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0
MSYSTEM
1
NANYA
WFMB2512RJEA8
Power Metal Plate⢠Current Sense Resistors, Low Value (10 m to 500 m), Surface-Mount, High Power
0
VISHAY
LMS-A5-V
Plug-in Signal Conditioners M-UNIT
1
MSYSTEM
0
MSYSTEM
0
MSYSTEM
LMS-0A-G
Plug-in Signal Conditioners M-UNIT
0
MSYSTEM
10VK-1E6-R
High-density Signal Conditioners 10-RACK
0
MSYSTEM
W2DYH-24AY-R/Q
Space-saving Dual Output Signal Conditioners Mini-MW Series
0
MSYSTEM
0
MSYSTEM
IPLK70R1K4P7
CoolMOS™ P7超结 (SJ) MOSFET 系列旨在解决低功耗开关电源市场的典型挑战，具备卓越的性能和易用性，更小的外形尺寸和更高的价格竞争力。ThinPAK 5x6 封装的特点是占用空间非常小，仅为 5x6 mm²，低剖面高度仅为 1 mm。再加上其标杆的低寄生效应，正是这些特点造就了其更小的外形尺寸，同时还有助于提高功率密度。此组合使ThinPAK 封装中的 CoolMOS™P7成为了其目标应用的完美选择。700V CoolMOS™ P7 系列针对反激式拓扑结构进行了优化。
0
INFINEON
0
MSYSTEM
M2SBS-114-R
Super-mini Signal Conditioners Mini-M Series
0
MSYSTEM
MS9603-110
BRACKET,, ANGLE 90°, CRES UNS S41000, .190 X .375 BOLT
0
UMPCO
MS9603-379
BRACKET,, ANGLE 90°, CRES UNS S41000, .190 X .375 BOLT
0
UMPCO
0
MURATA
F28386DPTPQ
TMS320F2838x Real-Time Microcontrollers With Connectivity Manager
1
TI
0
WALSIN
0
KYOCERA AVX
0
MURATA
0
NANYA
M6SDY-6-R
Tension-Clamp Ultra-Slim Signal Conditioners M6S Series
0
MSYSTEM
0
MSYSTEM
0
MURATA
0
KYOCERA AVX
0
MSYSTEM
1
NANYA
R3-ND3-R/Q
Remote I/O R3 Series DeviceNet INTERFACE MODULE
0
MSYSTEM
0
TE
HVF-Z2-R/Q
Space-saving Plug-in Signal Conditioners H-UNIT
0
MSYSTEM
- 元器件品牌
KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
FOXCONN
EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH
