SI5511DC-T1-E3 [VISHAY]

N- and P-Channel 30-V (D-S) MOSFET; N和P通道30 - V(D -S)的MOSFET
SI5511DC-T1-E3
型号: SI5511DC-T1-E3
厂家: VISHAY    VISHAY
描述:

N- and P-Channel 30-V (D-S) MOSFET
N和P通道30 - V(D -S)的MOSFET

文件: 总12页 (文件大小:165K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si5511DC  
Vishay Siliconix  
N- and P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFETs  
VDS (V)  
rDS(on) (Ω)  
Qg (Typ)  
I
D (A)  
4a,g  
4a,g  
- 3.6a  
- 2.7a  
0.055 at VGS = 4.5 V  
0.090 at VGS = 2.5 V  
0.150 at VGS = - 4.5 V  
0.256 at VGS = - 2.5 V  
APPLICATIONS  
RoHS  
N-Channel  
P-Channel  
30  
4.2 nC  
COMPLIANT  
Buck-Boost  
- DSC  
- 30  
2.85 nC  
- Portable Devices  
1206-8 Chip-FET®  
D
1
S
2
1
S
1
D
1
G
1
G
2
Marking Code  
EE XXX  
D
1
S
2
G
1
D
2
G
2
Lot Traceability  
and Date Code  
D
2
Part # Code  
S
1
D
2
Bottom View  
Ordering Information: Si5511DC-T1-E3 (Lead (Pb)-free)  
N-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
N-Channel  
P-Channel  
Unit  
VDS  
VGS  
30  
- 30  
Drain-Source Voltage  
Gate-Source Voltage  
V
12  
4a, g  
4a, g  
4a, g  
3.9a  
15  
- 3.6a  
- 2.8a  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
ID  
Continuous Drain Current (TJ = 150 °C)  
- 2.3b, c  
- 1.8b, c  
- 10  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
2.6  
1.7b, c  
3.1  
- 2.6  
- 1.7b, c  
2.6  
Source Drain Current Diode Current  
2.0  
1.7  
PD  
Maximum Power Dissipation  
W
2.1b, c  
1.33b, c  
1.3b, c  
0.84b, c  
TJ, Tstg  
- 55 to 150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
N-Channel  
Typ Max  
P-Channel  
Typ Max  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Foot (Drain)  
Symbol  
RthJA  
Unit  
t 5 s  
50  
30  
60  
40  
77  
33  
95  
40  
°C/W  
RthJF  
Steady State  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 Board.  
c. t = 5 s  
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequade  
bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 110 °C/W for N-Channel and 130 °C/W for P-Channel.  
g. Package limited.  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
1
Si5511DC  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typa  
Max  
Unit  
Static  
VGS = 0 V, ID = 250 µA  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
30  
VDS  
Drain-Source Breakdown Voltage  
V
VGS = 0 V, ID = - 250 µA  
- 30  
ID = 250 µA  
24.2  
- 23.1  
3.6  
V
DS Temperature Coefficient  
ΔVDS/TJ  
ΔVGS(th)/TJ  
I
I
D = - 250 µA  
ID = 250 µA  
D = - 250 µA  
mV/°C  
VGS(th) Temperature Coefficient  
2.3  
VDS = VGS, ID = 250 µA  
DS = VGS, ID = - 250 µA  
0.7  
2
VGS(th)  
Gate Threshold Voltage  
Gate-Body Leakage  
V
V
P-Ch  
N-Ch  
P-Ch  
N-Ch  
- 0.7  
- 2  
100  
- 100  
1
IGSS  
VDS = 0 V, VGS  
=
12 V  
nA  
VDS = 30 V, VGS = 0 V  
V
DS = - 30 V, VGS = 0 V  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
- 1  
10  
IDSS  
ID(on)  
rDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currentb  
µA  
A
V
DS = 30 V, VGS = 0 V, TJ = 55 °C  
V
DS = - 30 V, VGS = 0 V, TJ = 55 °C  
VDS 5 V, VGS = 4.5 V  
- 10  
15  
VDS - 5 V, VGS = - 4.5 V  
VGS = 4.5 V, ID = 4.8 A  
- 10  
0.045 0.055  
0.125 0.150  
0.075 0.090  
0.213 0.256  
10.8  
V
GS = - 4.5 V, ID = - 2.3 A  
GS = 2.5 V, ID = 3.8 A  
GS = - 2.5 V, ID = 1.8 A  
VDS = 15 V, ID = 4.8 A  
Drain-Source On-State Resistanceb  
Ω
S
V
V
Forward Transconductanceb  
V
DS = - 15 V, ID = - 2.3 A  
6.56  
Dynamica  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
435  
260  
65  
Ciss  
Coss  
Crss  
Input Capacitance  
N-Channel  
DS = 15 V, VGS = 0 V, f = 1 MHz  
V
Output Capacitance  
pF  
55  
P-Channel  
DS = - 15 V, VGS = 0 V, f = 1 MHz  
30  
V
Reverse Transfer Capacitance  
42  
VDS = 15 V, VGS = 5 V, ID = 4.8 A  
4.7  
7.1  
VDS = - 15 V, VGS = - 5 V, ID = - 3.2 A  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
4.1  
4.2  
3.8  
1.1  
0.6  
0.9  
1.85  
2.7  
7.7  
6.2  
6.3  
4.6  
Qg  
Total Gate Charge  
N-Channel  
nC  
V
DS = 15 V, VGS = 4.5 V, ID = 4.8 A  
Qgs  
Qgd  
Rg  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
P-Channel  
V
DS = - 15 V, VGS = - 4.5 V, ID = - 3.2 A  
f = 1 MHz  
Ω
www.vishay.com  
2
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
Si5511DC  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Dynamica  
Symbol  
Test Conditions  
Min  
Typa  
Max  
Unit  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
9
12  
23  
68  
117  
72  
50  
42  
98  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
N-Channel  
DD = 15 V, RL = 3.95 Ω  
ID 3.8 A, VGEN = 4.5 V, Rg = 1 Ω  
15  
45  
78  
48  
33  
28  
65  
V
ns  
P-Channel  
DD = - 15 V, RL = 18.1 Ω  
ID - 1.86 A, VGEN = - 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
V
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
2.6  
- 2.6  
15  
IS  
TC = 25 °C  
A
V
Pulse Diode Forward Currenta  
Body Diode Voltage  
ISM  
- 10  
1.2  
IS = 2.4 A, VGS = 0 V  
0.8  
VSD  
I
S = - 1.5 A, VGS = 0 V  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
- 0.8  
11.6  
19.8  
6.1  
- 1.2  
18  
trr  
Qrr  
ta  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
30  
N-Channel  
IF = 2.4 A, di/dt = 100 A/µs, TJ = 25 °C  
9.2  
27  
nC  
17.5  
8.4  
P-Channel  
IF = - 1.5 A, di/dt = - 100 A/µs, TJ = 25 °C  
17.2  
3.2  
ns  
tb  
Reverse Recovery Rise Time  
2.6  
Notes:  
