RH15G1R0C201CG [WALSIN]
High Q and low ESR performance at high frequency;
| 型号： | RH15G1R0C201CG |
| 厂家： | 
Walsin Technology |
| 描述： | High Q and low ESR performance at high frequency |
| 文件： | 总12页 (文件大小：4011K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitors
Approval Sheet
MULTILAYER CERAMIC CAPACITORS
Microwave Series + High Reliability (RH)
0402 to 0805 Sizes (200V to 250V)
X8G Dielectric
RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
Page 1 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
WTC RH series MLCC are used at high frequencies generally and have a small temperature coefficient of
capacitance, typical within the ±30ppm/°C required for X8G classification and have internal electrodes of excellent
conductivity. Thus, WTC RH series MLCC will have the feature of low ESR and high Q characteristics.
WTC RH series have high reliability characteristic, life test condition: 150℃ / 2000hrs / 2xRated Voltage.
2. FEATURES
3. APPLICATIONS
b. High Q and low ESR performance at high frequency.
c. Ultra low capacitance to 0.1pF.
d. Ultra high reliability ( 150℃ / 2000hrs / 2x Rated
Voltage).
a. Telecommunication products & equipments: Mobile
phone, WLAN, Base station, Small cell.
b. RF module: Power amplifier, VCO.
c. Tuners.
e. Can offer high precision tolerance to ±0.05pF.
f. Quality improvement of telephone calls for low
d. High quality concern wireless device.
4. HOW TO ORDER
RH
21
G
100
J
251
C
T
Series
Size
Dielectric
Capacitance
Tolerance
Rated voltage
Termination
Packaging
RH=High
15=0402 (1005) G=X8G
Two significant
A=±0.05pF Two significant
C=Cu/Ni/Sn
T=7” reeled
reliability & Ultra 18=0603 (1608)
digits followed by B=±0.1pF digits followed by
no. of zeros. And C=±0.25pF no. of zeros. And
G= 13” reeled
High Q & Low
ESR
11=0505 (1414)
21=0805 (2012)
R is in place of
decimal point.
F=±1%
G=±2%
J=±5%
R is in place of
decimal point.
eg. :
eg. :
0R5=0.5pF
1R0=1.0pF
100=10x100
=10pF
201=200 VDC
251=250 VDC
Page 2 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
5. EXTERNAL DIMENSIONS
Size
L
L (mm)
W (mm)
T (mm)/Symbol Remark
MB (mm)
Inch (mm)
0402 (1005)
1.00±0.05
1.60±0.10
2.00±0.20
0.50±0.05
0.50±0.05
N
#
0.25+0.05/-0.10
0.40±0.15
T
0603 (1608)
0805 (2012)
0505 (1414)
0.80±0.10
1.25±0.20
1.40±0.38
0.80±0.07
0.85±0.10
1.15±0.15
S
T
J
W
0.50±0.20
MB
MB
1.40
+0.38/-0.25
#
0.25+0.25/-0.13
Fig. 1 The outline of MLCC
# Reflow soldering only is recommended.
6. GENERAL ELECTRICAL DATA
Dielectric
Size
X8G
0402, 0505, 0603, 0805
0.1pF to 10pF
Capacitance*
Cap≤5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: B (±0.1pF), C (±0.25pF)
Cap=10pF: F (±1%), G (±2%), J (±5%)
200V, 250V
Capacitance tolerance
Rated voltage (WVDC)
Q*
Q≥800+20C
Insulation resistance at Ur
Operating temperature
Capacitance change
Termination
≥10GΩ or RxC≥100Ω-F whichever is smaller.
