SI4906DY-T1-GE3 [VISHAY]
MOSFET 2N-CH 40V 6.6A 8-SOIC;型号: | SI4906DY-T1-GE3 |
厂家: | VISHAY |
描述: | MOSFET 2N-CH 40V 6.6A 8-SOIC |
文件: | 总7页 (文件大小:122K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Si4906DY
Vishay Siliconix
Dual N-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) (Ω)
Qg (Typ.)
I
D (A)a
Definition
TrenchFET® Power MOSFET
100 % Rg and UIS Tested
Compliant to RoHS Directive 2002/95/EC
0.039 at VGS = 10 V
0.050 at VGS = 4.5 V
6.6
5.8
•
•
•
N-Channel
40
6.6
APPLICATIONS
CCFL Inverter
•
D
1
D
2
SO-8
S
1
D
1
D
1
D
2
D
2
1
8
7
6
5
G
1
2
3
4
S
2
G
G
2
1
G
2
Top View
S
1
S
2
Ordering Information: Si4906DY-T1-E3 (Lead (Pb)-free)
Si4906DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
VDS
Limit
40
Unit
Drain-Source Voltage
Gate-Source Voltage
V
VGS
16
T
T
T
C = 25 °C
C = 70 °C
A = 25 °C
6.6
5.3
Continuous Drain Current (TJ = 150 °C)
ID
5.3b, c
4.2b, c
30
TA = 70 °C
IDM
IS
A
Pulsed Drain Current (10 µs Pulse Width)
Source-Drain Current Diode Current
Pulsed Sorce-Drain Current
T
C = 25 °C
A = 25 °C
2.5
1.7b, c
T
ISM
IAS
30
13
Single Pulse Avalanche Current
Single-Pulse Avalanche Energy
L = 0.1 mH
EAS
8.5
mJ
W
3.1
TC = 25 °C
TC = 70 °C
TA = 25 °C
2
2b, c
PD
Maximum Power Dissipation
1.28b, c
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Limit
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
Symbol
RthJA
RthJF
Typical
52
Maximum
62.5
Unit
t ≤ 10 s
Steady State
°C/W
32
40
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 110 °C/W.
Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
www.vishay.com
1
Si4906DY
Vishay Siliconix
SPECIFICATIONS T = 25 °C, unless otherwise noted
J
Parameter
Symbol
Test Conditions
Min.
Typ.a
Max.
Unit
Static
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
VGS = 0 V, ID = 250 µA
ID = 250 µA
Drain-Source Breakdown Voltage
40
V
V
DS Temperature Coefficient
40
mV/°C
VGS(th) Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
- 4.6
VDS = VGS, ID = 250 µA
0.8
20
2.2
100
1
V
IGSS
VDS = 0 V, VGS
=
16 V
nA
VDS = 40 V, VGS = 0 V
IDSS
ID(on)
RDS(on)
gfs
Zero Gate Voltage Drain Current
On-State Drain Currentb
µA
A
V
DS = 40 V, VGS = 0 V, TJ = 55 °C
10
VDS = 5 V, VGS = 10 V
VGS = 10 V, ID = 5 A
VGS = 4.5 V, ID = 4 A
VDS = 15 V, ID = 5 A
0.032
0.041
15
0.039
0.050
Drain-Source On-State Resistanceb
Ω
S
Forward Transconductanceb
Dynamica
Ciss
Coss
Crss
Input Capacitance
625
88
50
14.4
6.6
1.6
2.3
2.3
9
VDS = 20 V, VGS = 0 V, f = 1 MHz
DS = 20 V, VGS = 10 V, ID = 5 A
Output Capacitance
Reverse Transfer Capacitance
pF
V
22
10
Qg
Total Gate Charge
nC
Qgs
Qgd
Rg
V
DS = 20 V, VGS = 4.5 V, ID = 5 A
f = 1 MHz
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
3.5
15
77
32
10
20
128
26
11
Ω
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
Turn-On Delay Time
Rise Time
V
DD = 20 V, RL = 4 Ω
51
21
6
ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω
Turn-Off Delay Time
Fall Time
ns
Turn-On Delay Time
Rise Time
13
85
17
7
V
DD = 20 V, RL = 4 Ω
ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Currenta
IS
ISM
VSD
trr
TC = 25 °C
IS = 1.7 A
2.5
30
A
Body Diode Voltage
0.79
30
1.2
45
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
ns
nC
Qrr
ta
30
45
IF = 1.7 A, dI/dt = 100 A/µs, TJ = 25 °C
17
ns
tb
13
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
Si4906DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
24
18
12
6
2.0
1.6
1.2
0.8
0.4
0.0
V
= 10 V thru 4 V
GS
3 V
T
C
= 125 °C
25 °C
- 55 °C
0
0.0
0.5
1.0
1.5
2.0
2.5
0.0
0.8
1.6
2.4
3.2
4.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.060
0.052
0.044
0.036
0.028
0.020
900
720
540
360
180
0
C
iss
V
= 4.5 V
GS
V
= 10 V
GS
C
oss
C
rss
0
4
8
12
16
20
0
6
12
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
8
1.8
1.5
1.2
0.9
0.6
I
D
= 5 A
I
D
= 5 A
V
GS
= 10 V
V
DS
= 10 V
V
= 30 V
DS
6
V
GS
= 4.5 V
V
DS
= 20 V
4
2
0
0
3
6
9
12
15
- 50 - 25
0
T
25
50
75
100 125 150
Q
g
- Total Gate Charge (nC)
- Junction Temperature (°C)
J
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
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3
Si4906DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.30
0.24
0.18
0.12
0.06
0.00
100
10
T
= 150 °C
J
25 °C
1
125 °C
25 °C
0.1
0
2
4
6
8
10
0.0
0.2
0.6
0.8
1.0
1.2
0.4
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
V
SD
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
100
80
I
= 250 µA
D
0.2
0.0
60
I
D
= 5 mA
- 0.2
- 0.4
- 0.6
40
20
0
- 50 - 25
0
25
50
75
100 125 150
10
0.01
0.1
1
0.001
T
J
- Temperature (°C)
Time (s)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
Limited by R
DS(on)*
10
1 ms
1
10 ms
100 ms
0.1
1 s
10 s
DC
T
A
= 25 °C
Single Pulse
0.01
0.1
1
100
10
V
DS
- Drain-to-Source Voltage (V)
* V
minimum V at which R
is specified
DS(on)
GS
GS
Safe Operating Area, Junction-to-Ambient
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Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
Si4906DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
8
6
5
3
2
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
4.0
3.2
2.4
1.6
0.8
0.0
1.5
1.2
0.9
0.6
0.3
0.0
0
25
50
75
100
125
150
0
25
50
T - Ambient Temperature (°C)
A
75
100
125
150
T
C
- Case Temperature (°C)
Power Derating, Junction-to-Foot
Power Derating, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
www.vishay.com
5
Si4906DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
P
DM
0.05
t
1
t
2
t
t
1
0.02
1. Duty Cycle, D =
2
2. Per Unit Base = R
= 120 °C/W
thJA
(t)
3. T - T = P
Z
A
JM
DM thJA
Single Pulse
4. Surface Mounted
0.01
-4
-3
-2
-1
10
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
10
100
1000
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
-4
-3
-2
-1
10
1
10
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73867.
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Document Number: 73867
S09-2432-Rev. C, 16-Nov-09
Legal Disclaimer Notice
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Vishay
Disclaimer
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
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