF131
型号: CHP2010K6044FF131
厂家: VISHAY    VISHAY
描述:

Fixed Resistor, Metal Glaze/thick Film, 1W, 6040000ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2010,

文件: 总9页 (文件大小:151K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CHP, HCHP  
Vishay Sfernice  
High Stability Resistor Chips (< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
FEATURES  
Robust terminations  
Large ohmic value range 0.1 Ω to 100 MΩ  
Tight tolerance to 0.5 %  
CHP: Standard passivated version for  
industrial, professional and military applications  
HCHP: For high frequency applications  
ESCC approved see CHPHR  
SMD wraparound chip resistor  
Halogen-free according to IEC 61249-2-21 definition  
Compliant to RoHS directive 2002/95/0EC  
Vishay Sfernice thick film resistor chips are specially  
designed to meet very stringent specifications in terms  
of reliability, stability < 0.25 % at Pn at + 70 °C during  
1000 h, homogeneity, reproducibility and quality.  
Sputtered Thin Film terminations, with nickel barrier, are very  
convenient for high operating conditions. They can withstand  
thousands of very severe thermal shocks.  
B (W/A), N (W/A) and F (one face) types are for solder reflow  
assembly.  
They conform to specifications NFC 83-240 and  
MIL-R-55342 D.  
G (W/A) and W (one face) types are for wire bonding, gluing  
and even high temperature solder reflow.  
Evaluated to ESCC 4001/026 (see CHPHR datasheet).  
DIMENSIONS in millimeters (inches)  
A
A
D
E
D
D
D
B
C
C
E
A
B
C
D/E  
CASE  
SIZE  
VALUE  
TOL.  
VALUE  
TOL.  
VALUE  
TOL.  
VALUE  
TOL.  
1.27  
0.152  
0.60  
0.5  
0502  
0505  
0603  
0.127 (0.005)  
0.127 (0.005)  
0.38 (0.015)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
(0.050)  
(0.006)  
(0.024)  
(0.020)  
1.27  
(0.050)  
1.52  
(0.060)  
1.91  
(0.075)  
2.54  
(0.100)  
3.05  
(0.120)  
3.81  
(0.150)  
5.08  
(0.200)  
2.54  
(0.100)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
1.27  
(0.050)  
0.85  
(0.033)  
1.27  
(0.050)  
1.27  
(0.050)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.5  
(0.020)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.127 (0.005)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0705/  
0805  
1005  
1206  
1505  
2010  
1020  
2208  
2512  
1010  
1.60  
(0.063)  
1.32 (0.052)  
2.54 (0.100)  
5.08 (0.200)  
1.91 (0.075)  
3.06 (0.120)  
2.54 (0.100)  
5.58  
(0.220)  
6.35  
(0.250)  
2.54  
(0.100)  
0.152  
(0.006)  
0.152  
(0.006)  
0.152  
(0.006)  
0.5  
(0.020)  
0.5 (0.020)  
0.5 (0.020)  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
www.vishay.com  
54  
For technical questions, contact: sfer@vishay.com  
Document Number: 52023  
Revision: 25-Aug-09  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
SUGGESTED LAND PATTERN (to IPC-7351A)  
Gmin.  
Xmax.  
Zmax.  
DIMENSION in mm (inches)  
CASE SIZE  
Zmax.  
Gmin.  
Xmax.  
0502  
0505  
0603  
0705/0805  
1005  
1206  
1505  
2010  
1020  
2208  
2512  
1010  
1.82 (0.072)  
1.82 (0.072)  
2.37 (0.093)  
2.76 (0.109)  
3.39 (0.134)  
3.90 (0.154)  
4.66 (0.184)  
5.93 (0.234)  
3.39 (0.134)  
6.43 (0.253)  
7.20 (0.284)  
3.39 (0.134)  
0.10 (0.004)  
0.10 (0.004)  
0.35 (0.014)  
0.74 (0.029)  
1.37 (0.054)  
1.88 (0.074)  
2.64 (0.104)  
3.91 (0.154)  
1.37 (0.054)  
4.41 (0.174)  
5.18 (0.204)  
1.37 (0.054)  
0.73 (0.029)  
1.40 (0.055)  
0.98 (0.038)  
1.40 (0.055)  
1.40 (0.055)  
1.73 (0.068)  
1.45 (0.057)  
2.67 (0.105)  
5.21 (0.205)  
2.04 (0.080)  
3.19 (0.125)  
2.67 (0.105)  
ELECTRICAL SPECIFICATIONS  
MAX.  
