VLMW3100-GS18 [VISHAY]
Visible LED,;VLMW310.
Vishay Semiconductors
High Intensity SMD LED
Description
This device has been designed to meet the increasing
demand for white SMD LED.
The package of the VLMW310. is the PLCC-2 (equiv-
alent to a size B tantalum capacitor).
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled with a mixture of epoxy and TAG phosphor.
19225
The TAG phosphor converts the blue emission par-
tially to yellow, which mixes with the remaining blue to
give white.
Features
Applications
• High efficient InGaN technology
• Chromaticity Coordinate categorized
• Automotive: Backlighting in dashboards and
switches
according to CIE1931 per packing unit
• Telecommunication: Indicator and backlighting in
telephone and fax
e3
• Luminous intensity ratio in one packing
unit I
/I
≤ 1.6
• Backlighting for audio and video equipment
• Backlighting in office equipment
• Indoor and outdoor message boards
• Flat backlight for LCD’s, switches and symbols
Vmax Vmin
• Typical color temperature 5500 K
• ESD class 1
• EIA and ICE standard package
• Compatible with infrared, vapor phase and wave
solder processes according to CECC
• Illumination purposes, alternative to incandescent
lamps
• Available in 8 mm tape reel
• General use
• Lead (Pb)-free device
• Preconditioning: according to Jedec Level 2a
Parts Table
Part
Color, Luminous Intensity
White, IV > 56 mcd
Angle of Half Intensity ( ϕ)
60°
Technology
VLMW3100
VLMW3101
VLMW3102
InGaN / TAG on SiC
White, IV = (56 to 140) mcd
White, IV > 112 mcd
60°
60°
InGaN / TAG on SiC
InGaN / TAG on SiC
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
VLMW310.
Parameter
Reverse voltage
Test condition
Symbol
VR
Value
Unit
V
5
DC Forward current
Tamb ≤ 70 °C
tp ≤ 10 µs
IF
IFSM
PV
20
0.1
mA
A
Surge forward current
Power dissipation
Tamb ≤ 70 °C
85
mW
°C
Junction temperature
Storage temperature range
Operating temperature range
Tj
100
Tstg
Tamb
- 40 to + 100
- 40 to + 100
°C
°C
Document Number 81212
Rev. 1.0, 04-Jan-06
www.vishay.com
1
VLMW310.
Vishay Semiconductors
Parameter
Test condition
Symbol
Tsd
Value
260
Unit
°C
Soldering temperature
t ≤ 5 s
Thermal resistance junction/
ambient
mounted on PC board
(pad size > 16 mm2)
RthJA
350
K/W
Optical and Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
White
VLMW310.
Parameter
Luminous intensity 1)
Test condition
IF = 10 mA
Part
Symbol
IV
Min
Typ.
Max
140
Unit
mcd
VLMW3100
VLMW3101
VLMW3102
VLMW3100
56
56
IV
IV
x
mcd
mcd
112
Chromaticity coordinate x acc. IF = 10 mA
to CIE 1931
0.33
0.33
Chromaticity coordinate y acc. IF = 10 mA
to CIE 1931
VLMW3100
y
Angle of half intensity
Forward voltage
IF = 10 mA
IF = 20 mA
ϕ
60
deg
V
VF
3.5
4.2
Reverse voltage
IR = 10 µA
VR
5
V
Temperature coefficient of VF
Temperature coefficient of IV
IF = 10 mA
IF = 10 mA
TCVF
TCIV
- 4
mV/K
% / K
- 0.5
1) in one Packing Unit IVmax/IVmin ≤ 1.6
Luminous Intensity Classification
Chromaticity coordinated groups for
white SMD LED
Group
Light Intensity [mcd]
Standard
Optional
Min
Max
X
Y
X
Y
0.266
0.258
0.273
0.280
0.273
0.266
0.280
0.286
0.280
0.273
0.285
0.291
0.286
0.280
0.291
0.296
0.291
0.285
0.307
0.310
0.296
0.291
0.310
0.313
0.232
0.239
0.261
0.252
0.227
0.232
0.252
0.244
0.252
0.261
0.279
0.268
0.244
0.252
0.268
0.259
0.268
0.279
0.312
0.297
0.259
0.268
0.297
0.284
0.310
0.307
0.330
0.330
0.313
0.310
0.330
0.330
0.330
0.330
0.347
0.345
0.330
0.330
0.338
0.352
0.345
0.347
0.367
0.364
0.352
0.338
0.364
0.360
0.297
0.312
0.347
0.330
0.284
0.297
0.330
0.310
0.330
0.347
0.371
0.352
0.310
0.330
0.342
0.344
0.352
0.371
0.401
0.380
0.344
0.342
0.380
0.357
P
Q
R
S
2
1
2
1
2
1
2
56
71
71
3L
3K
4L
4K
5L
5K
6L
6K
7L
7K
8L
8K
90
90
112
140
180
224
280
112
140
180
224
Note:
Luminous intensity is tested at a current pulse duration of 25 ms
and an accuracy of 11 %.
