SA04X472-PBL [WALSIN]

High reliability and stability;


型号：	SA04X472-PBL
厂家：	Walsin Technology
描述：	High reliability and stability
文件：	总8页 (文件大小：234K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Approval sheet

SA04X, SA06X

±1%, ±5%, Convex Type

Thick film General Purpose Chip-R Array

Size 0402x4, 0603x4 (8P4R)

Automotive & Anti-Sulfuration

*Contents in this sheet are subject to change without prior notice.

Page 1 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

FEATURE

1. High reliability and stability

2. Sulfuration resistant

3. Automotive grade with AEC Q-200 compliant

4. Higher component and equipment reliability

5. EU RoHS compliant and Lead free products

6. Anti-Sulfuration ASTM B-809-95 105’C, 1000hrs compliant

APPLICATION

•

Consumer electrical equipment

EDP, Computer application

Telecom

Automotive application

DESCRIPTION

The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are

added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The

composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to

within tolerance by laser cutting of this resistive layer.

The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For

ease of soldering the outer layer of these end terminations is a Tin (Pb free) solder alloy.

Fig 1. Consctruction of a Chip-R array(convex Type)

Page 2 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

QUICK REFERENCE DATA

Item

General Specification

Series No.

SA04X

0402x4 (1005x4)

Convex

SA06X

0603x4 (1608x4)

Convex

Size

Termination construction

Resistance Tolerance

Resistance Range

TCR (ppm/°C)

±5%, ±1%

10Ω ~ 1MΩ, Jumper

1Ω ~ 1MΩ, Jumper,

<10Ω: -200 ~ +400

10Ω - 1MΩ: ≤ ± 200

1/10 W

10Ω - 1MΩ: ≤ ± 300

1/16 W

50V

Max. dissipation at T_amb=70°C

Max. Operation Voltage

Max. overload voltage

50V

100V

Operation temperature

-55 ~ +155’C

Note :

Climatic category refer to IEC 60068

This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication

60115-8”

Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by

RCWV = RatedPower ×Resistance Value or Max. RCWV listed above, whichever is lower.

DIMENSIONS (unit : mm)

SA04X

SA06X

2.00 ± 0.10

1.00 ± 0.10

0.45 ± 0.10

0.50 ± 0.05

0.40 ± 0.10

0.20 ± 0.10

0.30 ± 0.05

0.25 ± 0.10

3.20 ± 0.10

1.60 ± 0.10

0.50 ± 0.10

0.80 ± 0.10

0.60 ± 0.10

0.30 ± 0.10

0.40 ± 0.10

0.30 ± 0.20

Page 3 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

MARKING

3-digits marking for E24 series ±1% , ±5% products.

No marking for chip resistors array E96 series resistance.

Each resistor is marked with a three digits code on the protective coating to designate the nominal resistance

value.

Example

Resistance

10Ω

100Ω

6800Ω

47000Ω

Marking code

100

101

682

473

FUNCTIONAL DESCRIPTION

Product characterization

Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5%,

The values of the E24 series are in accordance with “IEC publication 60063”

Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of

±1%, The values of the E24/E96 series are in accordance with “IEC publication 60063”

Derating

The power that the resistor can dissipate depends on the operating temperature; see Fig.2.

Figure 2. Maximum dissipation in percentage of rated power

As a function of the ambient temperature

CONSTRUCTION

R1=R2=R3=R4

Page 4 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

MOUNTING

Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by

automatic placement systems.

Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).

Electrical connection to the circuit is by individual soldering condition.

The end terminations guarantee a reliable contact.

SOLDERING CONDITION

The robust construction of chip resistors allows

them to be completely immersed in a solder bath

of 260°C for 10 seconds. Therefore, it is possible

to mount Surface Mount Resistors on one side of a

PCB and other discrete components on the

reverse (mixed PCBs).

Surface Mount Resistors are tested for

solderability at 235°C during 2 seconds. The test

condition for no leaching is 260°C for 30 seconds.

Typical examples of soldering processes that

provide reliable joints without any damage are

given in Fig 3.

Fig 3. Infrared soldering profile for Chip Resistors array

CATALOGUE NUMBERS

The resistors have a catalogue number starting with .

SA04

472_

Automotive

code

Type code Resistance code

Tolerance

F : ±1%

Packaging code

Special code

X : Convex 5%, E24 : 2 significant

digits

: 7” Reeled taping

: 10” Reeled taping

: 13” Reeled taping

: Bulk

L = Lead free

SA04 : 0402 x 4

SA06 : 0603 x 4

J : ±5%

followed by no. of

zeros and a blank

P : Jumper

220Ω

=221_

(“_” means a blank)

1%, E24+E96: 3 significant

digits followed by no.

of zeros

102Ω

=1020

=3742

37.4KΩ

* Anti-sulfur test conditions: ASTM B-809-95 105’C, 1000 hrs, criteria: within ±1% !

