SI5915DC-T1-GE3 [VISHAY]

Small Signal Field-Effect Transistor,;
SI5915DC-T1-GE3
型号: SI5915DC-T1-GE3
厂家: VISHAY    VISHAY
描述:

Small Signal Field-Effect Transistor,

开关 光电二极管 晶体管
文件: 总5页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si5915DC  
Vishay Siliconix  
Dual P-Channel 1.8 V (G-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 4.6  
- 3.7  
- 3.0  
Definition  
0.070 at VGS = - 4.5 V  
0.108 at VGS = - 2.5 V  
0.162 at VGS = - 1.8 V  
TrenchFET® Power MOSFET  
Low Thermal Resistance  
40 % Smaller Footprint than TSOP-6  
Compliant to RoHS Directive 2002/95/EC  
- 8  
APPLICATIONS  
Load Switch or PA Switch for Portable Devices  
1206-8 ChipFET®  
S
1
S
2
1
S
1
D
1
G
1
Marking Code  
D
1
S
2
DE XX  
G
G
2
1
Lot Traceability  
and Date Code  
D
2
G
2
D
2
Part # Code  
Bottom View  
Ordering Information: Si5915DC-T1-E3 (Lead (Pb)-free)  
D
D
2
1
P-Channel MOSFET  
P-Channel MOSFET  
Si5915DC-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
5 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 8  
8
V
VGS  
TA = 25 °C  
TA = 85 °C  
- 4.6  
- 3.3  
- 3.4  
- 2.5  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
IDM  
IS  
- 10  
- 1.8  
2.1  
- 0.9  
1.1  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 85 °C  
1.1  
0.6  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typical  
50  
Maximum  
Unit  
t 5 s  
60  
110  
40  
Maximum Junction-to-Ambienta  
Steady State  
Steady State  
90  
°C/W  
Maximum Junction-to-Foot (Drain)  
RthJF  
30  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure ade-  
quate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 70693  
S10-0936-Rev. C, 19-Apr-10  
www.vishay.com  
1
Si5915DC  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
Gate Threshold Voltage  
Gate-Body Leakage  
VGS(th)  
IGSS  
VDS = VGS, ID = - 250 µA  
- 0.45  
V
VDS = 0 V, VGS  
=
8 V  
100  
- 1  
nA  
VDS = - 6.4 V, VGS = 0 V  
DS = - 6.4 V, VGS = 0 V, TJ = 85 °C  
VDS - 5 V, VGS = - 4.5 V  
VGS = - 4.5 V, ID = - 3.4 A  
VGS = - 2.5 V, ID = - 2.7 A  
VGS = - 1.8 V, ID = - 1 A  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
IDSS  
µA  
A
V
- 5  
ID(on)  
- 10  
0.058  
0.090  
0.131  
8
0.070  
0.108  
0.162  
Drain-Source On-State Resistancea  
RDS(on)  
Ω
Forward Transconductancea  
Diode Forward Voltagea  
Dynamicb  
gfs  
VDS = - 5 V, ID = - 3.4 A  
S
V
VSD  
IS = - 0.9 A, VGS = 0 V  
- 0.8  
- 1.2  
9
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
Qgd  
td(on)  
tr  
5.9  
1.3  
1.4  
20  
70  
35  
35  
30  
VDS = - 4 V, VGS = - 4.5 V, ID = - 3.4 A  
nC  
ns  
30  
110  
55  
V
DD = - 4 V, RL = 4 Ω  
ID - 1 A, VGEN = - 4.5 V, Rg = 6 Ω  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
55  
Source-Drain Reverse Recovery Time  
trr  
IF = - 0.9 A, dI/dt = 100 A/µs  
60  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
10  
10  
8
T
= - 55 °C  
C
V
GS  
= 5 V thru 2.5 V  
25 °C  
8
2 V  
125 °C  
6
6
4
4
1.5 V  
2
2
0
0
0
1
2
3
4
5
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
www.vishay.com  
2
Document Number: 70693  
S10-0936-Rev. C, 19-Apr-10  
Si5915DC  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1000  
800  
600  
400  
200  
0
0.25  
V
GS  
= 1.8 V  
0.20  
0.15  
0.10  
0.05  
0.00  
C
iss  
V
GS  
= 2.5 V  
C
oss  
C
V
GS  
= 4.5 V  
rss  
0
2
4
6
8
0
2
4
6
8
10  
V
DS  
- Drain-to-Source Voltage (V)  
I
D
- Drain Current (A)  
On-Resistance vs. Drain Current  
Capacitance  
5
4
3
2
1
0
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
V
= 4 V  
= 3.4 A  
V
= 4.5 V  
DS  
GS  
I
D
I = 3.4 A  
D
0
1
2
3
4
5
6
7
- 50 - 25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
10  
I
D
= 1 A  
T
= 150 °C  
J
I
= 3.4 A  
D
T
= 25 °C  
1.0  
J
1
0
0.2  
V
0.4  
0.6  
0.8  
1.2  
1.4  
0
1
2
3
4
5
V
GS  
- Gate-to-Source Voltage (V)  
- Source-to-Drain Voltage (V)  
SD  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
Document Number: 70693  
S10-0936-Rev. C, 19-Apr-10  
www.vishay.com  
3
Si5915DC  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.3  
50  
40  
30  
0.2  
I
D
= 250 µA  
0.1  
0.0  
20  
10  
0
- 0.1  
- 0.2  
-4  
-3  
-2  
-1  
- 50 - 25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
10  
1
10  
100 600  
T
- Temperature (°C)  
Time (s)  
J
Threshold Voltage  
Single Pulse Power  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 90 °C/W  
thJA  
(t)  
3. T -- T = P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?70693.  
www.vishay.com  
4
Document Number: 70693  
S10-0936-Rev. C, 19-Apr-10  
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding  
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1

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