RFBPB2520121A2T [WALSIN]

2.4 GHz ISM Band Working Frequency;
RFBPB2520121A2T
型号: RFBPB2520121A2T
厂家: Walsin Technology    Walsin Technology
描述:

2.4 GHz ISM Band Working Frequency

ISM频段
文件: 总7页 (文件大小:258K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Approval sheet  
RFBPB 2520(1008) Series – RoHS Compliance  
MULTILAYER CERAMIC BAND PASS FILTER  
- Balanced Type  
Halogens Free Product  
2.4 GHz ISM Band Working Frequency  
P/N: RFBPB2520120A2T  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
FEATURES  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology  
Reflow solderable  
Low Insertion loss  
Allowable for DC biasing  
High attenuation on 2nd harmonic  
Miniature footprint: 2.5 X 2.0 X 1.2 mm3  
Suitable for 2.45 GHz Working Frequency Operation  
APPLICATIONS  
1.  
2.  
2.4GHz ISM Band RF Application  
Bluetooth, Wireless LAN, HomeRF  
CONSTRUCTION  
PIN  
P1  
Definition  
PIN  
P5  
Definition  
Balance Port  
NC or GND  
Balance Port  
GND  
7
6
NC or GND  
5
8
P2 Unbalance Port P6  
P3  
P4  
NC or DC  
GND  
P7  
P8  
4
1
2
3
Fig 1. Outline of 2.4GHz Balanced Band Pass Filter  
DESCRIPTION  
Walsin Technology Corporation develops a new ceramic Balanced Type Band Pass Filter specified for 2.4 GHz ISM Band  
application, as shown in fig-1. Both of Wireless LAN IEEE 802.11b/g/n, and BluetoothTM typically located on this unlicensed  
frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements,  
this Balanced Type Band Pass Filter has been designed to a high suppression on 2nd harmonic as well as low insertion loss  
characteristics through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product  
design via 3D EM Simulation Skill.  
This Balanced Type Band Pass Filter has a rectangular ceramic body with a tiny dimension of 2.5 x 2.0 x 1.2 mm3 future  
meet the SMT automation and miniaturization requirements on modern portable devices.  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
L
W
T
2.50+0.2 /- 0.10  
2.00+0.2/ - 0.10  
1.20 +0.1/ -0.20  
0.30 ± 0.10  
W
T
d
a
P
L
A
B
C
D
P
0.30 ± 0.10  
1.00 ± 0.10  
C
0.30 ± 0.20  
0.80 ± 0.20  
Page 2 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
ELECTRICAL CHARACTERISTICS  
RFBPB2520120A2T  
Frequency range (MHz)  
Insertion Loss (dB)  
Specification  
2450 ± 50  
2.2 max  
VSWR  
2.0 max  
Impedance (Unbalanced)  
Impedance (Balanced)  
Phase Difference  
50  
100 Ω  
180° ± 10°  
1.4 dB max  
25 @ 900MHz  
25 @ 1900 MHz  
30 @ 4800 MHz  
Amplitude Difference  
Attenuation (dB min.)  
15 @ 7200 MHz (reference)  
Typical Electrical Chart  
Phase imbalance  
:
Amplitude imbalance  
:
SOLDER LAND PATTERN (unit in mm)  
Land Pad Design (mm)  
(1). Line width to be design to match 50characteristic impedance, depending on PCB material and thickness  
(2). Φ are the grounding through holes.  
.
Page 3 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
RELIABILITY TEST  
Test condition / Test method  
Test item  
Specification  
Solderability  
JIS C 0050-4.6  
*Solder bath temperature235 ± 5°C  
*Immersion time2 ± 0.5 sec  
At least 95% of a surface of each terminal  
electrode must be covered by fresh solder.  
JESD22-B102D  
*SolderSn3Ag0.5Cu for lead-free  
Leaching  
*Solder bath temperature260 ± 5°C  
*Leaching immersion time30 ± 0.5 sec  
*Solder : SN63A  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to dissolution  
of metallization)  
IEC 60068-2-58  
Resistance to soldering heat  
JIS C 0050-5.4  
*Preheating temperature120~150,  
1 minute.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Solder temperature270±5°C  
*Immersion time10±1 sec  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
*SolderSn3Ag0.5Cu for lead-free  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Drop Test  
JIS C 0044  
*Height75 cm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test SurfaceRigid surface of concrete  
or steel.  
*Times6 surfaces for each units2  
times for each side.  
Adhesive Strength  
of Termination  
*Pressurizing force  
No remarkable damage or removal of the  
termination.  
5N(0603)10N(>0603)  
JIS C 0051- 7.4.3  
*Test time10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing  
rod at a rate of about 1 mm/s per second  
until the deflection becomes 1mm/s and  
then pressure shall be maintained for 5±1  
sec.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0051- 7.4.1  
Measurement to be made after keeping at  
room temperature for 24±2 hours  
Page 4 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
Temperature cycle  
1. 30±3 minutes at -40°C±3°C,  
2. 10~15 minutes at room temperature,  
3. 30±3 minutes at +85°C±3°C,  
No mechanical damage.  
Samples shall satisfy electrical  
specification after test.  
JIS C 0025  
4. 10~15 minutes at room temperature,  
Total 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Vibration  
*Frequency10Hz~55Hz~10Hz(1min)  
*Total amplitude1.5mm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0040  
*Test times6hrs.(Two hrs each in three  
mutually perpendicular directions)  
High temperature  
JIS C 0021  
*Temperature85°C±2°C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Humidity  
*Humidity90% to 95% R.H.  
*Temperature40±2°C  
*Time1000+24/-0 hrs.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
(steady conditions)  
JIS C 0022  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*Temperature-40°C±2°C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Page 5 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
RF  
BPB  
252012  
0
A
2
T
Walsin  
Product Code  
BPB :  
Dimension  
code  
Unit of  
dimension  
Application  
Specification  
Design Code  
Packing  
T : Reeled  
RF Pb free  
device  
A : 2.4GHZ ISM  
Band  
Per 2 digits of  
Length, Width,  
Thickness :  
0 : 0.1 mm  
1 : 1.0 mm  
Balanced Type  
Band Pass Filter  
e.g. :  
252012 =  
Length 25,  
Width 20,  
Thickness 12  
Minimum Ordering Quantity: 2000 pcs per reel.  
PACKAGING  
P2  
ΦD  
P0  
P1  
E
F
W
B
0
T
A0  
Plastic Tape specifications (unit :mm)  
Index  
Ao  
Bo  
ΦD  
1.55 ± 0.05  
Po  
T
W
Dimension (mm)  
Index  
2.27 ± 0.10  
E
2.74 ± 0.10  
F
1.40 ± 0.10  
P1  
1.00 ± 0.10  
P2  
Dimension (mm)  
1.75 ± 0.10  
3.50 ± 0.10  
4.00 ± 0..20  
4.00 ± 0.10  
2.00 ± 0.10  
Page 6 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  
Approval sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Dimension (mm)  
Φ178  
Φ60.0  
Φ13.5  
Typing Quantity: 2000 pieces per 7" reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage environment condition.  
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 7 of 7  
ASC_RFBPB2520120A2T_V04  
Nov. 2011  

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