PSC3500CM4A1GNKTS [VISHAY]

General Fixed Inductor, 1 ELEMENT, 0.0035 uH, ALUMINA-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 0505, LEADFREE;


型号：	PSC3500CM4A1GNKTS
厂家：	VISHAY
描述：	General Fixed Inductor, 1 ELEMENT, 0.0035 uH, ALUMINA-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 0505, LEADFREE 测试射频感应器电感器
文件：	总4页 (文件大小：204K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PSC

Vishay Electro-Films

RF Spiral Inductor for Wire Bonded Assemblies

FEATURES

• Wire bond assembly

• Small size: 45 mils x 45 mils x 10 mils

• Low DCR, high Q

• Low parasitic capacitance, high SRF

APPLICATIONS

• RF choking for DC biasing

• RF tuning circuits

PSC series RF spiral inductors are designed for RF circuits

that require wire bondable components. High precision

equivalent circuit modeling enables accurate computer

simulation of component performance. Additional values

and form factors available upon request.

• Lumped element filters

STANDARD SPECIFICATIONS

PARAMETER

SPECIFICATIONS

Alumina 99.6 %

Gold

Substrate Material

Conductor Material

Conductor Thickness

Inductance Range

5 µm 10 %

1 nH to 100 nH

20 %

Tolerance ⁽¹⁾

Maximum Power Handling

Operating Temperature

Storage Temperature

Bond Pad Diameter ⁽²⁾

Notes

250 mW

- 55 °C to + 125 °C

6 mil

⁽¹⁾Main source of value tolerance is due to variation in wire bonds. See “text fixture” section below.

⁽²⁾Bond pad geometry can be modified upon request.

RF CHARACTERISTICS

INDUCTANCE VALUE

IN-CIRCUIT

DCR

IN-CIRCUIT DCR

SRF

(GHz)

(nH)

PART NUMBER

INDUCTANCE VALUE

(Ω)

(Ω) ⁽¹⁾

(nH) ⁽¹⁾

250 MHz

3.5

1000 MHz

250 MHz 1000 MHz

PSC3500C

PSC1050B

PSC1250B

PSC1800B

PSC4500B

3.5

10.5

12.5

0.26

0.9

0.36

10.2

5.5

5.0

4.2

2.4

10.5

12.5

0.9

1.25

3.4

20.5

47.5

1.35

3.5

Note

⁽¹⁾Including the added inductance and resistance of typical bond wires. See equivalent circuit section.

Document Number: 61050

Revision: 28-Sep-09

For technical questions, contact: efi@vishay.com

www.vishay.com

PSC

RF Spiral Inductor for Wire Bonded

Assemblies

Vishay Electro-Films

DIMENSIONS in inches [millimeters]

0.045

BOND PAD

DIAMETER

LENGTH

WIDTH

THICKNESS

0.006

0.045 0.002

[1.143 0.051]

0.045 0.002

[1.143 0.051]

0.010 0.001

[0.254 0.0254]

0.006

[0.152]

GLOBAL PART NUMBER INFORMATION

Global Part Number: PSC4000CL4A1GNHW1

Global Part Number Description: PSC 4 nH 25 % 45 x 45 x 10 Au None

H W1

INDUCTANCE

MULTIPLIER

CODE

INDUCTANCE

(nH)

TOLERANCE

CODE

THICKNESS

(mil)

BACK

TEST

CLASS

PACKAGING

CODE

MODEL

SIZE

= 45 x 45

SUBSTRATE

TERMINATION

= Au

METAL

PSC

The first 4

digits are

significant

figures of

inductance

= 0.001

= 0.01

= 0.1

= 20 %

= 25 %

= Alumina

= 10

= Au

= Class H

W1 =

= None

= Class K Waffle pack,

1 min, 1 mult

TS = Tape

and Reel

100 min,

1 mult

EQUIVALENT CIRCUIT

The inductor’s spiral trace presents a substantial amount of series resistance, and the close spacing of the spiral turns presents

measurable amounts of stray capacitance that interact with the inductive characteristics.

A useful tool commonly used to model the behavior of electronic components at high frequency is the equivalent circuit model.

While the equivalent circuit model accurately predicts the reactive part of the total impedance, it fails to determine the real part

of the response at high frequency. This is due to the fact that the model does not include skin and proximity effects that

significantly increase the real part of the impedance as the frequency rises.

The equivalent circuit values are presented in the table

below:

Bond Wire

Spiral Inductor

EQUIVALENT CIRCUIT MODEL 2

R_bw

L_bw

INDUCTANCE VALUE DCR SHUNTCAP.

TYP.

(1)

(nH)

(Ω)

(fF)

R_bw

(Ω)

L_bw

(nH)

3.5

10.5

12.5

0.26

0.9

0.1

2.5

0.9

L: Desired inductance

R: Parasitic self resistance

C: Parasitic shunt capacitance

1.25

3.4

_bw: Bond wire self resistance

Note

L_bw: Parasitic bond wire inductance

⁽¹⁾Typical bond wires are approximated as being 1.25 mil in

diameter gold, totaling a length of 3 mm. The resistance listed

above includes the added effect of the bond wire adhesion to the

substrate and component.

Fig. 1 - Equivalent Circuit

www.vishay.com

For technical questions, contact: efi@vishay.com

Document Number: 61050

Revision: 28-Sep-09

PSC

RF Spiral Inductor for Wire Bonded

Assemblies

Vishay Electro-Films

COMPONENT PERFORMANCE

2.1

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

12.5 nH

18 nH

45 nH

10.5 nH

3.5 nH

0.9

100

1000

10 000

Frequency (MHz)

Fig. 2 - Relative Impedance vs. Frequency

LAYOUT CONSIDERATIONS

The RF spiral inductor is electrically connected to the circuit by wire bonds. All wire bonds add parasitic inductance and

resistance, as shown in Figure 1.

It is important to note that setup variations might affect the performance of the component. Special care must be given to minimize

these effects by careful design of the component host circuit board. The following aspects should be considered:

• Bond wire length should be minimized. The bond wire added inductance can be roughly estimated at 0.75 nH per mm of

1.25 mil diameter gold wire.

• Any ground plane directly under the component will increase the parasitic shunt capacitance. This will cause self-resonance at

lower frequencies.

• The epoxy used to attach the component is the limiting factor in power handling. For applications that require high power

handling it is recommended to use high temperature epoxy and to ensure adequate heat sinking.

Document Number: 61050

Revision: 28-Sep-09

For technical questions, contact: efi@vishay.com

www.vishay.com

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www.vishay.com

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Revision: 12-Mar-12

Document Number: 91000

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