The above type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In
order to ensure availability, single brightness groups will not be or-
derable.
In a similar manner for colors where wavelength groups are mea-
sured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
Crossing Table
Vishay
Osram
VLMW3100
VLMW3101
VLMW3102
LWT673Q2S2
LWT673R1S1
LWT673S1T1
Note: Chromaticity coordinate groups are tested at a current pulse
duration of 25 ms and a tolerance of 0.01.
www.vishay.com
Document Number 81212
Rev. 1.0, 04-Jan-06
2
VLMW310.
Vishay Semiconductors
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
1
10
100
16191
T
amb
16194
I - Forward Current (mA)
F
Figure 1. Power Dissipation vs. Ambient Temperature
Figure 4. Relative Luminous Intensity vs. Forward Current
100
25
20
15
10
5
10
1
2.0
0
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
2.5
3.0
V - Forward Voltage (V)
F
3.5
4.0
4.5
5.0
16195
16192
T
amb
Figure 2. Forward Current vs. Ambient Temperature for AlInGaP
Figure 5. Forward Current vs. Forward Voltage
30
100
I
II
MTTF, confidence level 60 %
failure criteria I /I = 50 %
5000 h
V
V0
90
80
70
60
50
40
30
20
10
0
10000 h
25
20
15
10
5
I
II
0
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
400 450 500 550 600 650 700 750 800
16193
T
amb
16196
λ
- Wavelength (nm)
Figure 6. Relative Intensity vs. Wavelength
Figure 3. Forward Current vs. Ambient Temperature for AlInGaP
Document Number 81212
Rev. 1.0, 04-Jan-06
www.vishay.com
3
VLMW310.
Vishay Semiconductors
0°
10°
20°
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
30°
40°
1.0
0.9
50°
60°
0.8
70°
80°
0.7
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
0.6
0.6 0.4 0.2
0
0.2
0.4
T
amb
16197
95 10319
Figure 7. Rel. Luminous Intensity vs. Ambient Temperature
Figure 10. Rel. Luminous Intensity vs. Angular Displacement
0.400
0.345
White
New color grouping white
8L
0.340
X
8K
0.350
7L
0.335
0.330
7K
6L
6K
0.300
5L
5K
Y
0.325
4L
4K
0.250
3L
3K
0.320
0.315
0.200
0
10
20
30
40
50
60
0.250 0.270 0.290 0.310 0.330 0.350 0.370
16198
I
- Forward Current (mA)
F
19784
X-par
Figure 8. Chromaticity Coordinate Shift vs. Forward Current
Figure 11. Coordinates of Colorgroups
3.95
3.90
3.85
3.80
3.75
3.70
3.65
3.60
3.55
3.50
3.45
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
16199
T
amb
Figure 9. Forward Voltage vs. Ambient Temperature
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4
Document Number 81212
Rev. 1.0, 04-Jan-06
VLMW310.
