TSMP6000TR [VISHAY]
SMD PH.MODULE REPEATER;
| 型号： | TSMP6000TR |
| 厂家： | 
VISHAY |
| 描述： | SMD PH.MODULE REPEATER 中继器 输出元件 光电 |
| 文件： | 总10页 (文件大小：312K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TSMP6000
Vishay Semiconductors
www.vishay.com
IR Sensor Module for Remote Control Systems
FEATURES
• Photo detector and preamplifier in one package
• AC coupled response from 20 kHz to 60 kHz, all
data formats
• Improved shielding against electrical field
disturbance
• TTL and CMOS compatibility
4
• Output active low
3
2
• Supply voltage 2.5 V to 5.5 V, typically the device
works in the range between 2.0 V and 5.5 V
1
16797
• Carrier out signal for code learning functions
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3
D
Product Page
3D Models
Calculators
Marking
MECHANICAL DATA
Pinning:
DESCRIPTION
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
The TSMP6000 is a miniaturized sensor for receiving various
kinds of modulated IR signals. A PIN diode and preamplifier
are assembled on a lead frame, the epoxy package is
designed as an IR filter. The modulated output signal, carrier
out, can be used for code learning applications.
ORDERING CODE
Taping:
TSMP6000TT - top view taped, 1190 pcs/reel
TSMP6000TR - side view taped, 1120 pcs/reel
This component has not been qualified according to
automotive specifications.
BLOCK DIAGRAM
3 VS
4 Carrier out
1 GND
TIA
Amp
Signal shaping
19746-1
APPLICATION CIRCUIT
19750-2
R1 = 100 Ω
VS
Transmitter
TSMPxxxx
with
+ VS
C1 =
4.7 µF
R2 =
4.7 kΩ
TSALxxxx
µC
OUT
GND
VO
GND
R1 + C1 recommended to suppress power supply disturbances.
R2 recommended to get faster slopes and a correct high level of the
output pulses.
Rev. 2.0, 26-Mar-2021
Document Number: 82620
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
PARTS TABLE
Carrier
20 kHz to 60
kHz
TSMP6000
Panhead
frequency
Package
Pinning
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
7.5 W x 5.3 H x 4.0 D
SMD
Dimensions (mm)
Mounting
Application
Code learning
•
•
Narrow optical filter: www.vishay.com/doc?81590
Wide optical flter: www.vishay.com/doc?82726
Special options
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
-0.3 to +6
-0.3 to (VS + 0.3)
5
UNIT
V
Supply voltage (pin 3)
Output voltage (pin 4)
Output current (pin 4)
Junction temperature
Storage temperature range
Operating temperature range
VS
VO
V
IO
mA
°C
°C
°C
Tj
100
Tstg
Tamb
-25 to +85
-25 to +85
Note
•
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
ELECTRICAL AND OPTICAL CHARACTERISTICS CARRIER OUT
(Tamb = 25 °C, unless otherwise specified, VS = 3 V)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
0.55
2.5
TYP.
0.7
-
MAX.
0.9
UNIT
mA
V
Supply current (pin 3)
Supply voltage
Ev = 0
ISD
VS
5.5
Ev = 0, test signal see Fig. 1,
IR diode TSAL6200, IF = 50 mA
Transmission distance
d
-
1.8
-
m
Output voltage low (pin 4)
Minimum irradiance
I
OSL = 0.5 mA, test signal see Fig. 1
VS = 3 V, (20 kHz to 60 kHz)
VOSL
-
-
-
250
25
mV
mW/m2
Ee min.
12
Test signal see Fig. 1,
(20 kHz to 60 kHz)
Maximum irradiance
Directivity
Ee max.
50
-
80
50
-
-
W/m2
Angle of
half transmission distance
ϕ1/2
deg
fC = 20 kHz to 60 kHz,
Ee = 25 mW/m2 to 50 W/m2,
test signal see Fig. 1, BER ≤ 2%
N
Input burst
length
-1 cycle
Input burst
length
+1 cycle
Input burst
length
Output accuracy
carrier
pulses
counts
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Carrier cycle
(26.3 μs in case of 38 kHz)
Optical burst
(input signal)
Delay time td
Output voltage
Fig. 1 - Testsignal
Rev. 2.0, 26-Mar-2021
Document Number: 82620
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
0°
10°
20°
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
30°
40°
1.0
0.9
0.8
50°
60°
70°
80°
0.7
700 750 800 850 900 950 1000 1050 1100
0.6
d - Relative Transmission Distance
rel
0.6
0.4
0.2
0
0.2
0.4
16801
22484
ꢀ - Wavelength (nm)
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength
Fig. 3 - Horizontal Directivity
PACKAGE DIMENSIONS in millimeters
7.5
Pick and place area. TT taping
7.2
A
1
4
0.1
(1.4)
0.5 0.15
0.3
4x
0.1
1.27
2.9
3 x 1.27
=
3.81
4
A
0.4
5.51
Not indicated tolerances 0.3
Pick and place area. TR taping
2.6
technical drawings
according to DIN
specifications
Footprint
3 x 1.27 = 3.81
1.27
0.9
R 1.7
Drawing-No.: 6.544-5341.01-4
Issue: 8; 02.09.09
16776
Rev. 2.0, 26-Mar-2021
Document Number: 82620
3
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Axis Title
300
250
200
150
100
50
10000
max. 260 °C
255 °C
240 °C
245 °C
217 °C
1000
100
10
max. 20 s
max. 120 s
max. 100 s
Max. ramp up 3 °C/s Max. ramp down 6 °C/s
Max. 2 cycles allowed
0
0
50
100
150
200
250
300
Time (s)
19800
Rev. 2.0, 26-Mar-2021
Document Number: 82620
4
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
TAPING VERSION TSMP..TT DIMENSIONS in millimeters
16584
Rev. 2.0, 26-Mar-2021
Document Number: 82620
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
TAPING VERSION TSMP..TR DIMENSIONS in millimeters
16585
Rev. 2.0, 26-Mar-2021
Document Number: 82620
6
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
Leader
no devices
devices
no devices
End
Start
min. 200
min. 400
96 11818
Rev. 2.0, 26-Mar-2021
Document Number: 82620
7
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
OUTER PACKAGING
The sealed reel is packed into a pizza box.
CARTON BOX DIMENSIONS in millimeters
Length
Thickness
Width
22127
THICKNESS
WIDTH
LENGTH
Pizza box (SMD and Heimdall)
(taping in reels)
50
340
340
COVER TAPE PEEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 mm/min. 10 mm/min.
165° to 180° peel angle
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITTING
Item-description
Item-number
Selection-code
LOT-/serial-number
Data-code
ABBREVIATION
LENGTH
-
18
INO
8
SEL
3
BATCH
10
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
Mixed code indicator
Origin
MIXED CODE
-
xxxxxxx+
Company logo
LONG BAR CODE TOP
Item-number
Plant-code
TYPE
LENGTH
N
8
N
2
Sequence-number
Quantity
X
3
N
8
Total length
-
21
SHORT BAR CODE BOTTOM
Selection-code
Data-code
TYPE
LENGTH
X
N
X
-
3
3
Batch-number
Filter
10
1
Total length
-
17
Rev. 2.0, 26-Mar-2021
Document Number: 82620
8
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP6000
Vishay Semiconductors
www.vishay.com
DRY PACKING
ESD PRECAUTION
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
Aluminum bag
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Label
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
22645
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
EIA JEDEC standard J-STD-020 level 4 label
is included on all dry bags
Rev. 2.0, 26-Mar-2021
Document Number: 82620
9
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
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© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 09-Jul-2021
Document Number: 91000
1
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