CRCW0100100RFREL [VISHAY]
RES SMD 100 OHM 1% 1/32W 01005;
| 型号： | CRCW0100100RFREL |
| 厂家： | 
VISHAY |
| 描述： | RES SMD 100 OHM 1% 1/32W 01005 |
| 文件： | 总4页 (文件大小：81K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CRCW01005 e3
www.vishay.com
Vishay
Standard Thick Film Chip Resistors
FEATURES
• Very small standard size (0.4 mm x 0.2 mm)
• Low tolerance (1 %)
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
CASE
SIZE
CASE
SIZE
POWER RATING
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
TOLERANCE
%
TYPE
P70
SERIES
IMPERIAL METRIC
W
1
E24; E96
E24
250
10.0 to 1M
2,
2,
5
5
0.031
15
CRCW01005
01005
RR0402M
1
1.0 to 9.76
1.0 to 9.1
E24; E96
E24
-200/+600
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 0.5 A
Notes
•
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance vale drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
•
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
W
CRCW01005
0.031
(1)
Rated Dissipation P70
Operating Voltage Umax. ACRMS/DC
Insulation Voltage Uins (1 min)
Insulation Resistance
V
15
V
30
> 109
Operating Temperature Range
Mass
°C
mg
-55 to +125
0.07
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 125 °C is not exceeded.
Revision: 28-Oct-13
Document Number: 20056
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW01005 e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW01001K00FREL
C
R
C
W
0
1
0
0
1
K
0
0
F
R
E
L
TYPE
VALUE
TOLERANCE
TCR
R = 250 ppm/K
Y = -200 ppm/K/+600 ppm/K
0 = Jumper
PACKAGING
CRCW0100
R = Decimal
K = Thousand
M = Million
F = 1.0 %
G = 2.0 %
J = 5.0 %
Z = Jumper
EL
0000 = Jumper
PRODUCT DESCRIPTION: CRCW01005 250 1K0 1 % ET3 e3
CRCW01005
250
1K0
1 %
ET3
e3
RESISTANCE
VALUE
TOLERANCE
VALUE
TYPE
TCR
PACKAGING
LEAD (Pb)-FREE
CRCW01005
250 ppm/K
-200/+600 ppm/K
1R0 = 1
10R = 10
1K0 = 1 k
10K = 10 k
1M0 = 1 M
0R0 = Jumper
1 %
2 %
5 %
ET3
e3 = Pure tin
termination finish
PACKAGING
TYPE
CODE
QUANTITY
CARRIER TAPE
WIDTH
8 mm
PITCH
REEL DIAMETER
CRCW01005
EL = ET3
20 000
Paper tape acc. to IEC 60286-3, Type 1a
2 mm
180 mm/7"
DIMENSIONS in millimeters
RECOMMENDED SOLDER PAD
DIMENSIONS
SIZE
DIMENSIONS
IMPERIAL
METRIC
L
W
H
T1
T2
a
b
l
01005
RR0402M
0.4 0.02
0.2 0.02
0.13 0.02 0.10 0.03 0.10 0.03
0.15
0.2
0.2
Note
No marking for 01005 size.
•
DERATING
100
50
0
- 50
0
50
100
125
150
70
Ambient Temperature ϑamb in °C
Revision: 28-Oct-13
Document Number: 20056
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW01005 e3
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
PERMISSIBLE CHANGE (R)
IEC
60068-2
TEST
PROCEDURE
EN 60115-1
CLAUSE
STABILITY CLASS 1 OR BETTER
TEST
Stability for product types:
METHOD
CRCW01005 e3
1 to 1 M
4.5
-
-
Resistance
-
1 %; 2 %; 5 %
U = 2.5 x P70 x R 2 x Umax.
duration according to style
;
4.13
Short time overload
(2 % R + 0.1 )
Solder bath method;
Sn60Pb40
non activated flux;
Good tinning ( 95 % covered)
no visible damage
(235 5) °C
(2 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(235 3) °C
Good tinning ( 95 % covered)
no visible damage
(2 0.5) s
(20/-55/20) °C and
(20/125/20) °C
- 200 ppm/K/+600 ppm/K,
250 ppm/K
4.8.4.2
4.33
-
Temperature coefficient
Substrate bending
No visible damage,
no open circuit in bent position
(1 % R + 0.05 )
21 (Uu1)
Depth 3 mm; 1 time
15 min. at -55 °C;
15 min. at 125 °C;
300 cycles
Rapid change
of temperature
4.19
14 (Na)
-
(2 % R + 0.1 )
(5 % R + 0.1 )
U = P70 x R Umax.
1.5 h on; 0.5 h off;
70 °C; 1000 h
;
4.25.1
Endurance at 70 °C
Solder bath method
(260 5) °C; (10 1) s
Resistance to
soldering heat
4.18.2
4.24
58 (Td)
78 (Cab)
-
(2 % R + 0.1 )
(5 % R + 0.1 )
(2 % R + 0.1 )
No visible damage
(40 2) °C; (90 to 95) % RH;
1000 h
Damp heat, steady state
Endurance at upper
category temperature
4.25.3
4.29
125 °C, 1000 h
Isopropyl alcohol;
(20 to 25) °C; (5 0.5) min
Component
solvent resistance
45 (XA)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 28-Oct-13
Document Number: 20056
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 09-Jul-2021
Document Number: 91000
1
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