RFBPF2012080A7T [WALSIN]

2.4 GHz ISM Band Working Frequency;
RFBPF2012080A7T
型号: RFBPF2012080A7T
厂家: Walsin Technology    Walsin Technology
描述:

2.4 GHz ISM Band Working Frequency

ISM频段
文件: 总7页 (文件大小:472K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Approval sheet  
RFBPF Series – 2012(0805)- RoHS Compliance  
MULTILAYER CERAMIC BAND PASS FILTER  
Halogens Free Product  
2.4 GHz ISM Band Working Frequency  
P/N: RFBPF2012080A7T  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  
Approval sheet  
FEATURES  
1.  
2.  
3.  
4.  
5.  
6.  
Miniature footprint: 2.0 X 1.2 X 0.8 mm3  
Low Profile Thickness  
Low Insertion loss  
High Rejection Rate  
High attenuation on 2nd harmonic suppressed  
LTCC process  
APPLICATIONS  
1.  
2.  
2.4GHz ISM band RF applications  
Bluetooth, Wireless LAN 802.11b/g, HomeRF  
CONSTRUCTION  
P4  
P1  
PIN  
1
Connection  
GND  
2
Input / Output  
GND  
3
4
Input / Output  
P2  
P3  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
L
W
T
2.00 ± 0.15  
1.25 ± 0.15  
0.80 ± 0.10  
0.50 ± 0.15  
1.00 ± 0.15  
A
B
C
D
E
F
0.25 ± 0.15  
0.25 ± 0.15  
0.475 ± 0.15  
0.30 ± 0.15  
Page 2 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  
Approval sheet  
ELECTRICAL CHARACTERISTICS  
RFBPF2012080A7T  
Frequency range  
Specification  
2450 ± 50 MHz  
2.8 dB max (typ. 2.5 dB )  
2.0 max  
Insertion Loss  
VSWR  
50 Ω  
Impedance  
40 dB @ DC~1600 MHz  
35 dB @ 1710 MHz  
25 dB @ 1900 MHz  
12 dB @ 2100 MHz  
8 dB @ 2170 MHz  
Attenuation (min.)  
30 dB @ 3100 MHz  
40 dB @ 4800~5000 MHz  
20 dB @ 7200~7500 MHz  
-45°C ~ +85°C  
Operation Temperature Range  
Typical Electrical Chart  
SOLDER LAND PATTERN  
Figure  
Unit : mm  
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.  
Page 3 of 7 ASC_RFBPF2012080A7T_V05 Jun. 2013  
Approval sheet  
RELIABILITY TEST  
Test condition / Test method  
Test item  
Specification  
Solderability  
At least 95% of a surface of each terminal  
*Solder bath temperature235 ± 5°C  
JIS C 0050-4.6  
JESD22-B102D  
electrode must be covered by fresh solder.  
*Immersion time2 ± 0.5 sec  
SolderSn3Ag0.5Cu for lead-free  
*Solder bath temperature260 ± 5°C  
*Leaching immersion time30 ± 0.5 sec  
Solder : SN63A  
Leaching  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to  
dissolution of  
metallization)  
IEC 60068-2-58  
Resistance to soldering  
heat  
*Preheating temperature120~150,  
1 minute.  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
JIS C 0050-5.4  
*Solder temperature270±5°C  
*Immersion time10±1 sec  
SolderSn3Ag0.5Cu for lead-free  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Drop Test  
*Height75 cm  
No mechanical damage.  
JIS C 0044  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test SurfaceRigid surface of concrete or  
Customer’s specification.  
steel.  
*Times6 surfaces for each units2 times  
for each side.  
Vibration  
*Frequency10Hz~55Hz~10Hz(1min)  
*Total amplitude1.5mm  
No mechanical damage.  
JIS C 0040  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test times6hrs.(Two hrs each in three  
mutually perpendicular directions)  
Adhesive Strength  
of Termination  
*Pressurizing force  
No remarkable damage or removal of the  
termination.  
5N(0603)10N(>0603)  
JIS C 0051- 7.4.3  
*Test time10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing rod  
at a rate of about 1 mm/s per second until the  
deflection becomes 1mm/s and then pressure  
shall be maintained for 5±1 sec.  
No mechanical damage.  
JIS C 0051- 7.4.1  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 24±2 hours  
Page 4 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  
Approval sheet  
Temperature cycle  
JIS C 0025  
1. 30±3 minutes at -40°C±3°C,  
2. 10~15 minutes at room temperature,  
3. 30±3 minutes at +85°C±3°C,  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics  
under the operational temperature range  
within -40 ~ 85°C.  
4. 10~15 minutes at room temperature,  
Total 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
High temperature  
JIS C 0021  
*Temperature85°C±2°C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Humidity  
*Humidity90% to 95% R.H.  
*Temperature40±2°C  
*Time1000+24/-0 hrs.  
No mechanical damage.  
(steady conditions)  
JIS C 0022  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*Temperature-40°C±2°C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Page 5 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  
Approval sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
RF  
BPF  
201208  
0
A
7
T
Walsin  
RF device  
Product Code  
BPF :  
Dimension code  
Unit of  
dimension  
Application  
Specification  
Design Code  
Packing  
T : Reeled  
Per 2 digits of  
Length, Width,  
Thickness :  
A : 2.4GHz ISM  
Band  
0 : 0.1 mm  
1 : 1.0 mm  
Band Pass Filter  
e.g. :  
201208 =  
Length 20,  
Width 12,  
Thickness 08  
Minimum Ordering Quantity: 2000 pcs per reel.  
PACKAGING  
Plastic Tape specifications (unit :mm)  
ΦD  
Index  
Ao  
Bo  
T
W
1.30 ± 0.10  
2.30 ± 0.10  
1.55 ± 0.10  
0.95 ± 0.10  
8.00 ± 0.10  
Dimension (mm)  
Index  
E
F
Po  
P1  
P2  
1.75± 0.10  
3.50 ± 0.05  
4.00 ± 0.10  
4.00 ± 0.10  
2.00± 0.10  
Dimension (mm)  
Page 6 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  
Approval sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Φ178.0  
Φ60.0  
Φ13.0  
Dimension (mm)  
Taping Quantity:2000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage environment condition.  
¢
¢
¢
¢
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
¢
¢
¢
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 7 of 7  
ASC_RFBPF2012080A7T_V05  
Jun. 2013  

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