SI1022R-T1-GE3 [VISHAY]

N-Channel 60-V (D-S) MOSFET; N通道60 -V (D -S )的MOSFET
SI1022R-T1-GE3
型号: SI1022R-T1-GE3
厂家: VISHAY    VISHAY
描述:

N-Channel 60-V (D-S) MOSFET
N通道60 -V (D -S )的MOSFET

晶体 小信号场效应晶体管 开关 光电二极管 PC
文件: 总5页 (文件大小:93K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si1022R  
Vishay Siliconix  
N-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free Option Available  
VDS(min.) (V)  
RDS(on) (Ω)  
VGS(th) (V)  
ID (mA)  
TrenchFET® Power MOSFETs  
Low On-Resistance: 1.25 Ω  
Low Threshold: 2.5 V  
1.25 at VGS = 10 V  
60  
1 to 2.5  
330  
RoHS  
COMPLIANT  
Low Input Capacitance: 30 pF  
Fast Switching Speed: 25 ns  
Low Input and Output Leakage  
Miniature Package  
SC-75A  
(SOT-416)  
ESD Protected: 2000 V  
APPLICATIONS  
G
S
1
2
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,  
Memories, Transistors, etc.  
3
D
Battery Operated Systems  
Solid State Relays  
Marking Code: E  
BENEFITS  
Low Offset Voltage  
Ordering Information: Si1022R-T1-E3 (Lead (Pb)-free)  
Si1022R-T1-GE3 (Lead (Pb)-free and Halogen-free)  
Low-Voltage Operation  
High-Speed Circuits  
Low Error Voltage  
Small Board Area  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
60  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
TA = 25 °C  
A = 85 °C  
330  
Continuous Drain Currenta  
Pulsed Drain Currenta  
Power Dissipationa  
ID  
T
240  
mA  
IDM  
PD  
650  
TA = 25 °C  
TA = 85 °C  
250  
mW  
130  
Thermal Resistance, Maximum Junction-to-Ambienta  
Operating Junction and Storage Temperature Range  
RthJA  
500  
°C/W  
°C  
TJ, Tstg  
- 55 to 150  
Notes:  
a. Surface Mounted on FR4 board, Power Applied for t 10 s.  
Document Number: 71331  
S-81543-Rev. B, 07-Jul-08  
www.vishay.com  
1
Si1022R  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VDS  
VGS = 0 V, ID = 10 µA  
Drain-Source Breakdown Voltage  
Gate-Threshold Voltage  
60  
1
V
VGS(th)  
VDS = VGS, ID = 0.25 mA  
2.5  
150  
500  
20  
VDS = 0 V, VGS  
=
10 V  
TJ = 85 °C  
5 V  
VDS = 50 V, VGS = 0 V  
TJ = 85 °C  
DS = 60 V, VGS = 0 V  
DS = 10 V, VGS = 4.5 V  
IGSS  
Gate-Body Leakage  
V
DS = 0 V, VGS =  
nA  
10  
IDSS  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
100  
1
V
µA  
V
500  
800  
ID(on)  
mA  
VDS = 7.5 V, VGS = 10 V  
VGS = 4.5 V, ID = 200 mA  
3.0  
5.0  
TJ = 125 °C  
GS = 10 V, ID = 500 mA  
TJ = 125 °C  
Drain-Source On-State Resistancea  
RDS(on)  
Ω
V
1.25  
2.25  
Forward Transconductancea  
Diode Forward Voltagea  
Dynamicb  
gfs  
VDS = 10 V, ID = 200 mA  
VGS = 0 V, IS = 200 mA  
100  
mS  
V
VSD  
1.3  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
30  
6
pF  
nC  
VDS = 25 V, VGS = 0 V, f = 1 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Charge  
2.5  
VDS = 10 V, ID = 250 mA, VGS = 4.5 V  
0.6  
Switchingb, c  
Turn-On Time  
Turn-Off Time  
t(on)  
t(off)  
VDD = 30 V, RL = 150 Ω,  
ID = 200 mA, VGEN = 10 V, RG = 10 Ω  
25  
35  
ns  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. For DESIGN AID ONLY, not subject to production testing.  
c. Switching time is essentially independent of operating temperature.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 71331  
S-81543-Rev. B, 07-Jul-08  
Si1022R  
Vishay Siliconix  
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted  
A
1200  
900  
600  
300  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
6 V  
5 V  
T = - 55 °C  
J
V
= 10 thru 7 V  
GS  
25 °C  
125 °C  
4 V  
3 V  
0
1
2
3
4
5
6
0
1
2
3
4
5
V
- Gate-to-Source Voltage (V)  
V
- Drain-to-Source Voltage (V)  
GS  
DS  
Output Characteristics  
Transfer Characteristics  
50  
40  
30  
20  
10  
0
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
= 0 V  
GS  
f = 1 MHz  
V
= 4.5 V  
GS  
C
iss  
V
= 10 V  
GS  
C
oss  
C
rss  
0
5
10  
15  
20  
25  
0
200  
400  
600  
800  
1000  
I
D
- Drain Current (mA)  
V
- Drain-to-Source Voltage (V)  
DS  
On-Resistance vs. Drain Current  
Capacitance  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
7
6
5
4
3
2
1
0
V
= 10 V at 500 mA  
V
= 10 V  
= 250 mA  
GS  
DS  
I
D
V
= 4.5 V  
GS  
at 200 mA  
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
T
J
- Junction Temperature (°C)  
Q
g
- Total Gate Charge (nC)  
On-Resistance vs. Junction Temperature  
Gate Charge  
Document Number: 71331  
S-81543-Rev. B, 07-Jul-08  
www.vishay.com  
3
Si1022R  
Vishay Siliconix  
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted  
A
1000  
5
4
3
2
1
0
V
= 0 V  
GS  
100  
T = 125 °C  
J
I
D
= 500 mA  
10  
1
T = 25 °C  
J
I
D
= 200 mA  
T = - 55 °C  
J
0
2
4
6
8
10  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V
- Gate-to-Source Voltage (V)  
GS  
V
- Source-to-Drain Voltage (V)  
SD  
On-Resistance vs. Gate-Source Voltage  
Source-Drain Diode Forward Voltage  
0.4  
0.2  
3
2.5  
I
D
= 250 µA  
2
0.0  
1.5  
- 0.2  
- 0.4  
- 0.6  
- 0.8  
1
0.5  
0
T
A
= 25 °C  
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
100  
600  
Time (s)  
T - Junction Temperature (°C)  
J
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage Variance Over Temperature  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 500 °C/W  
thJA  
(t)  
3. T - T = P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
- 1  
10  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
600  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?71331.  
www.vishay.com  
4
Document Number: 71331  
S-81543-Rev. B, 07-Jul-08  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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