RFLPF1608051K07B1U [WALSIN]

5 GHz Wireless Communication Band Working Frequency;


型号：	RFLPF1608051K07B1U
厂家：	Walsin Technology
描述：	5 GHz Wireless Communication Band Working Frequency 无线
文件：	总7页 (文件大小：474K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Approval sheet

RFLPF Series – 1608(0603)- RoHS Compliance

MULTILAYER CERAMIC LOW PASS FILTER

Halogens Free Product

5 GHz Wireless Communication Band Working Frequency

P/N: RFLPF1608050K07B1U

*Contents in this sheet are subject to change without prior notice.

Page 1 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

FEATURES

Miniature footprint: 1.6 X 0.8 X 0.5 mm³

Low Profile Thickness

Low Insertion loss

LTCC process

APPLICATIONS

4900 – 5950 MHz band RF applications

5G wireless communication system applications, WLAN, etc.

CONSTRUCTION

Connection

Input port

GND

Output port

GND

DIMENSIONS

Figure

Symbol

Dimension (mm)

1.60 ± 0.15

0.80 ± 0.15

0.50 ± 0.10

0.45 ± 0.15

0.70 ± 0.15

0.20 ± 0.15

0.25 ± 0.15

0.30 ± 0.15

Page 2 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

ELECTRICAL CHARACTERISTICS

RFLPF1608050K07B1U

Specification

Frequency range (MHz)

4900 ~ 5950 MHz

0.6 dB max. (25°C)

Insertion Loss (dB)

0.7 dB max. (-40°C ~ +85°C)

2.0 max

VSWR

Impedance (Ω)

50 Ω

25 dB@ 9800 MHz

30 dB@ 11900 MHz

20 dB@ 17850 MHz (reference)

-40°C ~ +85°C

Attenuation (dB min.)

Operation Temperature Range

Typical Electrical Chart

-10

-20

-30

-40

-50

-60

S21

S11

Frequency (GHz)

SOLDER LAND PATTERN

unit: mm

Line width to de designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.

D1 and D2 are the grounding through holes.

Page 3 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

RELIABILITY TEST

Test condition / Test method

Test item

Specification

Solderability

JIS C 0050-4.6

*Solder bath temperature：235 ± 5°C

*Immersion time：2 ± 0.5 sec

At least 95% of a surface of each terminal

electrode must be covered by fresh solder.

JESD22-B102D

*Solder：Sn3Ag0.5Cu for lead-free

Leaching

*Solder bath temperature：260 ± 5°C

*Leaching immersion time：30 ± 0.5 sec

*Solder : SN63A

Loss of metallization on the edges of each

electrode shall not exceed 25%.

(Resistance to dissolution

of metallization)

IEC 60068-2-58

Resistance to soldering heat

JIS C 0050-5.4

*Preheating temperature：120~150℃,

1 minute.

No mechanical damage.

Samples shall satisfy electrical specification

after test.

*Solder temperature：270±5°C

*Immersion time：10±1 sec

Loss of metallization on the edges of each

electrode shall not exceed 25%.

*Solder：Sn3Ag0.5Cu for lead-free

Measurement to be made after keeping at

room temperature for 24±2 hrs

Drop Test

JIS C 0044

*Height：75 cm

No mechanical damage.

Samples shall satisfy electrical specification

after test.

*Test Surface：Rigid surface of concrete

or steel.

*Times：6 surfaces for each units；2

times for each side.

Adhesive Strength

of Termination

*Pressurizing force：

No remarkable damage or removal of the

termination.

5N(≦0603)；10N(>0603)

JIS C 0051- 7.4.3

*Test time：10±1 sec

Bending test

The middle part of substrate shall be

pressurized by means of the pressurizing

rod at a rate of about 1 mm/s per second

until the deflection becomes 1mm/s and

then pressure shall be maintained for 5±1

sec.

No mechanical damage.

Samples shall satisfy electrical specification

after test.

JIS C 0051- 7.4.1

Measurement to be made after keeping at

room temperature for 24±2 hours

Page 4 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

Temperature cycle

JIS C 0025

1. 30±3 minutes at -40°C±3°C,

2. 10~15 minutes at room temperature,

3. 30±3 minutes at +85°C±3°C,

No mechanical damage.

Samples shall satisfy electrical

specification after test.

4. 10~15 minutes at room temperature,

Total 100 continuous cycles

Measurement to be made after keeping at

room temperature for 24±2 hrs

Vibration

*Frequency：10Hz~55Hz~10Hz(1min)

*Total amplitude：1.5mm

No mechanical damage.

Samples shall satisfy electrical specification

after test.

JIS C 0040

*Test times：6hrs.(Two hrs each in three

mutually perpendicular directions)

High temperature

JIS C 0021

*Temperature：85°C±2°C

No mechanical damage.

Samples shall satisfy electrical specification

after test.

*Test duration：1000+24/-0 hours

Measurement to be made after keeping at

room temperature for 24±2 hrs

Humidity

*Humidity：90% to 95% R.H.

*Temperature：40±2°C

*Time：1000+24/-0 hrs.

No mechanical damage.

Samples shall satisfy electrical specification

after test.

(steady conditions)

JIS C 0022

Measurement to be made after keeping at

room temperature for 24±2 hrs

※500hrs measuring the first data then

1000hrs data

Low temperature

JIS C 0020

*Temperature：-40°C±2°C

No mechanical damage.

Samples shall satisfy electrical specification

after test.

*Test duration：1000+24/-0 hours

Measurement to be made after keeping at

room temperature for 24±2 hrs

Page 5 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

SOLDERING CONDITION

Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,

Fig 2. Infrared soldering profile

ORDERING CODE

Walsin

RF device

LPF

160805

07B1U

Specification

Design Code

Product Code

LPF :

Dimension code

Unit of dimension

0 : 0.1 mm

Application

Per 2 digits of

Length, Width,

Thickness :

K : 5 GHZ ISM Band

Low Pass Filter

1 : 1.0 mm

e.g. :

160805 =

Length 16,

Width 08,

Thickness05

Minimum Ordering Quantity: 4000 pcs per reel.

PACKAGING

Paper Tape specifications (unit :mm)

Index

ΦD

Dimension (mm)

Index

1.55 + 0.05

0.975 ± 0.05

1.76 ± 0.05

0.75 ± 0.10

8.0 ± 0.10

Dimension (mm)

1.75 ± 0.10

3.50 ± 0.05

4.00 ± 0.10

2.00 ± 0.05

Page 6 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

Approval sheet

Reel dimensions

Index

Φ178.0

Φ60.0

Φ13.0

Dimension (mm)

Taping Quantity: 4000 pieces per 7” reel

CAUTION OF HANDLING

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects, which might directly cause damage to the third party’s life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Medical equipment

(5) Disaster prevention / crime prevention equipment

(6) Traffic signal equipment

(7) Transportation equipment (vehicles, trains, ships, etc.)

(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.

Storage condition

(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be

confirmed.

(2) Storage environment condition.

Products should be storage in the warehouse on the following conditions.

Temperature

Humidity

: -10 to +40℃

: 30 to 70% relative humidity

Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of

electrode, resulting in poor solderability.

Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.

Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.

Products should be storage under the airtight packaged condition.

Page 7 of 7

ASC_RFLPF1608050K07B1U_V01

Aug. 2012

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