SC170H100S5R [VISHAY]

Rectifier Diode, Schottky, 1 Phase, 1 Element, 100V V(RRM), Silicon, WAFER;
SC170H100S5R
型号: SC170H100S5R
厂家: VISHAY    VISHAY
描述:

Rectifier Diode, Schottky, 1 Phase, 1 Element, 100V V(RRM), Silicon, WAFER

文件: 总6页 (文件大小:130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Bulletin I0506J rev. E 05/03  
SC170.....5. Series  
SCHOTTKY DIE 170 x 115 mils  
40 (157)  
Wafer flat alligned with  
side b of the die  
a
c
0.35 ± 0.01  
(14 ± 0.4)  
C
A
D
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN  
MILLIMETERS (MILS).  
Ø
Ø 125 (492)  
2. CONTROLLING DIMENSION: (MILS).  
3. LETTER DESIGNATION:  
A = Anode (Top Metal)  
C = Cathode (Back Metal)  
D = Reject Ink Dot (only on non-conforming dies)  
4. SAWING:  
NOT TO SCALE  
Recommended Blade  
SEMITEC S1025 QS00 Blade  
Sawing Street  
0.05 + 0, - 0.005  
(2 + 0, - 0.2)  
5. DIMENSIONS AND TOLERANCES  
Device  
#
T
J
Max.  
V
A
B
C
D
diameter  
R
(°C)  
(V)  
SC170R015x5x  
125  
150  
150  
150  
150  
175  
175  
175  
15  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
SC170S020x5x  
SC170S030x5x  
SC170S045x5x  
SC170S060x5x  
SC170H045x5x  
SC170H100x5x  
SC170H150x5x  
20  
30  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
45  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
60  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
45  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
100  
150  
2.92 +0, -0.01 4.32 +0, -0.01 2.77 +0, -0.01 4.17 +0, -0.01  
(115 +0, - 0.4) (170 +0, - 0.4) (109 +0, - 0.4) (164 +0, - 0.4)  
1
40  
0.15  
6
n.a. contact factory  
Document Number: 93867  
www.vishay.com  
1
SC170.....5.  
Bulletin I0506J rev. F 03/07  
Electrical Characteristics  
Device  
#
T
J
Max.  
V
Typ. I @ 25°C Typ. I @ 125°C Max. V @ I @ 25°C Package  
R
R
R
F
F
(°C)  
(V)  
15  
20  
30  
45  
60  
45  
(μA)  
(mA)  
(V)  
Style  
SC170R015x5x  
SC170S020x5x  
SC170S030x5x  
SC170S045x5x  
SC170S060x5x  
SC170H045x5x  
125  
150  
150  
150  
150  
175  
500  
70  
300 (100°C)  
0.41 @ 19A  
0.51 @ 40A  
0.48 @ 20A  
0.57 @ 20A  
0.61 @ 20A  
0.60 @ 18A  
0.80 @ 20A  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
210  
140  
100  
70  
350  
250  
140  
40  
14  
SC170H100x5x  
SC170H150x5x  
175  
175  
100  
150  
15  
8
n.a. contact factory  
Mechanical Data  
Device  
#
MetalThickness  
Front Metal  
MetalThickness  
Back Metal  
SC170xxxxA5x  
SC170xxxxS5x  
Bondable  
Solderable  
--  
Al (1% Si) 30 kÅ  
Ni 1 kÅ  
--  
Cr 1 kÅ  
Ni 2 kÅ  
Ni 2 kÅ  
Ag 3 kÅ  
Ag 3 kÅ  
Ti 2 kÅ  
Ag 35 kÅ Cr 1 kÅ  
RecommendedStorageEnvironment: Store in original container, in dessicated nitrogen, with no contamination.  
Shelf life for parts stored in above condition is 2 years.  
If the storage is done in normal atmosphere shelf life is reduced to six months.  
Packaging  
Device  
#
Description  
Minimum Order Quantity  
Die in Sale Package  
SC170xxxxx5B  
SC170xxxxx5R  
Inked Probed Unsawn Wafer (Wafer in Box)  
Probed Die in Tape & Reel  
795  
n.a.  
SC170xxxxx5P  
SC170xxxxx5F  
Probed Die in Waffle Pack  
795  
795  
Inked Probed Sawn Wafer on Film  
www.vishay.com  
2
Document Number: 93867  
SC170.....5.  
Bulletin I0506J rev. F 03/07  
Ordering Information Table  
Device Code  
SC 170  
H
020  
S
5
B
3
4
6
1
2
5
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die  
Die Size Code  
H = 830 Process  
Process (see Electrical Characteristics Table)  
Voltage code: Code = VRRM  
R = OR'ing Process  
S = Standard Process  
Chip surface metallization (see Mechanical Data Table)  
Wafer Diameter in inches  
Packaging (see Packaging Table)  
Wafer on Film  
Document Number: 93867  
www.vishay.com  
3
SC170.....5.  
Bulletin I0506J rev. F 03/07  
Wafer in Box  
ROUND CONTAINER  
TYVEK DISK  
FOAM DISK  
Die in Waffle Pack  
CHIP TRAY POCKET  
www.vishay.com  
4
Document Number: 93867  
SC170.....5.  
Bulletin I0506J rev. F 03/07  
Data and specifications subject to change without notice.  
This product has been designed for Industrial Level.  
Qualification Standards can be found on IR's Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7309  
Visit us at www.irf.com for sales contact information. 03/07  
Document Number: 93867  
www.vishay.com  
5
Legal Disclaimer Notice  
Vishay  
Notice  
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of  
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the  
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.  
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or  
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied, by  
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's  
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express  
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness  
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Vishay for any damages resulting from such improper use or sale.  
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®  
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product  
names noted herein may be trademarks of their respective owners.  
Document Number: 99901  
Revision: 12-Mar-07  
www.vishay.com  
1

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