CRCW0201226RFKED [VISHAY]

RES SMD 226 OHM 1% 1/20W 0201;


型号：	CRCW0201226RFKED
厂家：	VISHAY
描述：	RES SMD 226 OHM 1% 1/20W 0201
文件：	总5页 (文件大小：84K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CRCW0201 e3

www.vishay.com

Vishay

Lead (Pb)-Free Commodity Thick Film Chip Resistors

FEATURES

• High volume product suitable for commercial

applications

• Pure tin solder contacts on Ni barrier layer

provides compatibility with lead (Pb)-free and

lead containing soldering processes

• Metal glaze on high quality ceramic

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

STANDARD ELECTRICAL SPECIFICATIONS

LIMITING

ELEMENT

VOLTAGE

U_max.

AC_RMS/DC

CASE

SIZE

INCH

CASE

SIZE

METRIC

POWER RATING

TEMPERATURE

COEFFICIENT

ppm/K

RESISTANCE

RANGE

TOLERANCE

MODEL

P₇₀

SERIES

200

-200 / +400

100

10.0 to 10M

1.0 to 9.76

47.0 to 1M

10.0 to 10M

1.0 to 9.76

10.0 to 10M

1.0 to 9.1

0.5

E24; E96

E24

0.05

200

CRCW0201

0201 RR 0603M

-200 / +400

200

-200 / +400

Zero-ohm-resistor: R_max.= 50 mΩ, I_max.at 70 °C = 1.0 A

Notes

•

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over

operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime

Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material

•

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

CRCW0201

0.05

Rated Dissipation at 70 °C ⁽¹⁾

Operating Voltage U_max.AC_RMS/DC

Insulation Voltage U_ins(1 min)

Insulation Resistance

> 10⁹

Operating Temperature Range

Weight

°C

-55 to +155

0.17

Note

(1)

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded

Revision: 05-Jan-2021

Document Number: 20052

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3

www.vishay.com

Vishay

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: CRCW02011K00FNED

MODEL

VALUE

TOLERANCE

TCR

PACKAGING

CRCW0201

R = decimal

K = thousand

M = million

D = 0.5 ꢀ

F = 1.0 ꢀ

J = 5.0 ꢀ

Z = jumper

K = 100 ppm/K

N = 200 ppm/K

X = -200 ppm/K / +400 ppm/K

0 = jumper

0000 = jumper

Product Description: CRCW0201 100 1K0 1 % ET7 e3

CRCW0201

100

562R

1 %

ET7

RESISTANCE

VALUE

TOLERANCE

VALUE

MODEL

TCR

PACKAGING

LEAD (Pb)-FREE

CRCW0201

200 ppm/K

100 ppm/K

- 200/+ 400 ppm/K

1R0 = 1 Ω

10R = 10 Ω

1K0 = 1 kΩ

10K = 10 kΩ

1M0 = 1 MΩ

0R0 = jumper

0.5 %

1 %

5 %

ET7

EF4

ET2

e3 = pure tin

termination finish

PACKAGING

MODEL

CODE

QUANTITY

10 000

CARRIER TAPE

WIDTH

PITCH

REEL DIAMETER

180 mm / 7"

ED = ET7

EI = ET2

EE = EF4

Paper tape according

to IEC 60068-3 type I

CRCW0201

20 000

8 mm

2 mm

254 mm / 10"

330 mm / 13"

50 000

DIMENSIONS in millimeters

SIZE

DIMENSIONS

SOLDER PAD DIMENSIONS

INCH

METRIC

0201

0603

0.6 0.05

0.3 0.03

0.23 0.03 0.15 0.05 0.10 0.05

0.28

0.43

0.23

Note

No marking for 0201 size

•

Revision: 05-Jan-2021

Document Number: 20052

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3

www.vishay.com

Vishay

DERATING

Axis Title

10000

1000

100

-60 -50 -40

-20

100

120

140 150 160

ϑ_amb- Ambient Temperature (°C)

TEST PROCEDURES AND REQUIREMENTS

REQUIREMENTS

IEC

60068-2

TEST

PROCEDURE

PERMISSIBLE CHANGE (ΔR)

EN 60115-1

CLAUSE

TEST

Stability for product types:

METHOD

CRCW0201 e3

1 Ω to 10 MΩ

4.5

4.7

Resistance

0.5 ꢀ; 1 ꢀ; 5 ꢀ

Voltage proof

U = 1.4 x U_ins; 60 s

No flashover or breakdown

Solder bath method;

Sn60Pb40

non activated flux;

Good tinning (≥ 95 ꢀ covered)

no visible damage

(235 5) °C

(2 0.2) s

4.13

58 (Td)

Solderability

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 5) °C

Good tinning (≥ 95 ꢀ covered)

no visible damage

(3 0.3) s

100 ppm/K,

200 ppm/K,

-200 ppm/K / +400 ppm/K

(20 / -55 / 20) °C and

(20 / 125 / 20) °C

4.8.4.2

4.32

Temperature coefficient

Shear (adhesion)

21 (Uu₃)

21 (Uu₁)

9 N

No visible damage

No visible damage,

no open circuit in bent position

(0.5 ꢀ R + 0.05 Ω)

4.33

Substrate bending

Depth 2 mm; 3 times

30 min. at -55 °C;

30 min. at 125 °C

Rapid change

of temperature

4.19

14 (Na)

5 cycles

1000 cycles

(0.5 ꢀ R + 0.05 Ω)

(1 ꢀ R + 0.05 Ω)

4.23

Climatic sequence:

Dry heat

4.23.2

4.23.3

4.23.4

4.23.5

4.23.6

4.23.7

2 (Ba)

30 (Db)

1 (Aa)

13 (M)

30 (Db)

125 °C; 16 h

Damp heat, cyclic

Cold

55 °C; ≥ 90 ꢀ RH; 24 h; 1 cycle

-55 °C; 2 h

(2 ꢀ R + 0.1 Ω)

Low air pressure

Damp heat, cyclic

DC load

1 kPa; (25 10) °C; 1 h

55 °C; ≥ 90 ꢀ RH; 24 h; 5 cycles

U = P₇₀x R ≤ U_max.

Revision: 05-Jan-2021

Document Number: 20052

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3

www.vishay.com

Vishay

TEST PROCEDURES AND REQUIREMENTS

REQUIREMENTS

IEC

60068-2

TEST

PROCEDURE

PERMISSIBLE CHANGE (ΔR)

EN 60115-1

CLAUSE

TEST

Stability for product types:

METHOD

CRCW0201 e3

1 Ω to 10 MΩ

U = P₇₀x R ≤ U_max.

;

1.5 h on; 0.5 h off;

4.25.1

4.18.2

Endurance at 70 °C

70 °C; 1000 h

70 °C; 8000 h

(2 ꢀ R + 0.1 Ω)

(4 ꢀ R + 0.1 Ω)

Solder bath method

(260 5) °C; (10 1) s

Resistance to

soldering heat

58 (Td)

(1 ꢀ R + 0.05 Ω)

IEC 60695-11-5;

10 s

Flammability,

needle flame test

4.35

No burning after 30 s

(2 ꢀ R + 0.1 Ω)

4.24

78 (Cab)

Damp heat, steady state

(40 2) °C; (93 3) ꢀ RH; 56 days

Endurance at upper

category temperature

4.25.3

155 °C, 1000 h

(2 ꢀ R + 0.1 Ω)

Isopropyl alcohol;

50 °C; method 2

Component

solvent resistance

4.29

4.22

45 (XA)

6 (Fc)

No visible damage

f = 10 Hz to 2000 Hz;

x, y, z ≤ 1.5 mm;

A ≤ 200 m/s²;

Vibration, endurance

by sweeping

(0.5 ꢀ R + 0.05 Ω)

10 sweeps per axis

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2-x, environmental test procedures

Packaging of components is done in paper tapes according to IEC 60286-3.

Revision: 05-Jan-2021

Document Number: 20052

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice

www.vishay.com

Vishay

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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical

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about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product

with the properties described in the product specification is suitable for use in a particular application. Parameters provided in

datasheets and / or specifications may vary in different applications and performance may vary over time. All operating

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Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited

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Revision: 09-Jul-2021

Document Number: 91000

CRCW0201226RFKED [VISHAY]

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