RESISTANCE (1)  
MΩ  
POWER RATING  
LIMITING ELEMENT  
MAX. OVERLOAD  
UNIT WEIGHT  
mg  
CASE SIZE  
Pn  
VOLTAGE  
V
VOLTAGE  
V
mW  
0502  
0505  
0603  
0705/0805  
1005  
1206  
1505  
2010  
1020  
2208  
2512  
1010  
50  
125  
50  
100  
100  
100  
300  
300  
400  
400  
400  
400  
400  
500  
400  
25  
10  
1
3
50  
125  
50  
25  
2
200  
150  
150  
200  
200  
200  
200  
200  
250  
200  
25  
4
250  
50  
5
250  
50  
8
500  
75  
8
1000 (2)  
1000 (2)  
750  
100  
10  
26  
25  
21  
42  
12  
100  
100  
25  
2000 (2)  
500  
Notes  
(1) Shall be read in conjunction with other tables  
(2) With special assembly care  
Document Number: 52023  
Revision: 25-Aug-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
55  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
ELECTRICAL SPECIFICATIONS  
PACKAGING  
Resistance range:  
Resistance tolerance:  
Power dissipation:  
0.1R to 100M  
0.5 % to 10 %  
Pn: 50 mW to 2 W  
ESD packaging available: Waffle pack and plastic tape and  
reel (low conductivity). Paper tapes available on request  
(ESD only).  
Temperature coefficient: K: 100 ppm/°C  
NUMBER OF PIECES PER PACKAGE  
TAPE  
L: 200 ppm/°C  
SIZE  
WAFFLE  
PACK  
TAPE AND REEL  
WIDTH  
MECHANICAL SPECIFICATIONS  
MIN.  
MAX.  
Substrate:  
Alumina  
Thick film (Ruthenium oxyde)  
Epoxy coating  
0502  
0505  
0603  
0805  
1005  
1206  
1505  
2010  
1010  
2208  
1020  
2512  
Technology:  
Protection:  
Terminations:  
100  
B (W/A): SnPb over nickel  
barrier for solder reflow  
N (W/A): SnAg over nickel  
barrier for solder reflow  
F (Flip Chip): SnAg over nickel  
barrier for solder reflow  
W (one face) and G (W/A) type:  
gold over nickel barrier for other  
applications  
4000  
8 mm  
140  
60  
100  
1000  
4000  
8 mm (2)  
8 mm (2)  
8 mm (2)  
8 mm (2)  
8 mm (2)  
100  
60  
1000  
60  
45  
CLIMATIC SPECIFICATIONS  
Operating temp. range:  
Note  
(2) 12 mm on request  
- 55 °C to + 155 °C  
Note  
For temperature up to 215 °C please consult Vishay Sfernice  
PACKAGING RULES  
BEST TOL. AND TCR VERSUS OHMIC VALUE (1)  
Waffle Pack  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered exceeds maximum quantity of a  
single waffle pack, the waffle packs are stacked up on the top  
of each other and closed by one single cover.  
To get “not stacked up” waffle pack in case of ordered  
quantity > maximum number of pieces per package:  
Please consult Vishay Sfernice for specific ordering  
code  
TIGHTEST  
OHMIC  
BEST TCR  
ppm/°C  
TOLERANCE  
VALUES  
0.5 % (D)  
1 % (F)  
2 % (G)  
5 % (J)  
10 Ω < R < 5M  
5 Ω < R < 10M  
100 (K)  
100 (K)  
200 (L)  
200 (L)  
1 Ω < R < R max.  
0.1 Ω < R < R max.  
Note  
(1) Improved performance on request  
Tape and Reel  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered is between the MOQ and the  
maximum reel capacity, only one reel is provided.  
When several reels are needed for ordered quantity  
within MOQ and maximum reel capacity: Please consult  
Vishay Sfernice for specific ordering code  
CHIPS FOR HIGH FREQUENCY APPLICATIONS  
The HF performance of flip chip and W/A types can be  
improved on request.  
Please ask for HCHP  
POWER DERATING CURVE  
100  
80  
60  
40  
20  
0
0
20  
40  
60 70 80  
100  
120  
140 155  
Ambient Temperature in °C  
www.vishay.com  
56  
For technical questions, contact: sfer@vishay.com  
Document Number: 52023  
Revision: 25-Aug-09  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
TYPICAL HF PERFORMANCE OF HCHP  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1 Ω  
1 Ω  
10 Ω  
10 Ω  
100 Ω  
200 Ω  
100 Ω  
200 Ω  
1 kΩ  
1 kΩ  
10 kΩ  
1 MΩ  
100 kΩ  
10 kΩ  
1 MΩ  
100 kΩ  
1
10  
100  
1000  
10 000  
1
10  
100  
1000  
10 000  
Size 0603 (W/A)  
f (MHz)  
Size 0603 (Flip chip)  
f (MHz)  
POPULAR OPTIONS  
For any option it is recommended to consult Vishay Sfernice for availability first.  
