PHP00603E1012BST1 [VISHAY]

RES SMD 10.1K OHM 0.1% 3/8W 0603;


型号：	PHP00603E1012BST1
厂家：	VISHAY
描述：	RES SMD 10.1K OHM 0.1% 3/8W 0603
文件：	总5页 (文件大小：142K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PHP

www.vishay.com

Vishay Dale Thin Film

High Power Thin Film Wraparound Chip Resistor

FEATURES

• High purity ceramic substrate

• Power rating to 2.5 W

• Resistance range 10 Ω to 30.1 kΩ

• Resistor tolerance to 0.1 ꢀ

• TCR to 25 ppm/°C

• Flame resistant UL 94 V-0

LINKS TO ADDITIONAL RESOURCES

APPLICATIONS

• Power supplies

3D Models

Infographics

• Power switching

• Braking system

PHP series chip resistors are designed with enlarged

backside terminations to reduce the thermal resistance

between the topside resistor layer and the solder joint on the

end users circuit board.

• Test and measurement equipment

• Motor deflection circuits

TYPICAL PERFORMANCE

Actual power handling capability is limited by the end user

mounting process. As with any high power chip resistor the

ability to remove the generated heat is critical to the overall

performance of the device.

ABSOLUTE

TCR

TOL.

0.1

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

CONDITIONS

Material

Nichrome

Resistance Range

10 Ω to 30.1 kΩ

25 ppm/°C, 50 ppm/°C (standard)

and, 100 ppm/°C

TCR: Absolute

-55 °C to +125 °C

Tolerance: Absolute

Power Rating: Resistor

Stability: Absolute

0.1 ꢀ, 0.5 ꢀ, 1.0 ꢀ and, 5.0 ꢀ

0.375 W to 2.5 W ⁽¹⁾

ΔR 0.1 ꢀ

+25 °C

Maximum at +70 °C

2000 h at +70 °C

Stability: Ratio

Not applicable

< 0.1 ppm/V

Voltage Coefficient

Working Voltage

75 V to 200 V

Operating Temperature Range

Storage Temperature Range

Noise

-55 °C to +155 °C

< -30 dB

Shelf Life Stability: Absolute

0.01 ꢀ

1 year at +25 °C

COMPONENT RATINGS

CASE SIZE

POWER RATING (mW)

WORKING VOLTAGE (V)

RESISTANCE RANGE (Ω)

10 to 30.1K

0603

375 ⁽¹⁾

625 ⁽¹⁾

1000 ⁽¹⁾

2500 ⁽¹⁾

0805

100

200

10 to 30.1K

1206

10 to 30.1K

2512

10 to 30.1K

Note

(1)

Dependent on component mounting by user

Revision: 08-Mar-2021

Document Number: 60076

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)

LIMITS MIL-PRF-55342

ENVIRONMENTAL TEST

TYPICAL VISHAY PERFORMANCE

CHARACTERISTIC “E”

25 ppm/°C

+70 °C

Resistance Temperature Characteristic

Maximum Ambient Temperature at Rated Wattage

Maximum Ambient Temperature at Power Derating

Thermal Shock

15 ppm/°C

+70 °C

+150 °C

0.1 ꢀ

+150 °C

0.04 ꢀ

Low Temperature Operation

Short Time Overload

0.1 ꢀ

0.001 ꢀ

0.003 ꢀ

0.030 ꢀ

0.007 ꢀ

0.002 ꢀ

0.100 ꢀ

0.1 ꢀ

High Temperature Exposure

Resistance to Soldering Heat

Moisture Resistance

0.1 ꢀ

0.2 ꢀ

Life at +70 °C for 2000 h

0.5 ꢀ

DIMENSIONS in inches

WIDTH

W ( 0.005)

THICKNESS

MIN./MAX.

TOP PAD

D ( 0.005)

BOTTOM PAD

E ( 0.005)

CASE SIZE

LENGTH

0603

0805

1206

2512

0.064 0.006

0.080 0.006

0.032

0.050

0.063

0.124

0.020 max.