Vishay Semiconductors
Package Dimensions in mm
3.5 0.2
technical drawings
according to DIN
specifications
Mounting Pad Layout
Pin identification
1.2
area covered with
solder resist
C
A
4
1.6 (1.9)
Ø
2.4
Dimensions: IR Reflow and Vaporphase
(Wave Soldering)
+ 0.15
3
Drawing-No. : 6.541-5025.01-4
Issue: 8; 22.11.05
95 11314-1
Method of Taping / Polarity and Tape and Reel
SMD LED (VLM.3 - series)
Reel Package dimension in mm for SMD
LEDs, tape option GS08 (= 1500 pcs.)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN
IEC 40 (CO) 564) for automatic component inserta-
tion. The blister tape is a plastic strip with impressed
component cavaties, covered by a top tape.
10.0
9.0
120°
4.5
3.5
13.00
12.75
2.5
1.5
63.5
60.5
Identification
Label:
Vishay
Adhesive Tape
Type
Group
Tape Code
Production
Code
14.4 max.
180
178
Blister Tape
Quantity
94 8665
Figure 13. Reel dimensions - GS08
94 8670
Component Cavity
Reel Package dimension in mm for SMD
LEDs, tape option GS18 (= 8000 pcs.)
prefered
Taping of VLM.3...
3.5
3.1
2.2
2.0
10.4
8.4
Anode
120°
4.5
3.5
5.75
5.25
4.0
3.6
13.00
12.75
2.5
1.5
62.5
60.0
8.3
7.7
3.6
3.4
Identification
Label:
Vishay
Type
Group
1.85
Tape Code
Production
Code
1.65
14.4 max.
0.25
321
329
1.6
1.4
4.1
3.9
4.1
3.9
Quantity
18857
2.05
1.95
94 8668
Figure 14. Reel dimensions - GS18
Figure 12. Tape dimensions in mm for PLCC-2
Document Number 81212
Rev. 1.0, 04-Jan-06
www.vishay.com
5
VLMW310.
Vishay Semiconductors
Barcode-Product-Label
Soldering Profile
IR Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
200
150
100
50
106
max. 260 °C
245 °C
225555°C
240 °C
217 °C
A
H
VISHAY
max. 30 s
max. 100 s
37
max. 120 s
B
19797
C
D
E
F
G
max. Ramp Down 6 °C/s
max. Ramp Up 3 °C/s
0
0
50
100
150
200
250
300
Time (s)
max. 2 cycles allowed
19885
A) Type of component
Figure 15. Vishay Leadfree Reflow Soldering Profile
(acc. to J-STD-020B)
B) Manufacturing Plant
C) SEL - Selection Code (Bin):
948626-1
TTW Soldering (acc. to CECC00802)
300
250
5 s
Lead Temperature
e.g.: R1 = Code for Luminous Intensity Group
5L = Code for Chromaticity Coordinate Group
second
235°...260 °C
first wave
full line: typical
dotted line: process limits
wave
200
150
100
ca. 2 K/s
D) Date Code year/week
E) Day Code (e. g. 1: Monday)
F) Batch No.
ca. 200 K/s
100°...130 °C
ca. 5 K/s
2 K/s
forced cooling
50
0
0
100
Time (s)
250
50
150
200
G) Total quantity
Figure 16. Double wave soldering of opto devices (all packages)
H) Company Code
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6
Document Number 81212
Rev. 1.0, 04-Jan-06
VLMW310.
Vishay Semiconductors
Dry Packing
L
E V E L
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
Aluminium bag
a)
b)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
2a or 2b is not met.
4. If baking is required, devices may be baked for:
Label
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
or
96 hours at 60 5oCand <5%RH
24 hours at 100 5°C
For all device containers
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Reel
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 Level 2a label
15973
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping pur-
poses.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconduc-
tors specific data.
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH
(dry air/ nitrogen) or
96 hours at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 hours at 100 °C + 5 °C not suitable for reel
or tubes.
An EIA JEDEC Standard JESD22-A112 Level 2a
label is included on all dry bags.
Document Number 81212
Rev. 1.0, 04-Jan-06
www.vishay.com
7
VLMW310.
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
www.vishay.com
8
Document Number 81212
Rev. 1.0, 04-Jan-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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