SIHB25N50E-GE3 [VISHAY]

Power Field-Effect Transistor, 26A I(D), 500V, 0.145ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, TO-263, D2PAK-3/2;
SIHB25N50E-GE3
型号: SIHB25N50E-GE3
厂家: VISHAY    VISHAY
描述:

Power Field-Effect Transistor, 26A I(D), 500V, 0.145ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, TO-263, D2PAK-3/2

开关 脉冲 晶体管
文件: 总8页 (文件大小:166K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
E Series Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Low figure-of-merit (FOM): Ron x Qg  
• Low input capacitance (Ciss  
VDS (V) at TJ max.  
DS(on) max. at 25 °C (Ω)  
Qg (Max.) (nC)  
550  
)
R
VGS = 10 V  
0.145  
• Reduced switching and conduction losses  
• Low gate charge (Qg)  
86  
14  
Q
gs (nC)  
gd (nC)  
Q
25  
• Avalanche energy rated (UIS)  
Configuration  
Single  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
D2PAK (TO-263)  
APPLICATONS  
• Hard switched topologies  
• Power factor correction power supplies (PFC)  
• Switch mode power supplies (SMPS)  
• Computing  
G
D
G
- PC silver box / ATX power supplies  
• Lighting  
S
S
N-Channel MOSFET  
- Two stage LED lighting  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
Lead (Pb)-free and Halogen-free  
SiHB25N50E-GE3  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
500  
V
VGS  
30  
T
C = 25 °C  
26  
16  
Continuous Drain Current (TJ = 150 °C)  
VGS at 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Current a  
IDM  
50  
Linear Derating Factor  
Single Pulse Avalanche Energy b  
0.2  
W/°C  
mJ  
W
EAS  
PD  
273  
Maximum Power Dissipation  
250  
Operating Junction and Storage Temperature Range  
Drain-Source Voltage Slope  
Reverse Diode dV/dt d  
TJ, Tstg  
-55 to +150  
65  
°C  
V
DS = 0 V to 80 % VDS  
dV/dt  
V/ns  
°C  
25  
Soldering Recommendations (Peak Temperature) c  
for 10 s  
300  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature.  
b. VDD = 50 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, IAS = 4.4 A.  
c. 1.6 mm from case.  
d. ISD ID, dI/dt = 100 A/μs, starting TJ = 25 °C.  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
TYP.  
MAX.  
62  
UNIT  
°C/W  
Maximum Junction-to-Ambient  
Maximum Junction-to-Case (Drain)  
-
-
RthJC  
0.5  
S15-0493-Rev. A, 16-Mar-15  
Document Number: 91646  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
VDS  
VGS = 0 V, ID = 250 μA  
Reference to 25 °C, ID = 1 mA  
VDS = VGS, ID = 250 μA  
500  
-
-
-
V
V/°C  
V
VDS Temperature Coefficient  
ΔVDS/TJ  
VGS(th)  
-
2.0  
-
0.59  
Gate-Source Threshold Voltage (N)  
-
4.0  
100  
1
VGS  
VGS  
=
=
20 V  
30 V  
-
nA  
μA  
Gate-Source Leakage  
IGSS  
IDSS  
-
-
-
VDS = 500 V, VGS = 0 V  
-
1
Zero Gate Voltage Drain Current  
μA  
VDS = 400 V, VGS = 0 V, TJ = 125 °C  
-
-
25  
0.145  
-
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic  
RDS(on)  
gfs  
VGS = 10 V  
ID = 12 A  
-
0.125  
6.6  
Ω
VDS = 30 V, ID = 12 A  
-
S
Input Capacitance  
Ciss  
Coss  
Crss  
-
-
-
1980  
105  
8
-
-
-
VGS = 0 V,  
VDS = 100 V,  
f = 1 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
pF  
Effective Output Capacitance, Energy  
Related a  
Co(er)  
Co(tr)  
-
-
105  
285  
-
-
VDS = 0 V to 400 V, VGS = 0 V  
Effective Output Capacitance, Time  
Related b  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
-
-
-
-
-
-
-
-
57  
14  
86  
-
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V
GS = 10 V  
ID = 12 A, VDS = 400 V  
nC  
25  
-
19  
38  
72  
86  
58  
-
36  
VDD = 400 V, ID = 12 A  
Rg = 9.1 Ω, VGS = 10 V  
