WLBD0603HC [WALSIN]

Combination of high frequency noise suppression with capability of handing high current;
WLBD0603HC
型号: WLBD0603HC
厂家: Walsin Technology    Walsin Technology
描述:

Combination of high frequency noise suppression with capability of handing high current

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中文:  中文翻译
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Approval Sheet  
WLBD0603HC  
Chip Bead SERIES  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  
Approval Sheet  
FEATURES  
1. Combination of high frequency noise suppression with capability of handing high current.  
2. Low DC Resistance.  
SHAPE and DIMENSION  
Chip Size  
A
B
C
0.60±0.03  
0.30±0.03  
0.30±0.03  
0.1~0.2  
D
Units: mm  
Ordering Information  
WL  
BD  
0603  
HC  
U
300  
T
H
Product  
Code  
Series  
Dimensions  
Series  
extension  
Tolerance  
Value  
Packing  
Code  
WL:  
Inductor  
BD: Chip  
Bead.  
0.6 * 0.3 mm  
Refer to  
characteristic  
300 =30 OHM  
301 =300 OHM  
102 =1000OHM  
T = 7"  
H = high  
current  
U: ±25%  
0603 :EIA 0201  
Paper Tape  
Page 2 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  
Approval Sheet  
PART NUMBER AND CHARACTERISTICS TABLE  
WLBD0603HC series  
Impedance ()  
Test Freq.  
DCR()  
(Max.)  
Rated Current  
Walsin Part Number  
+/-25%  
(MHz)  
(mA)  
WLBD0603HCU100TH  
WLBD0603HCU220TH  
WLBD0603HCU330TH  
WLBD0603HCU470TH  
WLBD0603HCU800TH  
WLBD0603HCU121TH  
WLBD0603HCU241TH  
WLBD0603HCU331TH  
10  
100  
100  
100  
100  
100  
100  
100  
100  
0.050  
0.065  
0.090  
0.120  
0.180  
0.230  
0.400  
0.500  
1000  
1000  
750  
500  
500  
450  
350  
300  
22  
33  
47  
80  
120  
240  
330  
Test Level250 mV  
HP4991A RF Impedance / Material Analyzer  
HP4338A/B Milliohm meter  
Test Instruments:  
Agilent 5071C S-Parameter Network Analyzer  
HP6632B System DC Power Supply  
GENERAL TECHNICAL DATA  
Operating temperature range- 40~ +85℃  
Storage ConditionLess than 40and 70% RH  
Storage Time6 months  
Page 3 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  
Approval Sheet  
RELIABILITY AND TEST CONDITION  
Test item  
Test condition  
Criteria  
1. Temperature:-40 ~ 85For 30  
minutes each  
1. No mechanical damage  
2. Impedance should be within  
±30% of the initial value  
2. Cycle: 100 cycles  
Temperature Cycle  
3. Measurement: at ambient  
temperature 24 hours after test  
completion  
1. Temperature: 85 ± 5℃  
2. Testing time: 1000 hours  
3. Applied current: Full rated current  
4. Measurement: At ambient  
temperature 24 hours after test  
completion  
1. No mechanical damage  
2. Impedance should be within  
±30% of the initial value  
Operational Life  
1. Temperature: 40± 2℃  
2. Humidity: 90-95 % RH  
3. Testing time: 1000 hrs  
4. Measurement: at ambient  
temperature 24 hours after test  
completion  
1. No mechanical damage  
2. Impedance should be within  
±30% of the initial value  
Biased Humidity  
Solderability  
1. More than 95 % of terminal  
electrode should be covered  
with new solder  
1. Solder temperature : 235 ± 5℃  
2. Flux : Rosin  
3. DIP time : 5 ± 1 sec  
2. No mechanical damage  
1. More than 95 % of terminal  
electrode should be covered  
with new solder  
1. Solder temperature : 260 ± 5℃  
2. Flux : Rosin  
Resistance to Solder Heat  
2. No mechanical damage  
3. Impedance should be within ±30  
% of the initial value  
3. DIP time : 10 ± 1 sec  
1. Reflow temperature : 245It shall  
be soldered on the substrate  
applying direction parallel to the  
substrate  
1. No mechanical damage  
2. Soldering the products on PCB  
after the pulling test force > 2 N  
Adhesive Test  
Rated Current  
2. Apply force(F) : 2N  
Test time : 10 sec  
At ambient temperature & humidity  
Testing time:5 minutes  
Product surface tempbelow room  
temperature plus 40℃  
( under full rated current )  
Page 4 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  
Approval Sheet  
Chip Size  
Land Patterns For Reflow Soldering  
Type  
A(mm)  
B(mm)  
C(mm)  
D(mm)  
E(mm)  
F(mm)  
G(mm)  
WLBD  
0.6±0.0  
3
0.30±0.0  
3
0.30±0.0  
3
0.15±0.0  
5
0603  
0.35  
0.30  
0.40  
Packaging Specification  
Reel Dimensions  
7” Reel Packaging Quantity  
0603  
Part Size  
(EIA Size)  
(0201)  
Qty.(pcs)  
BOX  
15,000  
5 reels / inner box  
Page 5 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  
Approval Sheet  
Recommended Soldering Conditions  
Land Patterns for Reflow Soldering  
Solder Land Information  
Size(mm)  
A
B
C
0.20 0.30  
0.80 0.90  
0.20 0.30  
0603  
(EIA 0201)  
(0.008 0.012)  
(0.031 0.035)  
(0.008 0.012)  
Page 6 of 12  
ASC_ WLBD0603HC Series_V1.0  
NOV – 2018  

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