SIHFZ44R [VISHAY]
Power MOSFET; 功率MOSFET
| 型号： | SIHFZ44R |
| 厂家： | 
VISHAY |
| 描述： | Power MOSFET |
| 文件： | 总8页 (文件大小：1242K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IRFZ44R, SiHFZ44R
Vishay Siliconix
Power MOSFET
FEATURES
• Advanced Process Technology
PRODUCT SUMMARY
VDS (V)
60
• Ultra Low On-Resistance
• Dynamic dV/dt Rating
• 175 °C Operating Temperature
• Fast Switching
Available
RDS(on) (Ω)
VGS = 10 V
0.028
RoHS*
Qg (Max.) (nC)
67
18
COMPLIANT
Q
Q
gs (nC)
gd (nC)
25
• Fully Avalanche Rated
Configuration
Single
• Drop in Replacement of the IRFZ44/SiHFZ44 for
Linear/Audio Applications
D
• Lead (Pb)-free Available
TO-220
DESCRIPTION
Advanced Power MOSFETs from Vishay utilize advanced
processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
G
S
D
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
TO-220
IRFZ44RPbF
SiHFZ44R-E3
IRFZ44R
Lead (Pb)-free
SnPb
SiHFZ44R
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Gate-Source Voltage
VGS
20
V
Continuous Drain Currente
TC = 25 °C
C = 100 °C
50
36
VGS at 10 V
ID
T
A
Continuous Drain Current
Pulsed Drain Currenta
IDM
200
Linear Derating Factor
Single Pulse Avalanche Energyb
1.0
W/°C
mJ
EAS
PD
100
Maximum Power Dissipation
TC = 25 °C
150
W
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
4.5
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d
- 55 to + 175
300
°C
for 10 s
6-32 or M3 screw
10
lbf · in
N · m
Mounting Torque
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 44 µH, RG = 25 Ω, IAS = 51 A (see fig. 12).
c. ISD ≤ 51 A, dV/dt ≤ 250 A/µs, VDD ≤ VDS, TJ ≤ 175 °C.
d. 1.6 mm from case.
e. Current limited by the package, (die current = 51 A).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
www.vishay.com
1
WORK-IN-PROGRESS
IRFZ44R, SiHFZ44R
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYP.
MAX.
62
UNIT
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
RthJA
RthCS
RthJC
-
0.50
-
-
°C/W
1.0
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
VDS
ΔVDS/TJ
VGS(th)
IGSS
VGS = 0 V, ID = 250 µA
Reference to 25 °C, ID = 1 mA
VDS = VGS, ID = 250 µA
VGS = ± 20
60
-
-
-
V
V/°C
V
V
DS Temperature Coefficient
-
2.0
-
0.060
Gate-Source Threshold Voltage
Gate-Source Leakage
-
-
-
-
-
-
4.0
100
25
nA
VDS = 60 V, VGS = 0 V
-
Zero Gate Voltage Drain Current
IDSS
µA
V
DS = 48 V, VGS = 0 V, TJ = 150 °C
VGS = 10 V
ID = 31 Ab
VDS = 25 V, ID = 31 Ab
-
250
0.028
-
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
RDS(on)
gfs
-
Ω
15
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Ciss
Coss
Crss
Qg
-
-
-
-
-
-
-
-
-
-
1900
920
170
-
-
-
VGS = 0 V,
V
DS = 25 V,
pF
f = 1.0 MHz, see fig. 5
-
67
18
25
-
ID = 51 A, VDS = 48 V,
see fig. 6 and 13b
Qgs
Qgd
td(on)
tr
VGS = 10 V
-
nC
-
14
110
45
92
-
VDD = 30 V, ID = 51 A,
G = 9.1 Ω, RD = 0.55 Ω, see fig. 10b
ns
Turn-Off Delay Time
Fall Time
td(off)
tf
-
R
-
D
Between lead,
Internal Drain Inductance
LD
LS
-
-
4.5
7.5
-
-
6 mm (0.25") from
package and center of
die contact
nH
G
Internal Source Inductance
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
IS
-
-
-
-
50c
A
G
Pulsed Diode Forward Currenta
ISM
200
S
Body Diode Voltage
VSD
trr
TJ = 25 °C, IS = 51 A, VGS = 0 Vb
-
-
-
-
2.5
180
0.80
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
120
0.53
ns
µC
TJ = 25 °C, IF = 51 A, dI/dt = 100 A/µsb
Qrr
ton
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
c. Current limited by the package (die current = 51 A).
