RFBPB2520120A4T [WALSIN]
2.4 GHz ISM Band Working Frequency;型号: | RFBPB2520120A4T |
厂家: | Walsin Technology |
描述: | 2.4 GHz ISM Band Working Frequency ISM频段 |
文件: | 总8页 (文件大小:386K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Approval sheet
RFBPB 2520(1008) Series – RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
- Balanced Type
Halogens Free Product
2.4 GHz ISM Band Working Frequency
P/N: RFBPB2520120A4T
*Contents in this sheet are subject to change without prior notice.
Page 1 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
FEATURES
1.
2.
3.
4.
Miniature footprint: 2.5 X 2.0 X 1.2 mm3
Low Profile Thickness
Allowable for DC biasing.
LTCC process
APPLICATIONS
1.
2.
2.4GHz ISM band RF applications
Bluetooth, Wireless LAN 802.11b/g, HomeRF
CONSTRUCTION
Input
Ground
DC/GND
Output
Output
Fig 1. Outline of 2.4GHz Balanced Band Pass Filter 2520 size
DIMENSIONS
Figure
Symbol
Dimension (mm)
L
2.50 ± 0.20
L
W
T
2.00 ± 0.20
Max 1.20
a
d
W
P
a
b
c
0.30 ± 0.10
0.25 ± 0.10
1.83 ± 0.10
b
c
d
0.40 ± 0.10
0.80 ± 0.20
T
P
Page 2 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
ELECTRICAL CHARACTERISTICS
RFBPB2520120A4T
Frequency range
Specification
2450 ± 50 MHz
4.5 dB max
Insertion Loss
Return Loss
-8.0 dB max
50 Ω
Impedance (Unbalanced)
Impedance ( Balanced )
Phase Difference
Match to BC series of Bluetooth chipset
180∘± 15∘
Amplitude Difference
1.8dB Max
45dB @ 900MHz
30dB @ 1900MHz
25dB @ 2170MHz
30dB @ 4800MHz
Attenuation ( min.)
Typical Electrical Chart
Page 3 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
SOLDER LAND PATTERN
Figure
Symbol
L1
Dimension (mm)
2.540 ± 0.20
0.558 ± 0.05
1.320 ± 0.05
0.508 ± 0.20
0.305 ± 0.10
0.762 ± 0.10
2.032 ± 0.10
0.279 ± 0.05
0.508 ± 0.10
0.406 ± 0.05
0.508 ± 0.05
0.356 ± 0.05
0.508 ± 0.10
0.50 ± 0.10
L2
L3
W1
W2
W3
W4
S1
S2
S3
S4
S5
Line width to be design to match 50Ω characteristic impedance, depending
on PCB material and thickness
S6
.
Φ
Φ are the grounding through holes.
Page 4 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
RELIABILITY TEST
Test condition / Test method
Test item
Specification
Solderability
JIS C 0050-4.6
*Solder bath temperature:235 ± 5°C
*Immersion time:2 ± 0.5 sec
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
JESD22-B102D
*Solder:Sn3Ag0.5Cu for lead-free
Leaching
*Solder bath temperature:260 ± 5°C
*Leaching immersion time:30 ± 0.5 sec
*Solder : SN63A
Loss of metallization on the edges of each
electrode shall not exceed 25%.
(Resistance to dissolution
of metallization)
IEC 60068-2-58
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature:120~150℃,
1 minute.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Solder temperature:270±5°C
*Immersion time:10±1 sec
Loss of metallization on the edges of each
electrode shall not exceed 25%.
*Solder:Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
Drop Test
JIS C 0044
*Height:75 cm
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test Surface:Rigid surface of concrete
or steel.
*Times:6 surfaces for each units;2
times for each side.
Adhesive Strength
of Termination
*Pressurizing force:
No remarkable damage or removal of the
termination.
5N(≦0603);10N(>0603)
JIS C 0051- 7.4.3
*Test time:10±1 sec
Bending test
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
JIS C 0051- 7.4.1
Measurement to be made after keeping at
room temperature for 24±2 hours
Page 5 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
Temperature cycle
1. 30±3 minutes at -40°C±3°C,
2. 10~15 minutes at room temperature,
3. 30±3 minutes at +85°C±3°C,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
JIS C 0025
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
Vibration
*Frequency:10Hz~55Hz~10Hz(1min)
*Total amplitude:1.5mm
No mechanical damage.
Samples shall satisfy electrical specification
after test.
JIS C 0040
*Test times:6hrs.(Two hrs each in three
mutually perpendicular directions)
High temperature
JIS C 0021
*Temperature:85°C±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Humidity
*Humidity:90% to 95% R.H.
*Temperature:40±2°C
*Time:1000+24/-0 hrs.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
(steady conditions)
JIS C 0022
Measurement to be made after keeping at
room temperature for 24±2 hrs
※500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature:-40°C±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Page 6 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
BPB
Product Code
BPB :
252012
0
A
4
T
Walsin
Dimension code
Unit of
dimension
Application
Specification
Design Code
Packing
T : Reeled
RF
Per 2 digits of
Length, Width,
Thickness :
A : 2.4GHZ ISM
Band
device
0 : 0.1 mm
1 : 1.0 mm
Balanced
Type Band
Pass
e.g. :
252012 =
Length 25,
Filter
Width 20,
Thickness 12
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
Plastic Tape specifications (unit :mm)
Index
Ao
Bo
ΦD
T
W
Dimension (mm)
Index
2.27 ± 0.10
E
2.74 ± 0.10
F
1.55 ± 0.05
1.18 ± 0.10
P1
1.00 ± 0.10
P2
Po
Dimension (mm)
1.75 ± 0.10
3.50 ± 0.10
4.00 ± 0..20
4.00 ± 0.10
2.00 ± 0.10
Page 7 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
Approval sheet
Reel dimensions
B
A
C
Index
A
B
C
Dimension (mm)
Φ178
Φ60.0
Φ13.5
Typing Quantity: 2000 pieces per 7" reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be
confirmed.
(2) Storage environment condition.
ꢀ
ꢀ
ꢀ
ꢀ
Products should be storage in the warehouse on the following conditions.
Temperature
Humidity
: -10 to +40℃
: 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
ꢀ
ꢀ
ꢀ
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
Page 8 of 8
ASC_RFBPB2520120A4T_V05
Nov. 2011
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