WLBD0603H1U220TP [WALSIN]
Monolithic inorganic material construction;型号: | WLBD0603H1U220TP |
厂家: | Walsin Technology |
描述: | Monolithic inorganic material construction |
文件: | 总12页 (文件大小:2716K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Approval Sheet
WLBD0603
Chip Bead P SERIES
*Contents in this sheet are subject to change without prior notice.
Page 1 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
FEATURES
Monolithic inorganic material construction.
Closed magnetic circuit avoids crosstalk.
S.M.T. type.
Suitable for reflow soldering.
Shapes and dimensions follow E.I.A. spec.
Available in various sizes.
Excellent solder ability and heat resistance.
High reliability.
100% Lead(Pb) & Halogen- Free and RoHS compliant.
SHAPE and DIMENSION
Chip Size
A
B
0.60±0.03
0.30±0.03
0.30±0.03
0.1~0.2
C
D
Units: mm
Ordering Information
WL
BD
0603
K2
U
300
T
P
Product
Code
Series
Dimensions
Series
extension
Tolerance
Value
Packing
Code
WL:
Inductor
BD: Chip
Bead.
0.6 * 0.3 mm
Refer to
characteristic
300 =30 OHM
301 =300 OHM
102 =1000OHM
T = 7"
P:General
U: ê25%
0603 :EIA 0201
Paper Tape
Page 2 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
PART NUMBER AND CHARACTERISTICS TABLE
WLBD0603 series
Rated Current
(mA) max.
Impedance (Ω)
+/-25%
DC Resistance
Test Frequency
(MHz)
Walsin Part Number
(
) max.
22
33
100
100
100
100
100
100
100
0.065
0.07
0.40
0.45
0.65
1.20
1.15
500
500
200
200
200
150
200
WLBD0603K2U220TP
WLBD0603K2U330TP
WLBD0603K2U800TP
WLBD0603K2U121TP
WLBD0603K2U241TP
WLBD0603K2U601TP
WLBD0603K2U102TP
80
120
240
600
1000
Rated Current
(mA) max.
Impedance (Ω)
+/-25%
DC Resistance
Test Frequency
(MHz)
Walsin Part Number
(
) max.
0.25
0.40
0.80
1.05
1.20
60
100
100
100
100
100
200
200
200
100
WLBD0603B1U600TP
WLBD0603B1U121TP
WLBD0603B1U241TP
WLBD0603B1U471TP
WLBD0603B1U601TP
120
240
470
600
100
Rated Current
Impedance (Ω)
+/-25%
DC Resistance
Test Frequency
(MHz)
Walsin Part Number
(
) max.
0.25
0.45
0.55
0.70
1.00
1.30
1.50
(mA) max.
10
22
100
100
100
100
100
100
100
200
200
150
150
100
100
100
WLBD0603H1U100TP
WLBD0603H1U220TP
WLBD0603H1U330TP
WLBD0603H1U471TP
WLBD0603H1U561TP
WLBD0603H1U800TP
WLBD0603H1U121TP
33
47
56
80
120
Page 3 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
RELIABILITY AND TEST CONDITION
Test item
Test Condition
Performance
Operating
-40~+125 (Including self-temperature rise)
-40~+125
Temperature
Transportation
Storage
Temperature
For long storage conditions, please see the
Application Notice
Impedance (Z)
Agilent4291
Agilent E4991
Agilent4287
Agilent16192
Inductance (Ls)
Q Factor
Refer to standard electrical characteristics list
DC Resistance
Agilent 4338
DC Power Supply
Rated Current
Over Rated Current requirements, there will be
some risk
Rated Current < 1A ΔT 20 Max
Rated Current 1A ΔT 40 Max
Applied the allowed DC current.
Temperature measured by digital surface
thermometer.
Temperature Rise
Test
Preheat: 150 ,60sec.
Solder: Sn99.5%-Cu0.5%
Solder temperature: 260±5
Flux for lead free: Rosin. 9.5%
Temperature ramp/immersion and immersion rate:
25±6 mm/s
Appearance No damage.
Impedance within±15% of initial value
RDC within ±15% of initial value and shall not
exceed the specification value
Resistance to
Soldering Heat
Dip time: 10±1sec.
Depth: completely cover the termination.
Preheating Dipping Natural cooling
260°C
150°C
60
10±1.0
second
second
More than 95% of the terminal electrode
should be covered with solder.
Preheat: 150 ,60sec.
Solder: Sn99.5%-Cu0.5%
Solder temperature: 245±5
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preheating Dipping Natural cooling
245°C
Solderability
150°C
60
4±1
second
second
Appearance No damage.
Impedance within±15% of initial value.
RDC within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
(>0805:1kg <=0805:0.5kg)to the side of a device
being tested. This force shall be applied for 60 +1
seconds. Also the force shall be applied gradually
as not to shock the component being tested.