Option: Enlarged terminations:  
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint  
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat sinks  
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,  
PRA Arrays, CHP Thick Film) www.vishay.com/doc?53048.  
Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).  
DIMENSIONS (Option 0063) in millimeters  
Bottom view for mounting  
Uncoatted  
ceramic  
A
Enlarged  
termination  
B
F
D
E
A
B
E
D
MAX. TOL.  
+ 0.152  
MIN. TOL.  
- 0.152  
MAX. TOL.  
+ 0.127  
MIN. TOL.  
- 0.127  
MAX. TOL.  
+ 0.13  
MIN. TOL.  
- 0.13  
MAX. TOL.  
+ 0.13  
MIN. TOL.  
- 0.13  
F
CASE  
SIZE  
NOMINAL  
3.06 (0.120)  
3.81 (0.150)  
2.54 (0.100)  
5.08 (0.200)  
6.35 (0.250)  
NOMINAL  
1.60 (0.063)  
1.32 (0.052)  
5.08 (0.200)  
2.54 (0.100)  
3.06 (0.120)  
NOMINAL  
NOMINAL  
1.22 (0.048)  
1.59 (0.063)  
0.96 (0.038)  
2.23 (0.088)  
2.86 (0.11)  
NOMINAL  
0.63 (0.024)  
0.63 (0.024)  
0.63 (0.024)  
0.63 (0.024)  
0.63 (0.024)  
MIN.  
MAX.  
1206  
1505  
1020  
2010  
2512  
0.40 (0.016)  
0.50 (0.020)  
0.50 (0.020)  
0.50 (0.020)  
0.50 (0.020)  
0.50 (0.020)  
0.76 (0.030)  
0.76 (0.030)  
0.76 (0.030)  
0.76 (0.030)  
0.76 (0.030)  
0.48 (0.019)  
Document Number: 52023  
Revision: 25-Aug-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
57  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
SUGGESTED LAND PATTERN (Option 0063)  
Gmin.  
Xmax.  
Zmax.  
DIMENSIONS (in millimeters)  
Gmin.  
CHIP SIZE  
Zmax.  
Xmax.  
1206  
1505  
1020  
2010  
2512  
3.91 (0.154)  
4.66 (0.183)  
3.39 (0.133)  
5.93 (0.233)  
7.20 (0.283)  
0.50 (0.020)  
1.73 (0.068)  
1.45 (0.057)  
5.21 (0.205)  
2.67 (0.105)  
3.19 (0.126)  
0.50 (0.020)  
0.50 (0.020)  
0.50 (0.020)  
0.50 (0.020)  
Option: High Temperature  
For applications such as down hole drilling, high temperature withstanding is required. Vishay Sfernice offers an option  
for utilization on extended temperature range: [- 55 °C; + 215 °C] powered (and up to 230 °C unpowered).  
For guidance in designs, please refer to application note: 53047 Power Dissipation Considerations in High Precision Vishay  
Sfernice Thin Film Chip Resistors and Arrays (P, PRA etc.) (High Temperature Application) www.vishay.com/doc?53047.  
Option to order 0131:  
Please consult Vishay Sfernice  
Parts have double and organic coating  
External coating color: Blue  
Marking: HT  
Option: Marking  
Option to order 0013:  
Marking of ohmic value and tolerance:  
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)  
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)  
Tolerance indicated by a color dot.  
Option to order 0014:  
Marking of ohmic value:  
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)  
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)  
No standard marking available for smaller sizes.  
A price adder will apply to the unit price of the parts for options 0013 and 0014.  
PERFORMANCE  
TYPICAL VALUES  
AND DRIFTS  
TESTS  
CONDITIONS  
REQUIREMENTS  
Termination adhesion  
5N for 10 s  
(0.25 % + 0.05 Ω)  
<
<
0.1 %  
0.1 %  
Immersion 10 s  
in Sn/Pb 60/40  
at + 260 °C  
Resistance to solder heat  
Rapid temperature change  
(0.25 % + 0.05 Ω)  
(0.25 % + 0.05 Ω)  
5 cycles  
<
<
0.1 %  
0.2 %  
- 55 °C  
+ 155 °C  
Phase A dry heat  
Phase B damp heat  
Climatic sequence  
(1 % + 0.05 Ω)  
Phase C cold - 55 °C  
Phase D damp heat 5 cycles  
Humidity (steady state)  
Short time overload  
56 days  
(1 % + 0.05 Ω)  
<
<
0.2 %  
0.1 %  
6.25 Pn  
for 2 s  
(0.25 % + 0.05 Ω)  
1000 h at rated power  
90’/30’ at + 70 °C  
1000 h  
(1 % + 0.05 Ω)  
1000 h  
< 0.25 %  
2000 h  
< 0.5 %  
10 000 h  
< 1 %  
Load life  
www.vishay.com  
58  
For technical questions, contact: sfer@vishay.com  
Document Number: 52023  
Revision: 25-Aug-09  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
Maximum permissible pulse load Pi max. for single pulse  
100  
10  
1
P2512  
P2010  
P1206  
P0805  
P0603  
P0402  
P
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Duration t (s)  
Energy for single pulse  
100  
10  
1
0.1  
0.01  
P2512  
P2010  
P1206  
P0805  
P0603  
P0402  
0.001  
0.0001  
0.00001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Duration t (s)  
Maximum permissible pulse voltage Ui max.  
