CRMV2510A1K00FLT1W [VISHAY]

Thick Film Chip Resistors, High Voltage;


型号：	CRMV2510A1K00FLT1W
厂家：	VISHAY
描述：	Thick Film Chip Resistors, High Voltage
文件：	总4页 (文件大小：143K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CRMV

Vishay Techno

www.vishay.com

Thick Film Chip Resistors, High Voltage

FEATURES

• Voltages up to 3000 V

• Automatic placement capability

Available

• Termination style: 3-sided wraparound

termination or single termination flip chip

available

Available

• Tape and reel packaging available

• Suitable for solderable, epoxy bondable, or wire bondable

applications

• Internationally standardized sizes, custom sizes available

• Termination material: solder-coated nickel barrier or

solder coated non-magnetic terminations standard; gold,

palladium silver, platinum gold, platinum silver or platinum

palladium gold terminations available

• Multiple styles, termination materials and configurations,

allow wide design flexibility

• Epoxy bondable or wire bondable non-magnetic

terminations available

LINKS TO ADDITIONAL RESOURCES

3D Models

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Note

This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts

with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

STANDARD ELECTRICAL SPECIFICATIONS

POWER RATING MAX. WORKING

RESISTANCE

RANGE ⁽¹⁾

TEMPERATURE

COEFFICIENT ⁽³⁾

ppmꢁ°C

CASE

SIZE

TOLERANCE

ꢀ

GLOBAL MODEL

P_{70 °C}

VOLTAGE ⁽²⁾

CRMV1206

CRMV1210

CRMV2010

CRMV2510

CRMV2512

1206

1210

2010

2510

2512

0.30

0.35

0.50

0.80

1.0

1000

1250

2000

2500

3000

150 to 15M

300 to 20M

500 to 40M

1K to 60M

1K to 75M

0.5, 1, 2, 5, 10, 20

100

Notes

•

For non-standard sizes, lower values or higher power rating requirement, contact factory

Resistance values calibrated at 10 V_DC. Calibration at other voltages available upon request

Continuous working voltage shall be P x R or Maximum Working Voltage, whichever is less

Reference only: Not for all values specified. Consult factory for your size and value

(1)

(2)

(3)

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

CRMV1206

0.30

CRMV1210

0.35

CRMV2010

CRMV2510

0.80

CRMV2512

1.0

Rated dissipation at 70 °C

Limiting element voltage

Insulation resistance

Category temperature range

Weight/1000 (typical)

0.50

V≅

1000

≥ 10¹¹

1250

≥ 10¹¹

2000

≥ 10¹¹

2500

≥ 10¹¹

3000

≥ 10¹¹

°C

-55 to +155

12.2

-55 to +155

19.6

-55 to +155

32.2

-55 to +155

39.8

-55 to +155

49.7

VOLTAGE COEFFICIENT OF RESISTANCE

MODEL

VALUE (Ω)

150 to 15M

300 to 20M

500 to 40M

1K to 60M

1K to 75M

VCR (ppmꢁV)

FURTHER INSTRUCTIONS

Consult factory

CRMV1206

CRMV1210

CRMV2010

CRMV2510

CRMV2512

Consult factory

Revision: 19-May-2021

Document Number: 68037

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRMV

Vishay Techno

www.vishay.com

GLOBAL PART NUMBER INFORMATION

Global Part Numbering: CRMV1210AF1K00FLET (preferred part number format)

GLOBAL

MODEL

TERMINAL

STYLE

TERMINAL

MATERIAL

RESISTANCE

VALUE

SOLDER

SIZE

TOLERANCE

TCR

PACKAGING

TERMINATION

CRMV

1206

1210

2010

2510

2512

= 3-sided

= top only

= nickel barrier

= non-magnetic

D = 0.5 ꢀ K = 100 ppm

= Sn100

= no solder

= Sn90 / Pb10

= bulk

(250 pcs max.)

