AMDIP2004L167B1U [WALSIN]
Low Profile Thickness;型号: | AMDIP2004L167B1U |
厂家: | Walsin Technology |
描述: | Low Profile Thickness |
文件: | 总6页 (文件大小:585K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Approval sheet
AMDIP Series – 2012(0805)- RoHS Compliance
MULTILAYER CERAMIC DIPLEXER
Halogens Free Product
2.4 GHz & 5 GHz ISM Band RF Application
Automotive
Qualified to AEC-Q200
Preliminary
P/N: AMDIP2004L167B1U
*Contents in this sheet are subject to change without prior notice.
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ASC_AMDIP2004L167B1U_V01
Jan.2017
Approval sheet
FEATURES
1.
2.
3.
4.
5.
6.
7.
Miniature footprint: 2.0 X 1.25 X 0.4 mm3.
LTCC Process
Low Profile Thickness
Low Insertion Loss
High Rejection
RoHS Compliance
Halogens Free Product
APPLICATIONS
1. 2400 ~ 2500 MHz and 4900 ~ 5950 MHz working frequency
CONSTRUCTION
Top view
P6
P5
P4
1
PIN
1
Connection
GND
PIN
4
Connection
Lower Freq. Port
GND
Common(ANT) Port
GND
2
5
Higher Freq. Port
3
6
P1
P2
P3
DIMENSIONS
Figure
Symbol
Dimension (mm)
2.00 ± 0.15
1.25 ± 0.15
0.40 ± 0.10
0.20 ± 0.15
0.30 ± 0.15
0.35 ± 0.15
0.65 ± 0.15
L
W
T
A
B
C
D
E
Bottom view
Side view
Top view
0.20 ± 0.15
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Approval sheet
ELECTRICAL CHARACTERISTICS
Specification
AMDIP2004L167B1U
Frequency range
2400 ~ 2500 MHz
4900 ~ 5950 MHz
0.65 dB max. at +25C
0.95 dB max. at -55C ~ +125C
1.2 dB max. at +25C
Insertion Loss
1.5 dB max. at -55C ~ +125C
20 dB min. @ 824 ~ 915 MHz
20 dB min. @ 1800 ~ 2500 MHz
10 dB min. @ 3000 ~ 3900 MHz
20 dB min. @ 9800 ~ 11900 MHz
18 dB min. @ 14700 ~ 17850 MHz
10 dB min. @ 3600 MHz
20 dB min. @ 4800 ~ 5000 MHz
20 dB min. @ 7200 ~ 7500 MHz
Attenuation
20 dB min. @ DC ~ 2500 MHz
20 dB min. @ 4900 ~ 5950 MHz
Isolation
VSWR
2.0 max.
Impedance
50Ω
Moisture sensitivity levels
LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)
Operating & Storage Condition (Component)
Operation Temperature Range: -55C ~ +125C
Storage Temperature Range: -55C ~ +125C
Storage Condition before Soldering (Included packaging material)
Storage Temperature Range: +5 ~ +40 ℃
Humidity: 30 to 70% relative humidity
Typical Electrical Chart
SOLDER LAND PATTERN
Figure
Unit: mm
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
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ASC_AMDIP2004L167B1U_V01
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Approval sheet
RELIABILITY TEST
TEST
PROCEDURE / TEST METHOD
REQUIREMENT
Resistance to soldering heat
(R.S.H)
MIL-STD-202
Un-mounted chips completely immersed No mechanical damage.
for 10±1second in a SAC solder bath at
270℃±5ºC
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
method 210
Loss of metallization on the edges of each
electrode shall not exceed 25
Solderability
J-STD-002
95% coverage min., good tinning and no
visible damage
a)4hrs / 155℃*dry then solder dipping 235
℃/5sec
b)Steam 8 hrs then 215℃ / 5sec solder
dipping
c)Steam 8 hrs then 260℃ / 7sec solder
dipping
Temperature cycling
JESD22
method JA-104
No mechanical damage.
1000 cycles, -55℃ ~ +125℃, dwell time
30min
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
Humidity
MIL-STD-202
method 103
No mechanical damage.
1000+48/-0 hours; 85C, 85% RH
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
High Temperature Exposure
MIL-STD-202
method 108
1000+48/-0 hours; without load in a
No mechanical damage.
temperature chamber controlled 125±3°C Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
Mechanical Shock
MIL-STD-202
method 213
1/2 Sine Pulse / 100g Peak / Velocity
12.3ft/sec
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
Board Flex
RF component mounted on a 90mm glass No mechanical damage.
epoxy resin PCB(FR4), bending once
2mm for 60sec
Electrical specification shall satisfy the
AEC-Q200-005
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
Terminal strength
AEC-Q200-006
Pressurizing force: 1.8Kg, Test time:
60±1sec.
No remarkable damage or removal of the
terminations
Only 0402 for 1.0kg/60sec
Vibration
MIL-STD-202
method 204
Test 5g’s for 20min., 12 cycles each of 3 No mechanical damage.
orientations Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
ESD
AEC-Q200-002
Test contact 1.0KV ( 0.5KV for 1005 only) No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -55 ~
125°C.
Page 4 of 6
ASC_AMDIP2004L167B1U_V01
Jan.2017
Approval sheet
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
AM
DIP
20
Dimension code
Per 2 digits of Length, Width,:
e.g. :
04
L
Application
L :
167B1U
Specification
Design code
Walsin
Automotive
Product
Code
Dimension code
04=
device
DIP : Diplexer
Thickness 04
2.4GHz/5GHz
20 =
Length 20,
Width 12,
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
Plastic Tape specifications (unit :mm)
Index
Ao
Bo
T
W
D
Dimension (mm)
Index
1.40 0.10
E
2.25 0.10
F
1.55 0.05
Po
0.75 0.10
P1
8.0 0.10
P2
Dimension (mm)
1.75 0.10
3.50 0.05
4.00 0.10
4.00 0.10
2.00 0.05
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ASC_AMDIP2004L167B1U_V01
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Approval sheet
Reel dimensions
B
A
C
Index
A
B
C
Φ178.0
Φ60.0
Φ13.0
Dimension (mm)
Taping Quantity:2000 pieces per 7” reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection.
(2) Storage environment condition.
Products should be storage in the warehouse on the following conditions.
Temperature
Humidity
: +5 to +40℃
: 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
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ASC_AMDIP2004L167B1U_V01
Jan.2017
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