VLMY3214-GS18 [VISHAY]
Visible LED, Clear,;
| 型号： | VLMY3214-GS18 |
| 厂家： | 
VISHAY |
| 描述： | Visible LED, Clear, |
| 文件： | 总12页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VLMY3214
Vishay Semiconductors
Power SMD LED in PLCC-4 Package
FEATURES
• Utilizing AlInGaP technology (OMA*)
• Angle of half intensity ϕ = 60°
• Available in 8 mm tape
e3
• Luminous intensity and color categorized
per packing unit
• Luminous intensity ratio per packing unit
I
/I
≤ 1.6
Vmax Vmin
•
ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B
19210
• Suitable for all soldering methods according to
CECC
• Preconditioning: acc. to JEDEC Level 2a
• Automotive qualified
• Lead (Pb)-free device - RoHS compliant
* Omnidirectional Mirror Adhesion
DESCRIPTION
APPLICATIONS
The VLMY3214 is an advanced development in terms
of heat dissipation.
• Traffic Signals and Signs
• Interior and exterior lighting
• Dashboard illumination
• Indicator and backlighting purposes for audio,
video, LCDs, switches, symbols, illuminated adver-
tising etc.
The leadframe profile of this PLCC-4 SMD package is
optimized to reduce the thermal resistance.
This allows higher drive current and doubles the light
output compared to Vishay’s high intensity SMD LED
in PLCC-2 package.
PARTS TABLE
PART
COLOR, LUMINOUS INTENSITY
Yellow, IV = (900 to 1800) mcd
DOMINANT WAVELENGTH
VLMY3214-GS18
589 nm to 594 nm
Document Number 81266
Rev. 1.0, 02-Mar-06
www.vishay.com
1
VLMY3214
Vishay Semiconductor
1)
ABSOLUTE MAXIMUM RATINGS VLMY3214
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Reverse voltage2)
Forward current
VR
5
V
IF
Ptot
Tj
70
210
mA
mW
°C
Power dissipation
Junction temperature
125
Operating temperature range
Storage temperature range
Tamb
Tstg
RthJA
- 40 to + 100
- 40 to + 100
290
°C
°C
Thermal resistance junction/
ambient
mounted on PC board FR4
optional paddesign (see page 7)
K/W
mounted on PC board FR4
RthJA
270
K/W
recommended paddesign (see page 6)
Note:
1)
T
= 25 °C, unless otherwise specified
amb
2) Driving the LED in reverse direction is suitable for short term application
1)
OPTICAL AND ELECTRICAL CHARACTERISTICS , YELLOW, VLMY3214
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN
TYP.
MAX
UNIT
Luminous intensity
IF = 50 mA
VLMY3214
IV
900
1800
mcd
Luminous flux/Luminous
intensity
φV/IV
3
mlm/mcd
Dominant wavelength
Peak wavelength
IF = 50 mA
IF = 50 mA
IF = 50 mA
λd
λp
Δλ
589
594
nm
nm
nm
593
15
Spectral bandwidth
at 50 % Irel max
Angle of half intensity
Forward voltage
IF = 50 mA
IF = 50 mA
ϕ
60
2.1
deg
V
VF
VR
1.85
3.0
10
Reverse current
V
R = 5 V
0.01
μA
Note:
1)
T
= 25 °C, unless otherwise specified
amb
LUMINOUS INTENSITY CLASSIFICATION
COLOR CLASSIFICATION
GROUP
LIGHT INTENSITY [MCD]
GROUP
YELLOW
STANDARD
OPTIONAL
MIN
MAX
DOM. WAVELENGTH (NM)
MIN.
589
591
MAX.
592
1
2
1
2
V
5
6
900
1120
1400
1120
1400
1800
594
AA
Note:
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of 1 nm.
Luminous intensity is tested at a current pulse duration of 25 ms
and an accuracy of 11 %.
The above type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel).
In order to ensure availability, single brightness groups will not be
orderable.
