TEMD5010X01 [VISHAY]
Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released; 硅PIN光电二极管,符合RoHS ,发布的铅(Pb ) -free回流焊,符合AEC -Q101发布型号: | TEMD5010X01 |
厂家: | VISHAY |
描述: | Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released |
文件: | 总7页 (文件大小:141K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TEMD5010X01
Vishay Semiconductors
Silicon PIN Photodiode, RoHS Compliant, Released for Lead
(Pb)-free Reflow Soldering, AEC-Q101 Released
FEATURES
• Package type: surface mount
• Package form: top view
• Dimensions (L x W x H in mm): 5 x 4.24 x 1.12
• Radiant sensitive area (in mm2): 7.5
• Product designed and qualified acc. AEC-Q101
for the automotive market
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible and near infrared radiation
20535
• Fast response times
• Angle of half sensitivity: ϕ = 65°
• Floor life: 72 h, MSL 4, acc. J-STD-020
DESCRIPTION
• Lead (Pb)-free reflow soldering
TEMD5010X01 is a high speed and high sensitive PIN
photodiode. It is a miniature surface mount device (SMD)
including the chip with a 7.5 mm2 sensitive area detecting
visible and near infrared radiation.
• Lead (Pb)-free component in accordance with
RoHS 2002/95/EC and WEEE 2002/96/EC
APPLICATIONS
• High speed photo detector
PRODUCT SUMMARY
COMPONENT
Ira (µA)
ϕ (deg)
λ0.1 (nm)
TEMD5010X01
55
65
430 to 1100
Note
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TEMD5010X01
Tape and reel
MOQ: 1500 pcs, 1500 pcs/reel
Top view
Note
MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
60
UNIT
V
Reverse voltage
VR
PV
Tj
Power dissipation
Tamb ≤ 25 °C
215
mW
°C
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
100
Tamb
Tstg
- 40 to + 100
- 40 to + 100
260
°C
°C
Acc. reflow solder profile fig. 8
Tsd
°C
RthJA
350
K/W
Note
T
amb = 25 °C, unless otherwise specified
Document Number: 84679
Rev. 1.3, 16-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com
443
TEMD5010X01
Silicon PIN Photodiode, RoHS Compliant, Released for
Vishay Semiconductors
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
BASIC CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
VF
MIN.
TYP.
MAX.
UNIT
V
Forward voltage
IF = 50 mA
1
1.3
Breakdown voltage
I
R = 100 µA, E = 0
R = 10 V, E = 0
V(BR)
Iro
60
V
Reverse dark current
V
2
70
30
40
nA
V
V
R = 0 V, f = 1 MHz, E = 0
R = 3 V, f = 1 MHz, E = 0
CD
pF
Diode capacitance
CD
25
pF
Open circuit voltage
Ee = 1 mW/cm2, λ = 950 nm
Ee = 1 mW/cm2, λ = 950 nm
Ee = 1 mW/cm2, λ = 950 nm
Ee = 1 mW/cm2, λ = 950 nm
Ee = 1 mW/cm2, λ = 950 nm,
Vo
350
- 2.6
50
mV
mV/K
µA
Temperature coefficient of Vo
Short circuit current
TKVo
Ik
Temperature coefficient of Ik
TKIk
0.1
%/K
Reverse light current
Ira
45
55
µA
V
R = 5 V
Angle of half sensitivity
ϕ
65
940
deg
nm
Wavelength of peak sensitivity
Range of spectral bandwidth
Noise equivalent power
λp
λ0.1
NEP
430 to 1100
4 x 10-14
nm
V
R = 10 V, λ = 950 nm
W/√Hz
V
R = 10 V, RL = 1 kΩ,
λ = 820 nm
Rise time
tr
tf
100
100
ns
ns
V
R = 10 V, RL = 1 kΩ,
λ = 820 nm
Fall time
Note
Tamb = 25 °C, unless otherwise specified
BASIC CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
1000
100
10
1.4
1.2
1.0
VR = 5 V
λ = 950 nm
0.8
VR = 10 V
80
0.6
1
20
40
60
100
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
94 8403
Tamb - Ambient Temperature (°C)
94 8409
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature
www.vishay.com
444
For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84679
Rev. 1.3, 16-Sep-08
TEMD5010X01
Silicon PIN Photodiode, RoHS Compliant, Released for
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
Vishay Semiconductors
1000
100
10
1.0
0.8
0.6
0.4
V
= 5 V
R
1
λ= 950 nm
0.2
0
0.1
0.01
10
0.1
1
1150
350
550
λ - Wavelength (nm)
Fig. 6 - Relative Spectral Sensitivity vs. Wavelength
750
950
2
Ee - Irradiance (mW/cm )
12787
94 8420
Fig. 3 - Reverse Light Current vs. Irradiance
0°
10°
20°
100
30°
40°
2
1 mW/cm
2
0.5mW/cm
1.0
0.9
2
0.2 mW/cm
10
50°
60°
2
0.1 mW/cm
0.8
2
0.05 mW/cm
70°
0.7
80°
λ = 950 nm
1
100
0.1
1
10
0.6
0.4
0.2
0
VR - Reverse Voltage (V)
12788
94 8406
Fig. 4 - Reverse Light Current vs. Reverse Voltage
Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement
80
E = 0
f = 1 MHz
60
40
20
0
0.1
1
10
100
948407
VR - Reverse Voltage (V)
Fig. 5 - Diode Capacitance vs. Reverse Voltage
Document Number: 84679
Rev. 1.3, 16-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com
445
TEMD5010X01
Silicon PIN Photodiode, RoHS Compliant, Released for
Vishay Semiconductors
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
PACKAGE DIMENSIONS in millimeters
Drawing-No.: 6.541-5060.01-4
Not indicated tolerances 0.1
Issue: 3; 05.02.08
20536
www.vishay.com
446
For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84679
Rev. 1.3, 16-Sep-08
TEMD5010X01
Silicon PIN Photodiode, RoHS Compliant, Released for
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
Vishay Semiconductors
TAPING DIMENSIONS in millimeters
20537
REEL DIMENSIONS in millimeters
20874
Document Number: 84679
Rev. 1.3, 16-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com
447
TEMD5010X01
Silicon PIN Photodiode, RoHS Compliant, Released for
Vishay Semiconductors
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
SOLDER PROFILE
DRYPACK
300
Devices are packed in moisture barrier bags (MBB) to
max. 260 °C
245 °C
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
255 °C
250
240 °C
217 °C
200
FLOOR LIFE
max. 30 s
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 4
150
max. 100 s
max. 120 s
100
Floor life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
50
0
max. ramp down 6 °C/s
max. ramp up 3 °C/s
DRYING
0
50
100
150
200
250
300
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020D
96 h at 60 °C (+ 5 °C), RH < 5 %.
www.vishay.com
448
For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84679
Rev. 1.3, 16-Sep-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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