* 100% CCD visual inspection to guarantee visual quality !

SA06X, Reeled tape packaging : 8mm width paper taping 5000pcs per reel.

SA04X, Reeled tape packaging : 8mm width paper taping 10,000pcs per reel.

Page 5 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

TEST AND REQUIREMENTS

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

REQUIREMENT

TEST

PROCEDURE / TEST METHOD

Resistor

0Ω

Electrical Characteristics

DC resistance values measurement

Temperature Coefficient of Resistance (T.C.R)

Within the specified tolerance

Refer to “QUICK REFERENCE

DATA”

Natural resistance change per change in degree centigrade.

JISC5201-1: 1998

Clause 4.8

R₂− R

×10⁶(ppm/°C) t₁: 20°C+5°C-1°C

(

t₂− t₁

)

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

∆R/R max. ±(0.5%+0.05Ω) <50mΩ

Un-mounted chips completely immersed for 10±1second in a

SAC solder bath at 270℃±5ºC

Resistance to soldering

heat(R.S.H)

MIL-STD-202

method 201

a) Bake the sample for 155℃ dwell time 4hrs/ solder dipping

235℃/ 5sec.

95% coverage min., good tinning and

no visible damage

Solderability

J-STD-202

b) Steam the sample dwell time 1 hour/ solder dipping

260℃/ 7sec.

1000 cycles, -55℃ ~ +155℃, dwell time 5~10min

∆R/R max. ±(0.5%+0.05Ω) < 50mΩ

∆R/R max. ±(0.5%+0.10Ω) < 50mΩ

∆R/R max. ±(1.0%+0.05Ω)

Temperature cycling

JESD22

method JA-104

65±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle

1000+48/-0 hours; 85°C, 85% RH, 10% of operation power

1000+48/-0 hours; 35% of operation power, 125±2°C

Moisture Resistance

MIL-STD-202

method 106

Bias Humidity

MIL-STD-202

method 103

No visible damage

<50mΩ

∆R/R max. ±(1.0%+0.05Ω)

Operational Life

MIL-STD-202

method 108

No visible damage

< 50mΩ

1000+48/-0 hours; without load in a temperature chamber

∆R/R max. ±(1.0%+0.05Ω)

High Temperature

Exposure

controlled 125±3°C

No visible damage

<50mΩ

MIL-STD-202

method 108

Page 6 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

TEST

REQUIREMENT

Resistor

PROCEDURE / TEST METHOD

0Ω

Board Flex

Resistors mounted on a 90mm glass epoxy resin PCB(FR4), ∆R/R max. ±(1.0%+0.05Ω).

<50mΩ

AEC-Q200-005

Terminal strength

AEC-Q200-006

Vibration

bending once 2mm for 10sec

No visible damage

Pressurizing force: 1Kg, Test time: 60±1sec.

No remarkable damage or removal of

the terminations

Test 5g’s for 20min., 12 cycles each of 3 orientations

∆R/R max. ±(1.0%+0.05Ω)

MIL-STD-202

method 204

Thermal shock

MIL-STD-202

method 107

ESD

No visible damage

<50mΩ

Test –55 to 125℃/ dwell time 15min/ Max transfer time ∆R/R max. ±(0.5%+0.05Ω)

20sec

No visible damage

<50mΩ

300cycles

Test contact 1.0KV

∆R/R max. ±(1.0%+0.05Ω)

AEC-Q200-002

No visible damage

TEST CONDITION FOR JUMPER (0 Ω)

Item

SA04X

1/16W

SA06X

1/10W

Power Rating At 70°C

Resistance

MAX.50mΩ

Rated Current

Peak Current

1.5A

-55~155°C

Operating Temperature

Page 7 of 8

ASC_SAxxX_V01

DEC - 2016

Approval sheet

PACKAGING

Paper Tape specifications (unit :mm)

Symbol

SA06X

SA04X

3.60±0.20

2.20±0.20

2.00±0.20

1.20±0.20

8.00±0.30

3.50±0.20

1.75±0.10

Symbol

SA06X

SA04X

ΦD

4.00±0.10

2.00±0.05

Max. 1.0

Max. 0.6

+0.1

4.00±0.10

Φ1.50

−0.0

Reel dimensions

Symbol

7” REEL

13.0±0.2

9.0±0.5

Φ178.0±2.0

Φ60.0±1.0

Page 8 of 8

ASC_SAxxX_V01

DEC - 2016

相关型号：