Si7810DN
Vishay Siliconix
SPECIFICATIONS T = 25°C, unless otherwise noted
J
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
VGS(th)
IGSS
VDS = VGS, ID = 250 µA
2
4.5
100
1
V
VDS = 0 V, VGS
= 20 V
nA
VDS = 100 V, VGS = 0 V
DS = 100 V, VGS = 0 V, TJ = 55°C
VDS ≥ 5 V, VGS = 10 V
IDSS
ID(on)
Zero Gate Voltage Drain Current
On-State Drain Currenta
µA
A
V
5
20
VGS = 10 V, ID = 5.4 A
0.052
0.070
12
0.062
0.084
Drain-Source On-State Resistancea
rDS(on)
Ω
V
GS = 6 V, ID = 4.6 A
Forward Transconductancea
Diode Forward Voltagea
Dynamicb
gfs
VDS = 15 V, ID = 5.4 A
IS = 3.2 A, VGS = 0 V
S
V
VSD
0.78
1.2
17
Total Gate Charge
Qg
Qgs
Qgd
td(on)
tr
13.5
3
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
V
DS = 50 V, VGS = 10 V, ID = 5.4 A
nC
ns
4.6
10
15
20
15
45
15
25
30
25
90
VDD = 50 V, RL = 50 Ω
ID ≅ 1 A, VGEN = 10 V, RG = 6 Ω
Turn-Off DelayTime
Fall Time
td(off)
tf
Source-Drain Reverse Recovery Time
trr
IF = 3.2 A, di/dt = 100 A/µs
Notes
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS T = 25°C, unless otherwise noted
A
20
16
12
8
20
16
12
8
6 V
V
GS
= 10 thru 7 V
T
= 125˚C
C
5 V
4 V
4
4
25˚C
3
–55˚C
6
0
0
0
1
2
3
4
5
0
1
2
4
5
7
V
DS
– Drain-to-Source Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
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2
Document Number: 70689
S-51210–Rev. B, 27-Jun-05