Terminal strength
Page 4 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Performance
Test item
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions:>=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth:>=0805:1.2mm
<0805:0.8mm
Appearance No damage.
impedance within±10% of initial value
RDC within ±15% of initial value and shall not
exceed the specification value
Bending
Duration of 10 sec for a min
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10 2K 10Hz for 20
minutes
Equipment Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each
of 3 orientations)
Appearance No damage.
Impedance within±15% of initial value
RDC within ±15% of initial value and shall not
exceed the specification value
Vibration Test
Peak
Type Value
(g’s)
Normal
duration Wave form
(D) (ms)
Velocity
change
(Vi)ft/sec
15.4
Appearance No damage.
Impedance within±15% of initial value
RDC within ±15% of initial value and shall not
exceed the specification value
Shock
SMD
Lead
1,500
100
0.5
6
Half-sine
Half-sine
12.3
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2 (bead),
Life test
85±2 (inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing for
24±2 hrs.
Appearance: no damage.
Impedance: within±15%of initial value.
RDC within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Load Humidity
Temperature: 85±2
.
Duration: 1000hrs Min. with 100% rated current.
Measured at room temperature after placing for
24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Appearance: no damage.
Step1: -40±2
Step2: 25±2
Step3: +125±2
30±5 min.
0.5min
30±5min.(Bead)
Impedance: within±15%of initial value..
RDC within ±15% of initial value and shall not
exceed the specification value
Thermal shock
Number of cycles: 500
Measured at room temperature after placing for
24±2 hrs.
Insulation
Resistance
Chip Inductor Only
Test Voltage:100±10%V for 30 Sec.
IR>1GΩ
Page 5 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Derating
Derating Curve
6A
5A
4A
3A
6
5
4
3
2
1
0
For the ferrite chip bead whichwithstanding current over 1.5A, as the
operating temperature over 85 , the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
2A
1.5A
1A
Storage Conditions
85
125
Storage Condition : Less than 40 and 60% RH
Environment Temperature+ Tem perature(°C)
Storage Time : 6 months Max.
Soldering and Mounting
Recommended PC Board Pattern
Chip Size
Land Patterns For Reflow Soldering
Type
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
G(mm)
WLBD
0.6±0.0
3
0.30±0.0
3
0.30±0.0
3
0.15±0.0
5
0603
0.35
0.30
0.40
PC board shold be designed so that products can prevent
damage from mechanical stress when warping the board.
Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
Page 6 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering
iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Use a 20 watt soldering iron with tip
diameter of 1.0mm
Limit soldering time to 4~5sec.
Never contact the ceramic with
the iron tip
1.0mm tip diameter (max)
Preheat circuit and products to 150
350 tip temperature (max)
Reflow Soldering
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
TP(260
/ 10s max.)
350
150
tp(245° C / 20~40s.)
217
So
60~150s
200
150
60~180s
Gradual cooling
Over 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Iron Soldering times 1 times
max
Reflow times: 3 times max
Fig.1
Upper limit
Accordingly increasing the solder volume, the mechanical
stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance.
Solder shall be used not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product
Recommendable
t
Page 7 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Packaging Specification
Reel Dimension
COVER TAPE
2.0±0.5
Type
A(mm)
B(mm)
C(mm)
D(mm)
7’’x8mm 10±1.5
50 or more
13±0.2
178±2
A
EMBOSSED CARRIER
TAPE AND REEL SPECIFICATIONS
Paper carrier
0
P :4±0.1
t
Size
B0(mm)
A0(mm)
0.40 0.06
K0(mm)
0.45max
P(mm)
t(mm)
2.0
0.70 0.06
0.45max
0603
0.05
P
A0
Ko
F
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
165° to180°
Topcover tape
Room Temp. Room Humidity
Room atm
(hPa)
860 ~ 1060
Tearing Speed
Mm/min
300
Base tape
(c)
(%)
45 ~ 85
5 ~ 35
Application Notice
Storage Conditions(component level)
To maintain the solder ability of terminal electrodes:
1. Temperature and humidity conditions: Less than 40 and 60% RH.
2. Recommended products should be used within 12 months from the time of delivery.
3. The packaging material should be kept where no chlorine or sulfur exists in the air.
Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration
and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual
components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Page 8 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Impedance Frequency Characteristics(Typical)
WLBD0603K2U220TP
WLBD0603K2U330TP
WLBD0603K2U800TP
WLBD0603K2U121TP
WLBD0603K2U241TP
WLBD0603K2U601TP
Page 9 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Impedance Frequency Characteristics(Typical)
WLBD0603K2U102TP
WLBD0603K2U600TP
WLBD0603K2U241TP
WLBD0603K2U121TP
WLBD0603K2U471TP
WLBD0603K2601TP
Page 10 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Impedance Frequency Characteristics(Typical)
WLBD0603K2U100TP
WLBD0603K2U220TP
WLBD0603K2U330TP
WLBD0603K2U470TP
WLBD0603K2U560TP
WLBD0603K2U800TP
Page 11 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
Approval Sheet
Impedance Frequency Characteristics(Typical)
WLBD0603K2U121TP
Page 12 of 12
ASC_ WLBD0603 P Series_V1.0
JUL – 2018
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