RFBPB2520121A2T [WALSIN]
2.4 GHz ISM Band Working Frequency;型号: | RFBPB2520121A2T |
厂家: | Walsin Technology |
描述: | 2.4 GHz ISM Band Working Frequency ISM频段 |
文件: | 总7页 (文件大小:258K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Approval sheet
RFBPB 2520(1008) Series – RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
- Balanced Type
Halogens Free Product
2.4 GHz ISM Band Working Frequency
P/N: RFBPB2520120A2T
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
FEATURES
1.
2.
3.
4.
5.
6.
7.
Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology
Reflow solderable
Low Insertion loss
Allowable for DC biasing
High attenuation on 2nd harmonic
Miniature footprint: 2.5 X 2.0 X 1.2 mm3
Suitable for 2.45 GHz Working Frequency Operation
APPLICATIONS
1.
2.
2.4GHz ISM Band RF Application
Bluetooth, Wireless LAN, HomeRF
CONSTRUCTION
PIN
P1
Definition
PIN
P5
Definition
Balance Port
NC or GND
Balance Port
GND
7
6
NC or GND
5
8
P2 Unbalance Port P6
P3
P4
NC or DC
GND
P7
P8
4
1
2
3
Fig 1. Outline of 2.4GHz Balanced Band Pass Filter
DESCRIPTION
Walsin Technology Corporation develops a new ceramic Balanced Type Band Pass Filter specified for 2.4 GHz ISM Band
application, as shown in fig-1. Both of Wireless LAN IEEE 802.11b/g/n, and BluetoothTM typically located on this unlicensed
frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements,
this Balanced Type Band Pass Filter has been designed to a high suppression on 2nd harmonic as well as low insertion loss
characteristics through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product
design via 3D EM Simulation Skill.
This Balanced Type Band Pass Filter has a rectangular ceramic body with a tiny dimension of 2.5 x 2.0 x 1.2 mm3 future
meet the SMT automation and miniaturization requirements on modern portable devices.
DIMENSIONS
Figure
Symbol
Dimension (mm)
L
W
T
2.50+0.2 /- 0.10
2.00+0.2/ - 0.10
1.20 +0.1/ -0.20
0.30 ± 0.10
W
T
d
a
P
L
A
B
C
D
P
0.30 ± 0.10
1.00 ± 0.10
C
0.30 ± 0.20
0.80 ± 0.20
Page 2 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
ELECTRICAL CHARACTERISTICS
RFBPB2520120A2T
Frequency range (MHz)
Insertion Loss (dB)
Specification
2450 ± 50
2.2 max
VSWR
2.0 max
Impedance (Unbalanced)
Impedance (Balanced)
Phase Difference
50 Ω
100 Ω
180° ± 10°
1.4 dB max
25 @ 900MHz
25 @ 1900 MHz
30 @ 4800 MHz
Amplitude Difference
Attenuation (dB min.)
15 @ 7200 MHz (reference)
Typical Electrical Chart
Phase imbalance
:
Amplitude imbalance
:
SOLDER LAND PATTERN (unit in mm)
Land Pad Design (mm)
(1). Line width to be design to match 50Ω characteristic impedance, depending on PCB material and thickness
(2). Φ are the grounding through holes.
.
Page 3 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
RELIABILITY TEST
Test condition / Test method
Test item
Specification
Solderability
JIS C 0050-4.6
*Solder bath temperature:235 ± 5°C
*Immersion time:2 ± 0.5 sec
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
JESD22-B102D
*Solder:Sn3Ag0.5Cu for lead-free
Leaching
*Solder bath temperature:260 ± 5°C
*Leaching immersion time:30 ± 0.5 sec
*Solder : SN63A
Loss of metallization on the edges of each
electrode shall not exceed 25%.
(Resistance to dissolution
of metallization)
IEC 60068-2-58
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature:120~150℃,
1 minute.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Solder temperature:270±5°C
*Immersion time:10±1 sec
Loss of metallization on the edges of each
electrode shall not exceed 25%.
*Solder:Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
Drop Test
JIS C 0044
*Height:75 cm
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test Surface:Rigid surface of concrete
or steel.
*Times:6 surfaces for each units;2
times for each side.
Adhesive Strength
of Termination
*Pressurizing force:
No remarkable damage or removal of the
termination.
5N(≦0603);10N(>0603)
JIS C 0051- 7.4.3
*Test time:10±1 sec
Bending test
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
JIS C 0051- 7.4.1
Measurement to be made after keeping at
room temperature for 24±2 hours
Page 4 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
Temperature cycle
1. 30±3 minutes at -40°C±3°C,
2. 10~15 minutes at room temperature,
3. 30±3 minutes at +85°C±3°C,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
JIS C 0025
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
Vibration
*Frequency:10Hz~55Hz~10Hz(1min)
*Total amplitude:1.5mm
No mechanical damage.
Samples shall satisfy electrical specification
after test.
JIS C 0040
*Test times:6hrs.(Two hrs each in three
mutually perpendicular directions)
High temperature
JIS C 0021
*Temperature:85°C±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Humidity
*Humidity:90% to 95% R.H.
*Temperature:40±2°C
*Time:1000+24/-0 hrs.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
(steady conditions)
JIS C 0022
Measurement to be made after keeping at
room temperature for 24±2 hrs
※500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature:-40°C±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Page 5 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
BPB
252012
0
A
2
T
Walsin
Product Code
BPB :
Dimension
code
Unit of
dimension
Application
Specification
Design Code
Packing
T : Reeled
RF Pb free
device
A : 2.4GHZ ISM
Band
Per 2 digits of
Length, Width,
Thickness :
0 : 0.1 mm
1 : 1.0 mm
Balanced Type
Band Pass Filter
e.g. :
252012 =
Length 25,
Width 20,
Thickness 12
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
P2
ΦD
P0
P1
E
F
W
B
0
T
A0
Plastic Tape specifications (unit :mm)
Index
Ao
Bo
ΦD
1.55 ± 0.05
Po
T
W
Dimension (mm)
Index
2.27 ± 0.10
E
2.74 ± 0.10
F
1.40 ± 0.10
P1
1.00 ± 0.10
P2
Dimension (mm)
1.75 ± 0.10
3.50 ± 0.10
4.00 ± 0..20
4.00 ± 0.10
2.00 ± 0.10
Page 6 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
Approval sheet
Reel dimensions
B
A
C
Index
A
B
C
Dimension (mm)
Φ178
Φ60.0
Φ13.5
Typing Quantity: 2000 pieces per 7" reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be
confirmed.
(2) Storage environment condition.
ꢀ
ꢀ
ꢀ
ꢀ
Products should be storage in the warehouse on the following conditions.
Temperature
Humidity
: -10 to +40℃
: 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
ꢀ
ꢀ
ꢀ
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
Page 7 of 7
ASC_RFBPB2520120A2T_V04
Nov. 2011
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