In a similar manner for colors where wavelength groups are mea-
sured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
www.vishay.com
2
Document Number 81266
Rev. 1.0, 02-Mar-06
VLMY3214
Vishay Semiconductors
TYPICAL CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
250
200
150
100
50
100
90
30 mA
50 mA
Yellow
80
70
270 K/W
60
R
thJA
= 290 K/W
50
40
30
20
10
0
10 mA
0
- 50
- 100
- 150
- 200
- 50 - 25
0
25
50
75
100
0
25
50
75
100
125
17015
T
amb
- Ambient Temperature (°C)
T
amb
- Ambient Temperature (°C)
18568
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Change of Forward Voltage vs. Ambient Temperature
0°
10°
20°
2.5
30°
40°
Yellow
2.0
1.0
0.9
1.5
1.0
0.5
0.0
50°
60°
0.8
70°
0.7
80°
0.6
0.6
0.4
0.2
0
0.2
0.4
- 50 - 25
0
25
50
75
100
17016
T
amb
- Ambient Temperature (°C)
95 10319
Figure 2. Rel. Luminous Intensity vs. Angular Displacement
Figure 5. Relative Luminous Intensity vs. Amb. Temperature
6
1.2
Yellow
Yellow
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
4
2
0
- 2
- 4
- 6
- 50 - 25
T
0
25
50
75
100
540 550 560 570 580 590 600 610 620 630 640
λ - Wavelength (nm)
- Ambient Temperature (°C)
16008
amb
17017
Figure 3. Relative Intensity vs. Wavelength
Figure 6. Change of Dominant Wavelength vs. Ambient
Temperature
Document Number 81266
Rev. 1.0, 02-Mar-06
www.vishay.com
3
VLMY3214
Vishay Semiconductor
0.12
0.10
0.08
0.06
0.04
0.02
0.00
10.00
Yellow
1.00
0.10
0.01
t /T = 0.005
p
0.05
0.5
-5
-4
-3
-2
-1
0
1
2
10
10
10
10
10
10
10
10
1.00
10.00
- Forward Current (mA)
100.00
17044
t
p
- Pulse Length (s)
I
F
17018
Figure 7. Relative Luminous Intensity vs. Forward Current
Figure 10. Forward Current vs. Pulse Length
1.5
Yellow
1.0
0.5
0.0
- 0.5
- 1.0
- 1.5
10 20 30 40 50 60 70 80 90 100
I
F
- Forward Current (mA)
17019
Figure 8. Change of Dominant Wavelength vs. Forward Current
100
90
80
70
Yellow
60
50
40
30
20
10
0
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5
19651
V - Forward Voltage (V)
F
Figure 9. Forward Current vs. Forward Voltage
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4
Document Number 81266
Rev. 1.0, 02-Mar-06
VLMY3214
Vishay Semiconductors
TAPING
3.5
3.1
2.2
2.0
Anode
Cathode
4.0
3.6
5.75
5.25
8.3
7.7
3.6
3.4
Cathode
1.85
1.65
4.1
3.9
4.1
3.9
1.6
1.4
0.25
2.05
1.95
18596
Tape Dimensions in mm
Document Number 81266
Rev. 1.0, 02-Mar-06
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5
VLMY3214
Vishay Semiconductor
RECOMMENDED PAD DESIGN
(WAVE-SOLDERING), R
= 270 K/W
THJA
16260
RECOMMENDED PAD DESIGN
(REFLOW-SOLDERING), R
= 270 K/W
THJA
16261
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6
Document Number 81266
Rev. 1.0, 02-Mar-06
VLMY3214
Vishay Semiconductors
OPTIONAL PAD DESIGN
(WAVE-SOLDERING), R
= 290 K/W
THJA
16262
OPTIONAL PAD DESIGN
(REFLOW-SOLDERING), R
= 290 K/W
THJA
16263
Document Number 81266
Rev. 1.0, 02-Mar-06
www.vishay.com
7
VLMY3214
Vishay Semiconductor
PACKAGE DIMENSIONS IN MM
Mounting Pad Layout
area covered with
solder resist
1.2
4
1.6 (1.9)
Dimensions: IR and Vaporphase
(Wave Soldering)
19993
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8
Document Number 81266
Rev. 1.0, 02-Mar-06
VLMY3214
Vishay Semiconductors
SOLDERING PROFILE
BARCODE-PRODUCT-LABEL
IR Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
200
150
100
50
max. 260 °C
245 °C
255
255 °C
240 °C
217 °C
106
A
H
VISHAY
max. 30 s
max. 100 s
37
max. 120 s
max. Ramp Down 6 °C/s
max. Ramp Up 3 °C/s
B
C
D
E
F
G
19891
0
0
50
100
150
200
250
300
Time (s)
A) Type of component
B) Manufacturing Plant
max. 2 cycles allowed
19885
C) SEL - Selection Code (Bin):
e.g.: P1 = Code for Luminous Intensity Group
= Code for Color Group
Vishay Leadfree Reflow Soldering Profile
(acc. to J-STD-020B)
2
D) Date Code year/week
E) Day Code (e.g. 1: Monday)
F) Batch No.
G) Total quantity
H) Company Code
948626-1
TTW Soldering (acc. to CECC00802)
300
250
5 s
Lead Temperature
second
235 °C...260 °C
full line: typical
dotted line: process limits
wave
first wave
200
150
100
ca. 2 K/s
ca. 200 K/s
100 °C...130 °C
ca. 5 K/s
2 K/s
50
0
forced cooling
0
100
Time (s)
250
50
150
200
Double wave soldering of opto devices (all packages)
Document Number 81266
Rev. 1.0, 02-Mar-06
www.vishay.com
9
VLMY3214
Vishay Semiconductors
DRY PACKING
L
E V E L
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation
and storage.
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
Aluminium bag
3. Devices require baking before mounting if:
a)
b)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
2a or 2b is not met.
Label
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
or
96 hours at 60 5oCand <5%RH
24 hours at 100 5°C
For all device containers
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Reel
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
15973
Example of JESD22-A112 Level 2a label
ESD PRECAUTION
Proper storage and handling procedures should be fol-
lowed to prevent ESD damage to the devices especially
when they are removed from the Antistatic Shielding
Bag. Electro-Static Sensitive Devices war-ning labels
are on the packaging.
FINAL PACKING
The sealed reel is packed into a cardboard box. A sec-
ondary cardboard box is used for shipping purposes.
VISHAY SEMICONDUCTORS STANDARD
BAR-CODE LABELS
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the alumin-
ium bag has been opened to prevent moisture absorp-
tion. The following conditions should be observed, if dry
boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 hours under these conditions mois-
ture content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/
nitrogen) or
96 hours at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 hours at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC Standard JESD22-A112 Level 2a label
is included on all dry bags.
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10
Document Number 81266
Rev. 1.0, 02-Mar-06
VLMY3214
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81266
Rev. 1.0, 02-Mar-06
www.vishay.com
11
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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