= T / R

(full reel)

= T / R

(1000 pcs)

= T / R

(500 pcs)

= T / R

(250 pcs min.)

= waffle tray

= k

= M

110R = 110

49K9 = 49.9 k

10M0 = 10 M

F = 1 ꢀ

G = 2 ꢀ

J = 5 ꢀ

K = 10 ꢀ

M = 20 ꢀ

L = 150 ppm

= palladium

silver

= palladium

gold

= gold

= platinum silver

= platinum

palladium gold

Note

•

For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543)

DIMENSIONS in inches (millimeters)

TERMINATION STYLE A

(3-SIDED WRAPAROUND)

TERMINATION STYLE B

(TOP CONDUCTOR ONLY)

LENGTH

(L)

WIDTH

(W)

THICKNESS

(T)

MODEL

0.125 0.006

(3.18 0.15)

0.063 0.006

(1.60 0.15)

0.025 0.004

(0.64 0.10)

CRMV1206

CRMV1210

CRMV2010

CRMV2510

CRMV2512

0.125 0.006

(3.18 0.15)

0.100 0.006

(2.54 0.15)

0.025 0.004

(0.64 0.10)

0.200 0.006

(5.08 0.15)

0.100 0.006

(2.54 0.15)

0.025 0.004

(0.64 0.10)

0.250 0.006

(6.35 0.15)

0.100 0.006

(2.54 0.15)

0.025 0.004

(0.64 0.10)

0.025 (0.635)

Max.

0.025 (0.635)

Max.

0.250 0.006

(6.35 0.15)

0.126 0.006

(3.20 0.15)

0.025 0.004

(0.64 0.10)

TERMINATION

MATERIAL

TERMINATION

STYLE

TERMINATION STYLE ꢁ SOLDER TERMINATION

TYPE

MATERIAL CODE

CODE

3-sided (wraparound)

Top only (flip chip)

3-sided (wraparound)

Top only (flip chip)

Solderable

Nickel barrier

E or T

Non-magnetic

E or T

Epoxy bondable /

solderable

Platinum palladium gold

Gold

Top only (flip chip)

Wire bondable /

epoxy bondable

Palladium silver

Platinum gold

Platinum silver

Epoxy bondable

Top only (flip chip)

Revision: 19-May-2021

Document Number: 68037

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRMV

Vishay Techno

www.vishay.com

DERATING CURVE

MATERIAL SPECIFICATIONS

Axis Title

120

100

10000

1000

100

Resistive element

Encapsulation

Substrate

Ruthenium oxide

Epoxy

96 ꢀ alumina

Solder-coated nickel barrier or solder

coated non-magnetic terminations

standard. Gold, platinum silver, platinum

palladium gold terminations available.

Termination

Solder finish

Pure tin or tin / lead solder alloys standard.

-55 -25

25 50 70 100 125 155 175

Ambient Temperature (°C)

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST RESULTS (TYPICAL TEST LOTS)

MIL-STD-202, method 108

1000 h rated power at +70 °C

Life

≤

0.50 ꢀ

0.02 ꢀ

0.50 ꢀ

Short time overload

Thermal shock

MIL-PRF-55342, paragraph 4.8.6

MIL-STD-202, method 107

-55 °C to +150 °C

Low temperature operation

Resistance to bonding exposure

Moisture resistance

MIL-PRF-55342, paragraph 4.8.5

MIL-STD-202, methods 210

≤

0.02 ꢀ

0.05 ꢀ

0.06 ꢀ

MIL-PRF-55342, paragraph 4.8.9

MIL-PRF-55342, paragraph 4.8.13

2 kg for 30 s

Solder mounting integrity

Solderability

No evidence of mechanical damage

95 ꢀ coverage

MIL-STD-202, method 208

Revision: 19-May-2021

Document Number: 68037

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice

www.vishay.com

Vishay

Disclaimer

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Revision: 09-Jul-2021

Document Number: 91000

CRMV2510A1K00FLT1W [VISHAY]

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