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
57  
29  
Gate Input Resistance  
Drain-Source Body Diode Characteristics  
Rg  
f = 1 MHz, open drain  
0.56  
Ω
D
MOSFET symbol  
showing the  
Continuous Source-Drain Diode Current  
Pulsed Diode Forward Current  
IS  
-
-
-
-
12  
50  
A
G
integral reverse  
p - n junction diode  
ISM  
S
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
VSD  
trr  
TJ = 25 °C, IS = 16.5 A, VGS = 0 V  
-
-
-
-
-
1.2  
V
ns  
μC  
A
338  
5.3  
29  
-
-
-
TJ = 25 °C, IF = IS,  
dI/dt = 100 A/μs, VR = 25 V  
Qrr  
IRRM  
Notes  
a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS  
b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS  
.
.
S15-0493-Rev. A, 16-Mar-15  
Document Number: 91646  
2
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)  
70  
60  
50  
40  
30  
20  
10  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
TOP  
15 V  
14 V  
13 V  
12 V  
11 V  
10 V  
9 V  
8 V  
7 V  
6 V  
TJ = 25 °C  
ID = 12 A  
BOTTOM 5 V  
VGS = 10 V  
0
5
10  
15  
20  
25  
30  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
TJ, Junction Temperature (°C)  
VDS, Drain-to-Source Voltage (V)  
Fig. 1 - Typical Output Characteristics  
Fig. 4 - Normalized On-Resistance vs. Temperature  
40  
30  
20  
10  
0
10 000  
TOP  
15 V  
14 V  
13 V  
12 V  
11 V  
10 V  
9 V  
8 V  
7 V  
6 V  
TJ = 150 °C  
Ciss  
1000  
100  
10  
VGS = 0 V, f = 1 MHz  
C
C
iss = Cgs + Cgd, Cds shorted  
rss = Cgd  
BOTTOM 5 V  
Coss = Cds + Cgd  
Coss  
Crss  
1
0
100  
200  
300  
400  
500  
0
5
10  
15  
20  
25  
30  
VDS, Drain-to-Source Voltage (V)  
VDS, Drain-to-Source Voltage (V)  
Fig. 2 - Typical Output Characteristics  
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage  
70  
60  
50  
40  
30  
20  
10  
0
12  
TJ = 25 °C  
5000  
10  
8
Coss  
Eoss  
6
TJ = 150 °C  
500  
4
VDS = 28.6 V  
2
50  
0
0
5
10  
15  
20  
25  
0
100  
200  
300  
400  
500  
VDS  
VGS, Gate-to-Source Voltage (V)  
Fig. 3 - Typical Transfer Characteristics  
S15-0493-Rev. A, 16-Mar-15  
Fig. 6 - COSS and EOSS vs. VDS  
Document Number: 91646  
3
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
24  
20  
16  
12  
8
30  
24  
18  
12  
6
VDS = 400 V  
VDS = 250 V  
DS = 100 V  
V
4
0
0
0
20  
40  
60  
80  
100  
120  
25  
50  
75  
100  
125  
150  
Qg, Total Gate Charge (nC)  
TC, Case Temperature (°C)  
Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage  
Fig. 10 - Maximum Drain Current vs. Case Temperature  
100  
650  
625  
600  
575  
550  
525  
500  
TJ = 150 °C  
10  
TJ = 25 °C  
1
475  
ID = 250 μA  
VGS = 0 V  
1.2 1.4  
0.1  
450  
0.2  
0.4  
0.6  
0.8  
1.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
TJ, Junction Temperature (°C)  
VSD, Source-Drain Voltage (V)  
Fig. 8 - Typical Source-Drain Diode Forward Voltage  
Fig. 11 - Typical Drain-to-Source Voltage vs. Temperature  
Operation in this Area  
Limited by RDS(on)  
100  
IDM Limited  
10  
1
100 μs  
Limited by RDS(on)  
*
1 ms  
10 ms  
0.1  
0.01  
TC = 25 °C  
TJ = 150 °C  
Single Pulse  
BVDSS Limited  
1
10  
100  
1000  
VDS, Drain-to-Source Voltage (V)  
* VGS > minimum VGS at which RDS(on) is specified  
Fig. 9 - Maximum Safe Operating Area  
S15-0493-Rev. A, 16-Mar-15  
Document Number: 91646  
4
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
Pulse Time (s)  
Fig. 12 - Normalized Thermal Transient Impedance, Junction-to-Case  
RD  
VDS  
VDS  
tp  
VGS  
VDD  
D.U.T.  
RG  
+
V
-
DD  
VDS  
10 V  
Pulse width 1 µs  
Duty factor 0.1 %  
IAS  
Fig. 13 - Switching Time Test Circuit  