-55 to +150°C
±30ppm/°C
Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temper ature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
7. PACKAGING DIMENSION AND QUANTITY
Paper tape
Plastic tape
Size
Thickness (mm)/Symbol
7” reel
10,000
4,000
13” reel
50,000
15,000
15,000
0402 (1005)
0603 (1608)
0805 (2012)
0.50±0.05
0.80±0.07
0.85±0.10
N
S
T
4,000
Size
Thickness (mm)/Symbol
7” reel
13” reel
0505 (1414)
1.15±0.15
J
3,000
-
Unit: pieces
Page 3 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
8. CAPACITANCE RANGE
DIELECTRIC
X8G
0402
200
SIZE
Tolerance
RATED VOLTAGE (VDC)
0.1pF (0R1)
0.2pF (0R2)
0.3pF (0R3)
0.4pF (0R4)
0.5pF (0R5)
0.6pF (0R6)
0.7pF (0R7)
0.8pF (0R8)
0.9pF (0R9)
1.0pF (1R0)
1.1pF (1R1)
1.2pF (1R2)
1.3pF (1R3)
1.4pF (1R4)
1.5pF (1R5)
1.6pF (1R6)
1.7pF (1R7)
1.8pF (1R8)
1.9pF (1R9)
2.0pF (2R0)
2.1pF (2R1)
2.2pF (2R2)
2.3pF (2R3)
2.4pF (2R4)
2.5pF (2R5)
2.6pF (2R6)
2.7pF (2R7)
2.8pF (2R8)
2.9pF (2R9)
3.0pF (3R0)
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
B
A, B
A, B
A, B
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
Page 4 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
DIELECTRIC
SIZE
X8G
0603
0505
250
0805
250
Tolerance
RATED VOLTAGE (VDC)
250
0.3pF (0R3)
0.4pF (0R4)
0.5pF (0R5)
0.6pF (0R6)
0.7pF (0R7)
0.8pF (0R8)
0.9pF (0R9)
1.0pF (1R0)
1.1pF (1R1)
1.2pF (1R2)
1.3pF (1R3)
1.4pF (1R4)
1.5pF (1R5)
1.6pF (1R6)
1.7pF (1R7)
1.8pF (1R8)
1.9pF (1R9)
2.0pF (2R0)
2.1pF (2R1)
2.2pF (2R2)
2.3pF (2R3)
2.4pF (2R4)
2.5pF (2R5)
2.6pF (2R6)
2.7pF (2R7)
2.8pF (2R8)
2.9pF (2R9)
3.0pF (3R0)
3.1pF (3R1)
3.2pF (3R2)
3.3pF (3R3)
3.4pF (3R4)
3.5pF (3R5)
3.6pF (3R6)
3.7pF (3R7)
3.8pF (3R8)
3.9pF (3R9)
4.0pF (4R0)
4.1pF (4R1)
4.2pF (4R2)
4.3pF (4R3)
4.4pF (4R4)
4.5pF (4R5)
4.6pF (4R6)
4.7pF (4R7)
4.8pF (4R8)
4.9pF (4R9)
5.0pF (5R0)
5.1pF (5R1)
5.2pF (5R2)
5.3pF (5R3)
5.4pF (5R4)
5.5pF (5R5)
5.6pF (5R6)
5.7pF (5R7)
5.8pF (5R8)
5.9pF (5R9)
6.0pF (6R0)
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
B
B
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
Page 5 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
DIELECTRIC
SIZE
X8G
0603
0505
250
0805
250
Tolerance
RATED VOLTAGE (VDC)
250
6.1pF (6R1)
6.2pF (6R2)
6.3pF (6R3)
6.4pF (6R4)
6.5pF (6R5)
6.6pF (6R6)
6.7pF (6R7)
6.8pF (6R8)
6.9pF (6R9)
7.0pF (7R0)
7.1pF (7R1)
7.2pF (7R2)
7.3pF (7R3)
7.4pF (7R4)
7.5pF (7R5)
7.6pF (7R6)
7.7pF (7R7)
7.8pF (7R8)
7.9pF (7R9)
8.0pF (8R0)
8.1pF (8R1)
8.2pF (8R2)
8.3pF (8R3)
8.4pF (8R4)
8.5pF (8R5)
8.6pF (8R6)
8.7pF (8R7)
8.8pF (8R8)
8.9pF (8R9)
9.0pF (9R0)
9.1pF (9R1)
9.2pF (9R2)
9.3pF (9R3)
9.4pF (9R4)
9.5pF (9R5)
9.6pF (9R6)
9.7pF (9R7)
9.8pF (9R8)
9.9pF (9R9)
10pF (100)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
B, C
F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
Page 6 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
9. ELECTRICAL CHARACTERISTICS
Fig. 2 ESR vs. Frequency (0402 size)
Fig. 3 ESR vs. Frequency (0603 size)
Fig. 4 Q vs. Frequency (0402 size)
Fig. 5 Q vs. Frequency (0603 size)
Fig. 6 Impedance vs. Frequency. (0402 size)
Fig. 7 Impedance vs. Frequency (0603 size)
Page 7 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
Fig. 8 ESR vs. Frequency (0805 size)
Fig. 9 ESR vs. Frequency (0505 size)
Fig. 10 Q vs. Frequency (0805 size)
Fig. 11 Q vs. Frequency (0505 size)
Fig. 12 Impedance vs. Frequency. (0805 size)
Fig. 13 Impedance vs. Frequency (0505 size)
Page 8 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item
Test Conditions
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
2. Capacitance
3. Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
* Shall not exceed the limits given in the detailed spec.
At 25°C ambient temperature.
* Q≥800+20C
* To apply voltage:
4. Dielectric
Strength
* No evidence of damage or flash over during test.
200V ~ 250V : 200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge & discharge current less than 50mA.
5. Insulation
Resistance
≤100V : To apply rated voltage for max. 120 sec.
≥200V :To apply rated voltage (500V max.) for 60 sec.
With no electrical load.
≥10GΩ or RxC≥100Ω-F whichever is smaller
6. Temperature
Coefficient
* Capacitance change: within ±30ppm/°C;
Operating temperature: -55~150°C at 25°C
7. Adhesive
Strength of
Termination
* Pressurizing force：
0402 to 0603: 5N
>0603: 10N
* No remarkable damage or removal of the terminations.