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Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
IRFZ44R, SiHFZ44R
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
2.5
2.0
1.5
1.0
0.5
0.0
51A
=
I
D
V
=10V
GS
-60 -40 -20
0
20 40 60 80 100 120 140 160 180
°
T , Junction Temperature ( C)
J
Fig. 2 - Typical Output Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
www.vishay.com
3
IRFZ44R, SiHFZ44R
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
1000
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
100
10
1
100us
1ms
10ms
°
T = 25 C
C
°
T = 175 C
J
Single Pulse
1
10
100
1000
V
, Drain-to-Source Voltage (V)
DS
Fig. 8 - Maximum Safe Operating Area
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
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4
Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
IRFZ44R, SiHFZ44R
Vishay Siliconix
RD
60
50
40
30
20
10
0
VDS
LIMITED BY PACKAGE
VGS
D.U.T.
RG
+
V
-
DD
10 V
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
Fig. 10a - Switching Time Test Circuit
VDS
90 %
10 %
VGS
25
50
T
75
100
125
150
175
°
, Case Temperature( C)
C
td(on) tr
td(off) tf
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
10
1
D = 0.50
0.20
P
2
DM
0.10
0.1
t
1
0.05
t
2
0.02
0.01
Notes:
1. Duty factor D = t / t
SINGLE PULSE
1
(THERMAL RESPONSE)
2. Peak T =P
x Z
+ T
C
J
DM
thJC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Rectangular Pulse Duration (sec)
1
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
VDS
15 V
tp
Driver
L
VDS
D.U.T
RG
+
-
V
A
DD
IAS
IAS
20 V
0.01 Ω
tp
Fig. 12a - Unclamped Inductive Test Circuit
Fig. 12b - Unclamped Inductive Waveforms
Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
www.vishay.com
5
IRFZ44R, SiHFZ44R
Vishay Siliconix
250
200
150
100
50
I
D
TOP
21A
36A
BOTTOM 51A
0
25
50
75
100
125
150
175
°
Starting T , Junction Temperature ( C)
J
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 kΩ
QG
VGS
12 V
0.2 µF
0.3 µF
+
-
QGS
QGD
VDS
D.U.T.
VG
VGS
3 mA
Charge
IG
Current sampling resistors
Fig. 13b - Gate Charge Test Circuit
ID
Fig. 13a - Basic Gate Charge Waveform
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Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
IRFZ44R, SiHFZ44R
Vishay Siliconix
Peak Diode Recovery dV/dt Test Circuit
+
Circuit layout considerations
• Low stray inductance
• Ground plane
D.U.T
• Low leakage inductance
current transformer
-
+
-
-
+
RG
• dV/dt controlled by RG
+
-
• Driver same type as D.U.T.
• ISD controlled by duty factor "D"
• D.U.T. - device under test
VDD
Driver gate drive
P.W.
P.W.
Period
Period
D =
V
= 10 V*
GS
D.U.T. I waveform
SD
Reverse
recovery
current
Body diode forward
current
dI/dt
D.U.T. V waveform
DS
Diode recovery
dV/dt
V
DD
Re-applied
voltage
Body diode forward drop
Ripple ≤ 5 %
Inductor current
I
SD
* VGS = 5 V for logic level devices
Fig. 14 - For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?91292.
Document Number: 91292
S-Pending-Rev. A, 17-Jul-08
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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