10 000  
1000  
100  
P2512  
P2010  
P1206  
P0805  
P0603  
P0402  
10  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Duration t (s)  
Document Number: 52023  
Revision: 25-Aug-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
59  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
Maximum permissible pulse load Pi max.  
100  
P2512  
P2010  
P1206  
P0805  
P0603  
P0402  
P
10  
1
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Duration t (s)  
1.2/50 µs lightning surge  
10 000  
1000  
100  
P2512  
P1206  
P0805  
P0603  
10  
10  
100  
1000  
10 000  
100 000  
Resistor Value (Ω)  
10/70 µs lightning surge  
10 000  
1000  
100  
P1206  
P0805  
P0603  
10  
10  
100  
1000  
10 000  
100 000  
Resistor Value (Ω)  
www.vishay.com  
60  
For technical questions, contact: sfer@vishay.com  
Document Number: 52023  
Revision: 25-Aug-09  
CHP, HCHP  
High Stability Resistor Chips  
(< 0.25 % at Pn at 70 °C during 1000 h)  
Thick Film Technology  
Vishay Sfernice  
GLOBAL PART NUMBER INFORMATION  
New Global Part Numbering: CHP0805K1001FBT131 (preferred part number format)  
C
H
P
0
8
0
5
K
1
0
0
1
F
B
T
1
3
1
GLOBAL  
MODEL  
PACKAGING (1)  
SIZE  
TCR  
VALUE  
TOLERANCE TERMINATION  
OPTION  
CHP  
0502  
0505  
0603  
0805  
0705  
1005  
1206  
1505  
2010  
1020  
1010  
2208  
2512  
K = 100 ppm  
L = 200 ppm  
The first 3  
digits are  
D = 0.5 %  
F = 1 %  
G = 2 %  
J = 5 %  
B: SnPb over  
nickel barrier  
N: SnAg over  
nickel barrier  
F: SnAg over  
nickel barrier  
(one face)  
G: Gold over  
nickel barrier  
W: Gold over  
nickel barrier  
(one face)  
Blank =  
Waffle pack  
T =  
Leave blank  
if no option  
HCHP  
significant  
(3 or 4 digits)  
figures and  
the last digit  
specifies the  
number of  
zeros to follow.  
R designates  
decimal point  
Tape and reel  
PT =  
Paper tape (2)  
10R0 = 10 Ω  
3901 = 3900 Ω  
1004 = 1 MΩ  
B: Lead bearing version  
N and G: Lead (Pb)-free/  
RoHS version  
Historical Part Number example: CHP 0805 100 ppm 1K 1 % B TR R0131 (will continue to be accepted)  
CHP  
0805  
100 ppm  
1K  
1 %  
B
TR  
R0131  
e2  
HISTORICAL  
MODEL  
SIZE  
TCR  
VALUE  
In clear  
TOLERANCE TERMINATION  
TAPE  
OPTION  
RoHS  
CHP  
HCHP  
0502  
0505  
0603  
0805  
0705  
1005  
1206  
1505  
2010  
1020  
1010  
2208  
2512  
In clear  
In clear  
B: SnPb over  
nickel barrier  
N: SnAg over  
nickel barrier  
F: SnAg over  
nickel barrier  
(one face)  
Leave blank e2: Tin/silver  
if no option  
e4: Gold  
Blank: SnPb  
(3 or 4 digits)  
G: Gold over  
nickel barrier  
W: Gold over  
nickel barrier  
(one face)  
B: Lead bearing  
version  
N and G: Lead  
(Pb)-free/RoHS  
version  
Notes  
(1) For specific quantity of parts per packaging please consult Vishay Sfernice  
(2) For paper tape please consult Vishay Sfernice  
Document Number: 52023  
Revision: 25-Aug-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
61  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
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