SUR50N025-05P-T4-E3 [VISHAY]
N-Channel 25-V (D-S) MOSFET; N通道25 -V (D -S )的MOSFET型号: | SUR50N025-05P-T4-E3 |
厂家: | VISHAY |
描述: | N-Channel 25-V (D-S) MOSFET |
文件: | 总6页 (文件大小:97K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SUR50N025-05P
New Product
Vishay Siliconix
N-Channel 25-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
D TrenchFETr Power MOSFET
VDS (V)
rDS(on) (W)
ID (A)a, e
Qg (Typ)
D 100% Rg Tested
D RoHS Compliant
APPLICATIONS
0.0052 @ V = 10 V
89
80
GS
25
30 nC
0.0076 @ V = 4.5 V
GS
D DC/DC Conversion, Low-Side
− Desktop PC
− Notebook PC
TO-252
Reverse Lead DPAK
D
G
Drain Connected to Tab
G
D
S
Top View
S
Ordering Information:
N-Channel MOSFET
SUR50N025-05P—E3 (Lead (Pb)-Free)
SUR50N025-05P-T4—E3 (Lead (Pb)-Free, alternate tape orientation)
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)
A
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V
V
25
DS
V
"20
GS
a, e
T
T
= 25_C
= 70_C
= 25_C
= 70_C
89
C
a, e
75
C
Continuous Drain Current (T = 175__C)
I
J
D
b, c
T
A
36
b, c
30
T
A
A
Pulsed Drain Current
I
100
55
DM
T
C
= 25_C
= 25_C
Continuous Source-Drain Diode Current
I
S
b, c
T
A
7.7
Avalanche Current Pulse
I
AS
45
L = 0.1 mH
Single Pulse Avalanche Energy
E
101
mJ
AS
a
T
T
= 25_C
= 70_C
= 25_C
= 70_C
83
C
a
58
C
Maximum Power Dissipation
P
W
D
b, c
T
A
11.5
b, c
T
A
8.0
Operating Junction and Storage Temperature Range
T , T
J
−55 to 175
_C
stg
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
b, d
Maximum Junction-to-Ambient
t p 10 sec
R
10
13
thJA
thJC
C/W
Maximum Junction-to-Case
Steady State
R
1.5
1.8
Notes:
a. Based on T = 25_C.
C
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 sec
d. Maximum under steady state conditions is 90 _C/W.
e. Calculated based on maximum junction temperature. Package limitation current is 50 A.
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
1
SUR50N025-05P
Vishay Siliconix
New Product
SPECIFICATIONS (T = 25_C UNLESS OTHERWISE NOTED)
J
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
V
V
= 0 V, I = 250 mA
25
V
DS
GS
D
V
V
Temperature Coefficient
DV /T
J
20
DS
DS
mV/_C
I
D
= 250 mA
Temperature Coefficient
DV
/T
J
−6.0
GS(th)
GS(th)
V
= V , I = 250 mA
GS D
Gate-Source Threshold Voltage
Gate-Source Leakage
V
1.4
50
2.4
"100
1
V
DS
GS(th)
V
= 0 V, V = "20 V
GS
I
nA
DS
GSS
V
= 25 V, V = 0 V
GS
DS
Zero Gate Voltage Drain Current
I
mA
DSS
V
= 25 V, V = 0 V, T = 55_C
10
DS
GS
J
a
On-State Drain Current
I
A
V
w 5 V, V = 10 V
GS
D(on)
DS
0.0042
0.0052
0.0076
V
= 10 V, I = 20 A
D
GS
a
Drain-Source On-State Resistance
r
W
DS(on)
V
= 4.5 V, I = 15 A
0.0062
65
GS
DS
D
a
Forward Transconductance
g
fs
V
= 15 V, I = 15 A
S
D
Dynamicb
Input Capacitance
C
C
3600
790
430
63
iss
Output Capacitance
V
= 12 V, V = 0 V, f = 1 MHz
DS GS
pF
oss
Reverse Transfer Capacitance
C
rss
V
= 12 V, V = 10 V, I = 50 A
95
45
DS
DS
GS
D
Total Gate Charge
Q
g
30
nC
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Q
Q
V
= 12 V, V = 4.5 V, I = 50 A
10.5
10.5
1.0
24
gs
GS
D
gd
R
f = 1 MHz
0.5
1.5
36
20
36
12
17
17
44
12
W
g
t
d(on)
t
13
r
V
= 12 V, R = 0.24 W
L
GEN g
DD
^ 50 A, V
I
= 4.5 V, R = 1 W
D
Turn-Off Delay Time
Fall Time
t
24
d(off)
t
7.5
11
f
ns
Turn-On Delay Time
Rise Time
t
t
d(on)
t
11
r
V
= 12 V, R = 0.24 W
L
DD
^ 50 A, V
I
D
= 10 V, R = 1 W
GEN g
