RFBPF2012041AB7B1U [WALSIN]

2.4 GHz ISM Band Working Frequency;
RFBPF2012041AB7B1U
型号: RFBPF2012041AB7B1U
厂家: Walsin Technology    Walsin Technology
描述:

2.4 GHz ISM Band Working Frequency

ISM频段
文件: 总7页 (文件大小:168K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Walsin Technology Corporation  
RFBPF Series – 2012(0805)- RoHS Compliance  
MULTILAYER CERAMIC BAND PASS FILTER  
2.4 GHz ISM Band Working Frequency  
P/N: RFBPF2012040AB7B1U  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
FEATURES  
1.  
2.  
3.  
4.  
5.  
6.  
Miniature footprint: 2.0 X 1.2 X 0.4 mm3  
Low Profile Thickness  
Low Insertion loss  
High Rejection Rate  
High attenuation on 2nd harmonic suppressed  
LTCC process  
APPLICATIONS  
1.  
2.  
2.4GHz ISM band RF applications  
Bluetooth, Wireless LAN 802.11b/g, HomeRF  
CONSTRUCTION  
PIN  
1
Connection  
Input port  
2
GND  
Pin 3  
3
Output port  
Pin 2  
Pin 1  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
L
2.00 ± 0.15  
W
T
1.25 ± 0.10  
0.45 ± 0.10  
A
B
C
0.95 ± 0.10  
0.275 ± 0.10  
0.25 ± 0.10  
D
E
F
0.60 ± 0.10  
0.175 ± 0.10  
0.15 ± 0.10  
Page 2 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
ELECTRICAL CHARACTERISTICS  
RFBPF2012040AB7B1U  
Specification  
Frequency range  
Insertion Loss  
VSWR  
2450 ± 50 MHz  
2.5 dB max  
2.0 max  
50 Ω  
Impedance  
30 dB  
30 dB  
30 dB  
30 dB  
35 dB  
40 dB  
32 dB  
7 dB  
@
@
@
@
@
@
@
@
@
@
@
@
824 - 849 MHz  
880 - 915 MHz  
1545 - 1605 MHz  
1565 - 1585 MHz  
1710 - 1785 MHz  
1850 - 1910 MHz  
1920 - 1980 MHz  
3168 - 4752 MHz  
3300 - 3800 MHz  
4800 - 4967 MHz  
5150 - 6000 MHz  
7200 - 7450 MHz  
Attenuation (min.)  
11 dB  
35 dB  
26 dB  
23 dB  
Operation Temperature Range  
-40°C ~ +85°C  
Typical Electrical Chart  
SOLDER LAND PATTERN  
Figure  
Symbol  
Dimension (mm)  
L1  
W1  
W2  
D1  
S1  
0.60 ± 0.10  
0.70 ± 0.05  
2.25 ± 0.10  
0.20 ± 0.05  
0.25 ± 0.05  
Line width to de designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.  
D1 are the grounding through holes.  
Page 3 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
RELIABILITY TEST  
Test condition / Test method  
Test item  
Solderability  
Specification  
*Solder bath temperature235 ± 5°C  
*Immersion time2 ± 0.5 sec  
At least 95% of a surface of each terminal  
electrode must be covered by fresh solder.  
JIS C 0050-4.6  
JESD22-B102D  
SolderSn3Ag0.5Cu for lead-free  
Leaching  
*Solder bath temperature260 ± 5°C  
*Leaching immersion time30 ± 0.5 sec  
Solder : SN63A  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to dissolution  
of metallization)  
IEC 60068-2-58  
Resistance to soldering heat  
JIS C 0050-5.4  
*Preheating temperature120~150,  
1 minute.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Solder temperature270±5°C  
*Immersion time10±1 sec  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
SolderSn3Ag0.5Cu for lead-free  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Drop Test  
JIS C 0044  
*Height75 cm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test SurfaceRigid surface of concrete  
Customer’s specification.  
or steel.  
*Times6 surfaces for each units2  
times for each side.  
Adhesive Strength  
of Termination  
*Pressurizing force  
No remarkable damage or removal of the  
termination.  
5N(0603)10N(>0603)  
JIS C 0051- 7.4.3  
*Test time10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing  
rod at a rate of about 1 mm/s per second  
until the deflection becomes 1mm/s and  
then pressure shall be maintained for 5±1  
sec.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0051- 7.4.1  
Measurement to be made after keeping at  
room temperature for 24±2 hours  
Page 4 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
Temperature cycle  
1. 30±3 minutes at -40°C±3°C,  
No mechanical damage.  
Samples shall satisfy electrical  
specification after test.  
JIS C 0025  
2. 10~15 minutes at room temperature,  
3. 30±3 minutes at +85°C±3°C,  
4. 10~15 minutes at room temperature,  
Total 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Vibration  
*Frequency10Hz~55Hz~10Hz(1min)  
*Total amplitude1.5mm  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
JIS C 0040  
*Test times6hrs.(Two hrs each in three  
mutually perpendicular directions)  
High temperature  
JIS C 0021  
*Temperature85°C±2°C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Humidity  
*Humidity90% to 95% R.H.  
*Temperature40±2°C  
*Time1000+24/-0 hrs.  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
(steady conditions)  
JIS C 0022  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*Temperature-40°C±2°C  
No mechanical damage.  
Samples shall satisfy electrical specification  
after test.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Page 5 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
RF  
BPF  
201204  
0
A
B7B1U  
Specification  
Design code  
Walsin  
RF device  
Product Code  
Dimension code  
Unit of dimension  
0 : 0.1 mm  
Application  
BPF : Band Pass  
Filter  
Per 2 digits of  
Length, Width,  
Thickness :  
A : 2.4GHZ ISM Band  
1 : 1.0 mm  
e.g. :  
201204 =  
Length 20,  
Width 12,  
Thickness 04  
PACKAGING  
Paper Tape specifications (unit :mm)  
Index  
Ao  
Bo  
T
W
ΦD  
Dimension (mm)  
Index  
1.55 + 0.05  
Po  
1.32 ± 0.10  
E
2.25 ± 0.10  
F
0.80 ± 0.10  
P1  
8.0 ± 0.10  
P2  
Dimension (mm)  
1.75 ± 0.10  
3.50 ± 0.05  
4.00 ± 0.10  
4.00 ± 0.10  
2.00 ± 0.05  
Page 6 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  
Walsin Technology Corporation  
Reel dimensions  
B
A
C
Index  
A
B
C
Φ178.0  
Φ60.0  
Φ13.0  
Dimension (mm)  
Taping Quantity: 4000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage environment condition.  
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 7 of 7  
ASC_RFBPF2012040AB7B1U_V01  
Oct. 2009  

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