a. Guaranteed by design, not subject to production testing.  
b. Pulse test; pulse width 300 µs, duty cycle 2 %.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
3
Si5511DC  
Vishay Siliconix  
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
15  
12  
9
5
4
3
2
1
0
V
GS  
= 5 V thru 3 V  
V
= 2.5 V  
GS  
6
T
= 125 °C  
C
V
V
= 2 V  
GS  
3
T
= 25 °C  
1.0  
C
= 1.5 V  
GS  
T
= - 55 °C  
C
0
0.0  
0.6  
1.2  
1.8  
2.4  
3.0  
0.0  
0.5  
1.5  
2.0  
2.5  
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
600  
500  
400  
300  
200  
100  
0
C
iss  
V
GS  
= 2.5 V  
V
GS  
= 4.5 V  
C
oss  
C
rss  
0
3
6
9
12  
15  
0
5
10  
15  
20  
25  
30  
I
D
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
5
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
V
D
= 4.5 V  
GS  
= 4.8 A  
I
D
= 4.8 A  
I
4
3
2
1
0
V
DS  
= 15 V  
V
D
= 2.5 V  
GS  
= 3.7 A  
I
V
GS  
= 24 V  
0
1
2
3
4
5
6
- 50 - 25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
www.vishay.com  
4
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
Si5511DC  
Vishay Siliconix  
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
20  
10  
I
= 4.8 A  
D
T
A
= 150 °C  
1
0.1  
T
A
= 25 °C  
T
A
= 125 °C  
T
A
= 25 °C  
0.01  
0.001  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1
2
3
4
5
V
SD  
- Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
50  
40  
30  
I
D
= 250 µA  
20  
10  
0
-4  
-3  
-2  
-1  
- 50 - 25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
10  
Time (s)  
Single Pulse Power  
1
10  
100 600  
T
- Temperature (°C)  
J
Threshold Voltage  
100  
10  
Limited by r  
*
DS(on)  
1 ms  
10 ms  
1
100 ms  
1 s  
10 s  
0.1  
DC  
BVDSS Limited  
0.01  
T
A
= 25 °C  
Single Pulse  
0.001  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
* V  
GS  
minimum V at which r  
is specified  
GS  
DS(on)  
Safe Operating Area, Junction-to-Ambient  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
5
Si5511DC  
Vishay Siliconix  
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
4
3
2
1
0
8
6
4
2
0
Package Limited  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
- Case Temperature (°C)  
T
- Case Temperature (°C)  
C
C
Power Derating  
Current Derating*  
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
www.vishay.com  
6
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
Si5511DC  
Vishay Siliconix  
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
t
1
t
0.02  
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 90 °C/W  
thJA  
(t)  
3. T - T = P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
600  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
7
Si5511DC  
Vishay Siliconix  
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
10  
8
5
4
3
2
1
0
V
GS  
= 5 V thru 3.5 V  
V
GS  
= 3 V  
6
V
GS  
= 2.5 V  
4
V
GS  
= 2 V  
T
A
= 125 °C  
2
T
A
= 25 °C  
V
GS  
= 1.5 V  
T
A
= - 55 °C  
0
0.0  
0.6  
1.2  
1.8  
2.4  
3.0  
0.0  
0.6  
1.2  
1.8  
2.4  
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
500  
400  
300  
200  
100  
0
C
iss  
V
GS  
= 2.5 V  
V
GS  
= 4.5 V  
C
oss  
C
rss  
0
2
4
6
8
10  
0
5
10  
15  
20  
25  
30  
I
D
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
5
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I
D
= 2.3 A  
V
D
= 4.5 V,  
GS  
= 2.3 A  
4
3
2
1
0
I
V
GS  
= 15 V  
V
GS  
= 24 V  
V
D
= 2.5 V,  
GS  
= 1.8 A  
I
0
1
2
3
4
5
- 50 - 25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
www.vishay.com  
8
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
Si5511DC  
Vishay Siliconix  
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.40  
0.32  
0.24  
0.16  
0.08  
0.00  
20  
10  
I
D
= 2.3 A  
T
= 150 °C  
J
T
A
= 125 °C  
1
0.1  
T
= 25 °C  
J
T
A
= 25 °C  
0.01  
0.001  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1
2
3
4
5
V
SD  
- Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
50  
40  
I
= 250 µA  
D
30  
20  
10  
0
10  
2
3
-4  
-3  
-2  
-1  
- 50 - 25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
Time (s)  
Single Pulse Power  
10  
1
10  
10  
T
- Temperature (°C)  
J
Threshold Voltage  
100  
Limited by r  
*
DS(on)  
10  
1
10 ms  
100 ms  
1 s  
10 s  
0.1  
DC  
T
= 25 °C  
A
0.01  
Single Pulse  
0.001  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
* V  
GS  
minimum V at which r  
is specified  
GS  
DS(on)  
Safe Operating Area, Junction-to-Case  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
9
Si5511DC  
Vishay Siliconix  
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1.6  
1.2  
0.8  
0.4  
0.0  
4
3
2
1
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
- Case Temperature (°C)  
T
- Case Temperature (°C)  
C
C
Power Derating  
Current Derating*  
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
www.vishay.com  
10  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
Si5511DC  
Vishay Siliconix  
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
t
0.05  
1
t
2
t
t
1
2
1. Duty Cycle, D =  
0.02  
2. Per Unit Base = R  
= 110 °C/W  
thJA  
(t)  
3. T - T = P  
JM  
Z
A
DM thJA  
4. Surface Mounted  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
600  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?73787.  
Document Number: 73787  
S-72204-Rev. B, 22-Oct-07  
www.vishay.com  
11  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

