AMDIP2012050LP7B1U [WALSIN]

Low Profile Thickness;
AMDIP2012050LP7B1U
型号: AMDIP2012050LP7B1U
厂家: Walsin Technology    Walsin Technology
描述:

Low Profile Thickness

文件: 总6页 (文件大小:579K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Approval sheet  
AMDIP Series – 2012(0805)- RoHS Compliance  
MULTILAYER CERAMIC DIPLEXER  
Halogens Free Product  
2.4 GHz & 5 GHz ISM Band Working Frequency  
Automotive  
P/N: AMDIP2012050LP7B1U  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  
Approval sheet  
FEATURES  
1.  
2.  
3.  
4.  
5.  
Miniature footprint: 2.0 X 1.2 X 0.55 mm3.  
Low Profile Thickness  
Low insertion loss  
High attenuation on 2nd harmonic suppressed  
LTCC process  
APPLICATIONS  
1.  
Dual-band / Dual-mode.2.4 GHz/ 5 GHz WLAN  
CONSTRUCTION  
Top view  
P6  
P5  
P4  
PIN  
1
Connection  
GND  
PIN  
4
Connection  
Higher Freq. Port  
GND  
2
Common Port  
GND  
5
3
6
Lower Freq. Port  
P1  
P2  
P3  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
2.00 ± 0.10  
1.25 ± 0.10  
0.55 ± 0.15  
0.20 ± 0.15  
0.30 ± 0.15  
0.35 ± 0.15  
0.65 ± 0.15  
0.20 ± 0.10  
L
W
T
Top view  
Side view  
A
B
C
D
E
Bottom view  
Side view  
Page 2 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  
Approval sheet  
ELECTRICAL CHARACTERISTICS  
Specification  
AMDIP2012050LP7B1U  
Frequency range  
2400~2500 MHz  
0.5 dB max. at 25 °C  
4900~5950 MHz  
0.8 dB max. at 25 °C  
Insertion Loss  
0.9 dB max. at -55~+125 °C  
1.2 dB max. at -55~+125 °C  
25 dB @ 800~2500 MHz  
15 dB @ 9800~11900 MHz  
23 dB @ 4800~6000 MHz  
20 dB @ 7200~7500 MHz  
Attenuation (min.)  
Isolation  
28dB min.  
Impedance  
50  
Return Loss  
12dB  
Operation Temperature Range  
MSL  
-55oC ~ +125 oC  
MSL is LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)  
Typical Electrical Chart  
SOLDER LAND PATTERN  
Figure  
Unit: mm  
Line width to de designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.  
Page 3 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  
Approval sheet  
RELIABILITY TEST  
TEST  
PROCEDURE / TEST METHOD  
REQUIREMENT  
Resistance to soldering heat  
(R.S.H)  
MIL-STD-202  
Un-mounted chips completely immersed No mechanical damage.  
for 10±1second in a SAC solder bath at  
270±5ºC  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
method 210  
Loss of metallization on the edges of each  
electrode shall not exceed 25  
Solderability  
J-STD-002  
95% coverage min., good tinning and no  
visible damage  
a)4hrs / 155*dry then solder dipping 235  
/5sec  
b)Steam 8 hrs then 215/ 5sec solder  
dipping  
c)Steam 8 hrs then 260/ 7sec solder  
dipping  
Temperature cycling  
JESD22  
method JA-104  
No mechanical damage.  
1000 cycles, -55~ +125, dwell time  
30min  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
Humidity  
No mechanical damage.  
1000+48/-0 hours; 85°C, 85% RH  
MIL-STD-202  
method 103  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
High Temperature Exposure  
MIL-STD-202  
method 108  
1000+48/-0 hours; without load in a  
No mechanical damage.  
temperature chamber controlled 125±3°C Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
Mechanical Shock  
MIL-STD-202  
method 213  
1/2 Sine Pulse / 100g Peak / Velocity  
12.3ft/sec  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
Board Flex  
RF component mounted on a 90mm glass No mechanical damage.  
epoxy resin PCB(FR4), bending once  
2mm for 60sec  
Electrical specification shall satisfy the  
AEC-Q200-005  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
Terminal strength  
AEC-Q200-006  
Pressurizing force: 1.8Kg, Test time:  
60±1sec.  
No remarkable damage or removal of the  
terminations  
Only 0402 for 1.0kg/60sec  
Vibration  
MIL-STD-202  
method 204  
Test 5g’s for 20min., 12 cycles each of 3 No mechanical damage.  
orientations Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
ESD  
AEC-Q200-002  
Test contact 1.0KV ( 0.5KV for 1005 only) No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -55 ~  
125°C.  
Page 4 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  
Approval sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
AM  
DIP  
201205  
0
L
P7B1U  
Specification  
Design code  
Walsin  
Product  
Code  
Dimension code  
Unit of dimension  
0 : 0.1 mm  
Application  
L :2.4GHz/5GHz  
Automotive  
device  
Per 2 digits of Length, Width,  
Thickness :  
DIP : Diplexer  
1 : 1.0 mm  
e.g. :  
201205 =  
Length 20,  
Width 12,  
Thickness 05  
Minimum Ordering Quantity: 2000 pcs per reel.  
PACKAGING  
Plastic Tape specifications (unit :mm)  
Index  
Ao  
Bo  
T
W
ΦD  
Dimension (mm)  
Index  
1.40 ± 0.10  
E
2.25 ± 0.10  
F
1.55 ± 0.05  
Po  
0.75 ± 0.10  
P1  
8.0 ± 0.10  
P2  
Dimension (mm)  
1.75 ± 0.10  
3.50 ± 0.05  
4.00 ± 0.10  
4.00 ± 0.10  
2.00 ± 0.05  
Page 5 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  
Approval sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Φ178.0  
Φ60.0  
Φ13.0  
Dimension (mm)  
Taping Quantity:2000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage environment condition.  
¢
¢
¢
¢
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
¢
¢
¢
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 6 of 6  
ASC_AMDIP2012050LP7B1U_V01  
Mar.2015  

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