Fig. 16 - Unclamped Inductive Waveforms  
VDS  
QG  
10 V  
90 %  
QGS  
QGD  
10 %  
VGS  
VG  
td(on) tr  
td(off) tf  
Charge  
Fig. 14 - Switching Time Waveforms  
Fig. 17 - Basic Gate Charge Waveform  
Current regulator  
Same type as D.U.T.  
L
VDS  
50 kΩ  
Vary tp to obtain  
required IAS  
12 V  
0.2 µF  
0.3 µF  
D.U.T  
IAS  
+
-
RG  
+
-
VDS  
VDD  
D.U.T.  
VGS  
10 V  
0.01 Ω  
3 mA  
tp  
IG  
ID  
Current sampling resistors  
Fig. 15 - Unclamped Inductive Test Circuit  
S15-0493-Rev. A, 16-Mar-15  
Fig. 18 - Gate Charge Test Circuit  
Document Number: 91646  
5
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHB25N50E  
Vishay Siliconix  
www.vishay.com  
Peak Diode Recovery dV/dt Test Circuit  
+
Circuit layout considerations  
Low stray inductance  
Ground plane  
D.U.T.  
Low leakage inductance  
current transformer  
-
+
-
-
+
Rg  
dV/dt controlled by Rg  
Driver same type as D.U.T.  
ISD controlled by duty factor “D”  
D.U.T. - device under test  
+
-
VDD  
Driver gate drive  
P.W.  
P.W.  
D =  
Period  
Period  
V
GS = 10 Va  
D.U.T. lSD waveform  
D.U.T. VDS waveform  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
Diode recovery  
dV/dt  
VDD  
Re-applied  
voltage  
Body diode forward drop  
Inductor current  
ISD  
Ripple 5 %  
Note  
a. VGS = 5 V for logic level devices  
Fig. 19 - For N-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?91646.  
S15-0493-Rev. A, 16-Mar-15  
Document Number: 91646  
6
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
AN826  
Vishay Siliconix  
2
RECOMMENDED MINIMUM PADS FOR D PAK: 3-Lead  
0.420  
(10.668)  
0.145  
(3.683)  
0.135  
(3.429)  
0.200  
0.050  
(5.080)  
(1.257)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
Return to Index  
Document Number: 73397  
11-Apr-05  
www.vishay.com  
1
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please  
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by  
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Material Category Policy  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the  
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council  
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment  
(EEE) - recast, unless otherwise specified as non-compliant.  
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that  
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free  
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference  
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21  
conform to JEDEC JS709A standards.  
Revision: 02-Oct-12  
Document Number: 91000  
1

相关型号:

SIHB28N60EF-GE3

Power Field-Effect Transistor, 28A I(D), 600V, 0.123ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3/2
VISHAY

SIHB30N60E

E Series Power MOSFET
VISHAY

SIHB33N60E

E Series Power MOSFET
VISHAY

SIHB33N60E-GE3

Power Field-Effect Transistor, 33A I(D), 600V, 0.099ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, D2PAK-3/2
VISHAY

SIHB33N60EF-GE3

Power Field-Effect Transistor, 33A I(D), 600V, 0.098ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3/2
VISHAY

SIHB33N60ET1-GE3

MOSFET N-CH 600V 33A TO263
VISHAY

SIHB33N60ET5-GE3

MOSFET N-CH 600V 33A TO263
VISHAY

SIHB35N60E-GE3

Power Field-Effect Transistor,
VISHAY

SIHB8N50D-GE3

Power Field-Effect Transistor, 8.7A I(D), 500V, 0.85ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, TO-263, D2PAK-3/2
VISHAY

SIHD11N80AE-GE3

Power Field-Effect Transistor,
VISHAY

SIHD3N50D

D Series Power MOSFET
VISHAY

SIHD3N50D

D Series Power MOSFET
FREESCALE