相关型号:

SI5511DC-T1-GE3

Small Signal Field-Effect Transistor, 3.9A I(D), 30V, 2-Element, N-Channel and P-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, 1206-8, CHIPFET-8
VISHAY

SI5513CDC

N- and P-Channel 20-V (D-S) MOSFET
VISHAY

SI5513CDC-T1-E3

N- and P-Channel 20-V (D-S) MOSFET
VISHAY

SI5513CDC-T1-GE3

N- and P-Channel 20 V (D-S) MOSFET
VISHAY

SI5513CDC_10

N- and P-Channel 20 V (D-S) MOSFET
VISHAY

SI5513DC

Complementary 20-V (D-S) MOSFET
VISHAY

SI5513DC-T1

Complementary 20-V (D-S) MOSFET
VISHAY

SI5513DC-T1-E3

Complementary 20-V (D-S) MOSFET
VISHAY

SI5513DC-T1-GE3

TRANSISTOR 3100 mA, 20 V, 2 CHANNEL, N AND P-CHANNEL, Si, SMALL SIGNAL, MOSFET, HALOGEN FREE AND ROHS COMPLIANT, 1206-8, CHIPFET-8, FET General Purpose Small Signal
VISHAY

SI5515CDC

N- and P-Channel 20-V (D-S) MOSFET
VISHAY

SI5515CDC-T1-E3

N- and P-Channel 20-V (D-S) MOSFET
VISHAY

SI5515CDC-T1-GE3

N- and P-Channel 20 V (D-S) MOSFET
VISHAY