* Test time: 10±1 sec.
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
8. Vibration
Resistance
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Cap./DF(Q) Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
9. Solderability
10. Bending Test
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* Solder temperature: 260±5°C
11. Resistance to
Soldering Heat
* No remarkable damage.
* Dipping time: 10±1 sec
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
* Preheating: 120 to 150°C for 1 minute before imme rse the
capacitor in a eutectic solder.
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
Page 9 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
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Multilayer Ceramic Capacitors
Approval Sheet
No.
Item
Test Condition
Requirements
12. Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
* No remarkable damage.
* Cap change：within ±2.5％ or ±0.25pF whichever is larger.
Step
Temp. (°C)
Min. operating temp. +0/-3
Room temp.
Time (min.)
30±3
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
1
2
3
4
2~3
Max. operating temp. +3/-0
Room temp.
30±3
2~3
*Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Test temp.: 40±2°C
13. Humidity
(Damp Heat)
Steady State
* No remarkable damage.
* Humidity: 90~95% RH
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value: 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* Test time: 500+24/-0hrs.
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* I.R.: ≥1GΩ.
* Test temp.: 40±2°C
14. Humidity
(Damp Heat)
Load
* No remarkable damage.
* Humidity: 90~95%RH
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value: Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ.
* Test time: 500+24/-0 hrs.
* To apply voltage：rated voltage (MAX. 500V)
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Test temp.: 150±3°C
15. High
Temperature
Load
* No remarkable damage.
* To apply voltage:
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value: Cap≤10pF, Q≥200+10C
* I.R.: ≥1GΩ.
10V≦Ur<500V : 200% of rated voltage.
* Test time: 2000+24/-0 hrs.
(Endurance)
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
RH15(0402)
RH18(0603)
16. ESR
The ESR should be measured at room temperature and tested
at frequency 1±0.1 GHz.
0.1pF≤Cap≤1pF:< 330mΩ/pF
1pF<Cap≤3pF:< 280mΩ
0.2pF≤Cap≤1pF:< 1400mΩ
1pF<Cap≤10pF:< 230mΩ
RH21(0805)
RH11(0505)
0.3pF≤Cap≤1pF: < 1400mΩ
1pF<Cap≤10pF: < 230mΩ
0.4pF≤Cap<1pF: < 1400mΩ
1.0pF≤Cap<10pF: < 230mΩ
Cap=10pF: < 200mΩ
Page 10 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
APPENDIXES
◙ Tape & reel dimensions
Size
0402
N
0505
J
0603
0805
T
Thickness
S
0.70
+/-0.20
1.20
1.05
+/-0.30
1.80
1.50
+/-0.20
2.30
< 1.90
< 1.90
A0
B0
T
+/-0.20
+/-0.30
+/-0.20
0.23
+/-0.1
≦0.80
≦1.20
≦1.20
-
< 1.50
-
-
K0
W
8.00
+/-0.30
4.00
+/-0.10
40.00
+/-0.10
2.00
+/-0.05
2.00
+/-0.05
1.50
8.00
+/-0.30
4.00
+/-0.10
40.00
+/-0.20
4.00
+/-0.10
2.00
+/-0.05
1.50
+0.1/-0
1.00
+/-0.10
1.75
+/-0.10
3.50
+/-0.05
8.00
+/-0.30
4.00
+/-0.10
40.00
+/-0.20
4.00
+/-0.10
2.00
+/-0.05
1.50
8.00
+/-0.30
4.00
+/-0.10
40.00
+/-0.20
4.00
+/-0.10
2.00
+/-0.05
1.50
Fig. 14 The dimension of paper tape
P0
10xP0
P1
P2
D0
D1
E
+0.1/-0
+0.1/-0
+0.1/-0
-
-
-
1.75
+/-0.10
3.50
1.75
+/-0.10
3.50
1.75
+/-0.10
3.50
F
+/-0.05
+/-0.05
+/-0.05
Fig. 15 The dimension of plastic tape
Size
0402, 0505, 0603, 0805
Reel size
7”
13”
C
W1
A
13.0+0.5/-0.2
8.4+1.5/-0
13.0+0.5/-0.2
8.4+1.5/-0
330.0±1.0
100±1.0
178.0±1.0
N
60.0+1.0/-0
Fig. 16 The dimension of reel
◙ Example of customer label
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
*Customized label is available upon request
Page 11 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
Multilayer Ceramic Capacitors
Approval Sheet
◙ Constructions
No.
1
2
3
4
5
Name
X8G
Ceramic material
Inner electrode
Hi-Q dielectric ceramic
Cu
Cu
Inner layer
Termination
Middle layer
Outer layer
Ni
Sn (Matt)
Fig. 17 The construction of MLCC
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N2 within oven are recommended.
Fig. 18 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
Fig. 19 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
Page 12 of 12
ASC_Microwave_High_ Reliability_(RH)_023B
Jun. 2019
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