TLME230 [VISHAY]
Visible LED,;
VISHAY 
TLM.230.
Vishay Semiconductors
VISHAY
MiniLED Ultrabright
Description
The new MiniLED Series have been designed in a
small white SMT package. The feature of the device
is the very small package 2.3 mm x 1.3 mm x 1.4 mm.
The MinLED is an obvious solution for small-scale,
high-power products that are expected to work reli-
ably in an arduous environment. This is often the case
in automotive and industrial application of course.
16906
Features
Applications
Automotive: backlighting in dashboards and switches
Telecommunication: indicator and backlighting in
telephone and fax
• SMD LEDs with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement equipment
• EIA and ICE standard package
• IR reflow soldering
Indicator and backlight for audio and video equipment
Indicator and backlight in office equipment
Flat backlight for LCDs, switches and symbols
General use
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
I
/I
≤ 2.0, optional ≤ 1.6
Vmax Vmin
Parts Table
Part
Color, Luminous Intensity
Technology
AlInGaP on GaAs
TLMK230
TLMF230
TLME230
Red, IV > 32 mcd
Orange, IV > 25 mcd
Yellow, IV > 63 mcd
AlInGaP on GaAs
AlInGaP on GaAs
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
TLMK230. ,TLMF230. ,TLME230.
Parameter
Test condition
Sub type
Symbol
VR
Value
5
Unit
V
Reverse voltage
DC forward current
Tamb ≤ 80 °C
tp ≤ 10 µs
Tamb ≤ 80 °C
IF
IFSM
PV
30
0.1
mA
A
Surge forward current
Power dissipation
100
125
mW
°C
Junction temperature
Operating temperature range
Tj
Tamb
- 40 to + 100
°C
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Parameter
Test condition
Sub type
Symbol
Tstg
Value
Unit
°C
Storage temperature range
- 40 to + 100
Soldering temperature
t ≤ 5 s
Tsd
260
550
°C
Thermal resistance junction/
ambient
mounted on PC board (pad size >
16 mm2)
RthJA
K/W
Optical and Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Red
TLMK230.
Parameter
Test condition
IF = 10 mA
Sub type Symbol
Min
16
Typ.
40
Max
Unit
mcd
Luminous intensity 2)
Dominant wavelength
TLMK230
IV
λd
λp
ϕ
IF = 10 mA
IF = 10 mA
IF = 10 mA
IF = 20 mA
IR = 10 µA
630
643
60
nm
nm
deg
V
Peak wavelength
Angle of half intensity
Forward voltage
VF
VR
Cj
1.9
2.6
Reverse voltage
5
V
Junction capacitance
VR = 0, f = 1 MHz
15
pF
2) in one Packing Unit IVMin./ IVMax. ≤ 2.0
Orange
TLMF230.
Parameter
Luminous intensity 2)
Dominant wavelength
Test condition
IF = 10 mA
IF = 10 mA
Sub type Symbol
Min
25
Typ.
60
Max
611
Unit
mcd
TLMF230
IV
λd
λp
ϕ
598
605
610
60
nm
nm
deg
V
Peak wavelength
Angle of half intensity
Forward voltage
IF = 10 mA
IF = 10 mA
IF = 20 mA
VF
VR
Cj
2.0
2.6
Reverse voltage
IR = 10 µA
5
V
Junction capacitance
VR = 0, f = 1 MHz
15
pF
2) in one Packing Unit IVMin./ IVMax. ≤ 2
Yellow
TLME230.
Parameter
Luminous intensity 2)
Dominant wavelength
Test condition
IF = 10 mA
IF = 10 mA
Sub type Symbol
Min
25
Typ.
60
Max
594
Unit
mcd
TLME230
IV
λd
λp
ϕ
581
588
590
60
nm
nm
deg
V
Peak wavelength
Angle of half intensity
Forward voltage
IF = 10 mA
IF = 10 mA
IF = 20 mA
VF
VR
Cj
2.0
2.6
Reverse voltage
IR = 10 µA
5
V
Junction capacitance
VR = 0, f = 1 MHz
15
pF
2) in one Packing Unit IVMin./ IVMax. ≤ 2
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Package Dimensions in mm
16892
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Reel Dimensions
16938
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Tape Dimensions
16939
Leader and Trailer
Trailer
Leader
no devices
devices
no devices
End
Start
min. 200
min. 400
96 11818
GS08 = 3000 pcs
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3N
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard pack-
ing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
300 10 mm/min
165 ° - 180 ° peel angle
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Length
18
Plain Writing
Item-Description
Abbreviation
–
INO
SEL
BATCH
COD
8
Item-Number
Selection-Code
LOT-/ Serial-Number
Data-Code
3
10
3 (YWW)
Plant-Code
PTC
2
Quantity
QTY
8
Accepted by:
–
ACC
PCK
–
Packed by:
Mixed Code Indicator
MIXED CODE
xxxxxxx+
–
Company Logo
Origin
Length
Long Bar Code Top
Item-Number
Type
N
N
8
2
Plant-Code
X
N
–
3
Sequence-Number
Quantity
8
21
Total Length
Short Bar Code Bottom
Selection–Code
Data-Code
Length
3
Type
X
N
3
10
1
X
–
–
Batch-Number
Filter
17
Total Length
16942
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
An EIA JEDEC Standard JESD22-A112 Level 2 label
is included on all dry bags.
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during
transportation and storage.
Aluminium bag
Label
Reel
15973
17028
Example of JESD22-A112 Level 2 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices
warning labels are on the packaging.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium
bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific
data.
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 1 year under these conditions
moisture content will be too high for reflow soldering.
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 1 year
stored under max. 30 °C, 60 % RH after opening
envelop
In case of moisture absorption, the devices will
recover
to the former condition by drying under the following
condition:
• Recommended soldering paste
(composition: SN 63 %, Pb 37 %)
Melting temperature 178 °C to 192 °C
192 hours at 40 °C +5 °C/ -0 °C and < 5 % RH
(dry air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH
for all device containers or
24 hours at 100 °C +5 °C
not suitable for reel or tubes.
• Apply solder paste to the specified soldering
pads, by using a dispenser or by screen printing.
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a
combinationtype with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera–
ture at the device surface. Since temperature differ–
ence occurs between the work and the surface of
the circuit board depending on the pes of circuit
board or reflow furnace, the operating conditions
should be verified prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is
cooled off.
Cleaning
• Perform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 mΩ
corresponding to a conductivity of 2 mS/m.
• Temperature and time: 30 seconds under the
temperature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
240
10 s max.
220
200
180
160
140
120
100
80
@ 230 qC
2 qC - 4 qC/s
120 s - 180 s
90 s max
60
40
2 qC - 4 qC/s
20
0
0
50
100 150 200 250 300 350
Time ( s )
16944
Document Number 83200
Rev. A2, 14-Nov-02
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TLM.230.
Vishay Semiconductors
VISHAY
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further
notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 83200
Rev. A2, 14-Nov-02
www.vishay.com
9
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