0.015/0.033

0.012

0.016

0.021

0.025

0.126 0.008

0.020 + 0.005/- 0.010

0.02

0.040

0.259 + 0.009/- 0.015

0.050

LAND PATTERN DIMENSIONS in inches

0603 Land Pattern

0.0920

1206 Land Pattern

0.1730

0.0340

0.0710

0.0140

0.0390

0.0220

0.0755

0805 Land Pattern

0.1050

2512 Land Pattern

0.2910

0.0520

0.1260

0.0200

0.0425

0.1090

0.0910

Revision: 08-Mar-2021

Document Number: 60076

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

STANDARD MATERIAL SPECIFICATIONS

Resistive Element

Nichrome

Substrate Material

Alumina (Al₂O₃)

Terminations (Tin/Lead)

Tin/lead solder over nickel barrier

Terminations (Lead (Pb)-free)

Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier

PHP CHIP TEMP. VS. APPLIED POWER

5.00

4.50

4.00

5.00

4.50

4.00

0603 - 100 Ω

0603 - 5 kΩ

0603 - 18.8 kΩ

0805 - 100 Ω

0805 - 5 kΩ

0805 - 20 kΩ

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

150

200

150

200

Chip Surface Temperature (°C)

Note

•

Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C

•

Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C

PHP CHIP TEMP. VS. APPLIED POWER

5.00

4.50

4.00

10.00

9.00

8.00

1206 - 100 Ω

1206 - 5 kΩ

1206 - 10 kΩ

2512 - 10 Ω

2512 - 10 kΩ

2512 - 30 kΩ

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

7.00

6.00

5.00

4.00

3.00

2.00

1.00

0.00

150

200

150

200

Chip Surface Temperature (°C)

Notes

•

Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C

•

Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C

Thermal imaging was conducted under ambient conditions

resulting in a steady state test card surface temperature of 85 °C

over the full range of power levels

Thermal imaging and load life testing was conducted mounting

one device to 2" x 3" test cards with 2.5 mil copper plating on

both surfaces. Thermal vias on 120 mil centers were utilized for

heat transfer between surfaces of the test card

Case Size

2512

Resistance

Value

Temperature

Up to 10 Ω

Up to 10 kΩ

Up to 30 kΩ

Power (W)

1.81

2.44

6.82

9.33

1.87

5.19

7.09

150

200

4.89

6.63

Revision: 08-Mar-2021

Document Number: 60076

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

SINGLE PULSE CURVES

1000

100

100 Ω - 2512

100 Ω - 1206

100 Ω - 0805

100 Ω - 0603

0.1

0.00001 0.0001

0.001

0.01

0.1

Pulse Duration (s)

DERATING CURVE

100

125

155

Ambient Temperature °C

GLOBAL PART NUMBER INFORMATION

GLOBAL

MODEL

CASE

SIZE

SUBSTRATE

TCR

RESISTANCE

TOLERANCE

TERMINATION

PACKAGING

BS = BULK

100 min., 1 mult.

WS = WAFFLE

100 min., 1 mult.

WI = WAFFLE

PHP

0 = alumina

0603

0805

1206

2512

E =

25 ppm/°C

H =

50 ppm/°C

K =

100 ppm/°C

The first 3 digits B = 0.1 ꢀ B =wraparound

are significant

figures and the F = 1.0 ꢀ

last digit

specifies the

number of

zeros to follow.

“R” designates

the decimal

point.

D = 0.5 ꢀ

Sn/Pb solder

w/nickel barrier

G = 2.0 ꢀ

J = 5.0 ꢀ S = wraparound

lead (Pb)-free solder

SAC-305

RoHS-compliant - e1

(item single lot

day code)

100 min., 1 mult.

TAPE AND REEL

T1 = 1000 min.,

1000 mult.

T3 = 300 min., 300 mult.

T5 = 500 min., 500 mult.

TF = full reel

TS = 100 min., 1 mult.

TI = 100 min., 1 mult.

(item single lot

Example:

10R0 = 10 Ω

1000 = 100 Ω

1001 = 1 kΩ

date code)

TP = 100 min., 1 mult.

(package unit

single lot date)

Revision: 08-Mar-2021

Document Number: 60076

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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Vishay

Disclaimer

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Revision: 09-Jul-2021

Document Number: 91000

PHP00603E1012BST1 [VISHAY]

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