Turn-Off Delay Time
Fall Time
29
d(off)
t
8
f
Drain-Source Body Diode Characteristics
T
= 25_C
Continuous Source-Drain Diode Current
I
55
100
1.5
51
C
S
A
a
Pulse Diode Forward Current
I
SM
I
= 30 A
Body Diode Voltage
V
0.9
34
25
17
17
V
S
SD
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
t
rr
ns
nC
Q
38
rr
I
F
= 20 A, di/dt = 100 A/ms, T = 25_C
J
t
t
a
ns
b
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
2
SUR50N025-05P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
100
20
16
12
8
4 V
V
= 10 thru 5 V
GS
80
60
40
20
0
T
C
= 125_C
4
25_C
2 V
1.2
3 V
−55_C
0
1.0
0.0
0.4
0.8
1.6
2.0
1.5
2.0
2.5
3.0
3.5
V
− Drain-to-Source Voltage (V)
V
− Gate-to-Source Voltage (V)
GS
DS
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
0.012
4800
4000
3200
2400
1600
800
0.010
0.008
0.006
0.004
0.002
0.000
C
iss
V
= 4.5 V
GS
V
= 10 V
GS
C
oss
C
rss
0
0
20
40
60
80
100
0
5
10
15
20
25
I
D
− Drain Current (A)
V
DS
− Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
10
8
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I
D
= 20 A
V
= 10 V
GS
V
= 4.5 V
V
= 12 V
GS
DS
6
V
= 18 V
DS
4
2
0
0
8
16
Q
24
32
40
48
56
64
−50 −25
0
T
25
50
75 100 125 150 175
− Total Gate Charge (nC)
− Junction Temperature (_C)
g
J
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
3
SUR50N025-05P
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.030
0.025
0.020
0.015
0.010
0.005
0.000
100
I
= 20 A
D
T = 150_C
J
10
1
0.1
T = 125_C
J
T = 25_C
J
0.01
T = 25_C
J
0.001
2
3
4
5
6
7
8
9
10
0.00
0.2
0.4
0.6
0.8
1.0
1.2
V
− Source-to-Drain Voltage (V)
V
− Gate-to-Source Voltage (V)
GS
SD
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.6
720
600
0.3
0.0
I
D
= 250 mA
480
360
240
120
T
A
= 25_C
−0.3
−0.6
−0.9
−1.2
0
−50 −25
0
25
50
75 100 125 150 175
0.001
0.01
0.1
1
10
100
1000
T
J
− Temperature (_C)
Time (sec)
Safe Operating Area, Junction-to-Case
1000
*Limited by r
100
DS(on)
10 ms
100 ms
10
1
1 ms
10 ms
100 ms, dc
T
= 25_C
C
Single Pulse
0.1
0.1
1
10
100
V
− Drain-to-Source Voltage (V)
DS
*V u minimum V at which r is specified
GS
GS
DS(on)
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
4
SUR50N025-05P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Current De-Rating*
Power De-Rating
100
90
75
60
45
30
15
0
80
60
40
Package Limited
20
0
0
25
50
75
100
125
150
175
25
50
75
100
125
150
175
T
C
− Case Temperature (_C)
T
C
− Case Temperature (_C)
Single Pulse Avalanche Capability
1000
100
10
1
L @ I
D
T
+
A
BV * V
DD
0.1
0.00001 0.0001
0.001
0.01
0.1
1
T
A
− Time In Avalanche (sec)
*The power dissipation P is based on T
= 175_C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for
D
J(max)
cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
5
SUR50N025-05P
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Duty Cycle = 0.5
0.2
0.1
Notes:
P
DM
0.1
0.05
0.02
t
1
t
2
t
t
1
2
1. Duty Cycle, D =
2. Per Unit Base = R
= 70_C/W
thJA
(t)
3. T − T = P
Z
JM
A
DM thJA
Single Pulse
4. Surface Mounted
0.01
−4
−3
−2
−1
10
10
10
10
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
−4
−3
−1
−2
10
10
10
1
10
Square Wave Pulse Duration (sec)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?73379.
Document Number: 73379
s-50933—Rev. A, 09-May-05
www.vishay.com
6
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