WLFI1608Z0M2R2PB [WALSIN]

Ferrite Chip Inductors;


型号：	WLFI1608Z0M2R2PB
厂家：	Walsin Technology
描述：	Ferrite Chip Inductors
文件：	总7页 (文件大小：592K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Approval Sheet

WLFI1608

Ferrite Chip Inductors

*Contents in this sheet are subject to change without prior notice.

Page 1 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

FEATURES

General purpose chip ferrite power inductor for high integration electronics device.

Ceramic structure provides high reliability、high productivity.

RoHS compliance.

APPLICATIONS

1. EMI solution for I/O ports.

2. RF choke for DC power supplying to LNA or external antenna.

SHAPE and DIMENSION

Chip Size

1.60±0.15

0.80±0.15

0.30±0.20

Units: mm

Ordering Information

1608

R22

Product

Code

Series

Dimensions

Series

extension

Tolerance

Value

Packing

Code

FI : Ferrite

WL:

Inductor

1.6 * 0.8 mm

Z0 :STD

R22 = 0.22 uH

2R2 = 2.2 uH

100 = 10 uH

T = 7"

B:STD

M: 20%

Chip Inductor

1608 :EIA 0603

Paper Tape

P = 7”

Plastic Tape

Page 2 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

Electrical Characteristics

● WLFI1608 series

Rated Current

Inductance

Test Frequency

(MHz)

SRF

(MHz) min.

Walsin Part Number

(uH)

Tolerance

Resistance

(Ω) max.

0.30

0.50

0.60

0.80

0.85

1.00

1.35

1.55

1.70

2.10

0.60

0.80

0.95

1.15

1.55

2.10

2.55

(mA) max.

WLFI1608Z0M47NTB

WLFI1608Z0M68NTB

WLFI1608Z0M82NTB

WLFI1608Z0MR10TB

WLFI1608Z0MR12TB

WLFI1608Z0MR15TB

WLFI1608Z0MR18TB

WLFI1608Z0MR22TB

WLFI1608Z0MR27TB

WLFI1608Z0MR33TB

WLFI1608Z0MR39TB

WLFI1608Z0MR47TB

WLFI1608Z0MR56TB

WLFI1608Z0MR68TB

WLFI1608Z0MR82TB

WLFI1608Z0M1R0TB

WLFI1608Z0M1R5TB

WLFI1608Z0M1R8TB

WLFI1608Z0M2R2TB

WLFI1608Z0M3R3TB

WLFI1608Z0M4R7TB

WLFI1608Z0M100TB

0.047

0.068

0.082

0.10

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.56

0.68

0.82

1.0

60mV / 50MHz

60mV / 25MHz

60mV / 10MHz

60mV / 2MHz

260

250

245

240

205

180

165

150

136

125

110

105

1.5

1.8

2.2

3.3

4.7

NOTE :TOLERANCE M= ±20%

Characteristic Curve

Q - Frequency

Inductance - Current

Page 3 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

Test condition & Requirements

Item

Performance

Test Condition

-40~+105℃

(Including self-temperature rise)

Operating Temperature

For long storage conditions, please see the

Application Notice

Transportation

Storage Temperature

-40~+105℃

(on board)

Impedance (Z)

Inductance (Ls)

Q Factor

Agilent4291

Agilent E4991

Agilent4287

Agilent16192

Agilent 4338

Refer to standard electrical characteristics list

DC Resistance

DC Power Supply

Over Rated Current requirements, there will

be some risk

Rated Current

1. Applied the allowed DC current.

2. Temperature measured by digital surface

thermometer.

Rated Current < 1A ΔT 20℃Max

Rated Current ≧ 1A ΔT 40℃Max

Temperature Rise Test

Preheat: 150℃,60sec.

Solder: Sn99.5%-Cu0.5%

Solder temperature: 260±5℃

Flux for lead free: Rosin. 9.5%

Temperature ramp/immersion and immersion

rate: 25±6 mm/s

Appearance：No damage.

Dip time: 10±1sec.

Impedance：within±15% of initial value

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not exceed the specification value

Depth: completely cover the termination.

Resistance to Soldering

Heat

Preheating Dipping Natural cooling

260° C

150° C

10±1.0

second

Preheat: 150℃,60sec.

Preheating Dipping Natural cooling

Solder: Sn99.5%-Cu0.5%

More than 95% of the terminal

245° C

Solder temperature: 245±5℃

Flux for lead free: Rosin. 9.5%

Depth: completely cover the termination.

Dip time: 4±1sec.

Solderability

electrode should be covered

150° C

4±1

with solder.

second

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Appearance：No damage.

Component mounted on a PCB apply a force

Impedance：within±15% of initial value

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

exceed the specification value

(>0805:1kg <=0805:0.5kg)to the side of

Terminal strength

device being tested. This force shall be

applied for 60 +1 seconds. Also the force

shall be applied gradually as not to shock the

component being tested.

Shall be mounted on a FR4 substrate of the

following dimensions:>=0805:40x100x1.2mm

<0805:40x100x0.8mm

Bending depth:>=0805:1.2mm

<0805:0.8mm

Appearance：No damage.

Impedance：within±10% of initial value

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

Bending

Duration of 10 sec for a min.

RDC：within ±15% of initial value and shall not exceed the specification value

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Oscillation Frequency: 10～2K～10Hz for 20

minutes

Appearance：No damage.

Impedance：within±15% of initial value

Inductance：within±10% of initial value

Vibration Test

Equipment： Vibration checker

Total Amplitude:1.52mm±10%

Testing Time : 12 hours(20 minutes, 12 cycles

each of 3 orientations)。

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not exceed the specification value

Page 4 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

Test condition:

Peak

Normal

Velocity

Appearance：No damage.

Impedance：within±15% of initial value

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not exceed the specification value

Type

Value

duration Wave form change

(g’s)

(D) (ms)

0.5

(Vi)ft/sec

15.4

Shock

SMD

Lead

1,500

100

Half-sine

12.3

Item

Performance

Test Condition

Preconditioning: Run through IR reflow

for 2 times.( IPC/JEDEC J-STD-020D

Classification Reflow Profiles)

Temperature: 125±2℃(bead),

85±2℃(inductor)

Life test

Applied current: rated current.

Duration: 1000±12hrs.

Appearance: no damage.

Measured at room temperature after

placing for 24±2 hrs.

Impedance: within±15%of initial value.

Inductance: within±10%of initial value.

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not exceed the specification value

Preconditioning: Run through IR reflow

for 2 times.( IPC/JEDEC J-STD-020D

Classification Reflow Profiles)

Humidity: 85±2%R.H.

Temperature: 85±2℃.

Load Humidity

Duration: 1000hrs Min. with 100% rated

current.

Measured at room temperature after

placing for 24±2 hrs.

Preconditioning: Run through IR reflow

for 2 times.( IPC/JEDEC J-STD-020D

Classification Reflow Profiles)

Condition for 1 cycle

Appearance: no damage.

Step1: -40±2℃ 30±5 min.

Step2: 25±2℃ ≦0.5min

Step3: +105±2℃ 30±5min.

Number of cycles: 500

Measured at room temperature after

placing for 24±2 hrs.

Impedance: within±15%of initial value.

Inductance: within±10%of initial value.

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not exceed the specification value

Thermal shock

Chip Inductor Only

Test Voltage:100±10%V for 30Sec.

IR>1GΩ

Insulation Resistance

Derating

**Derating Curve

For the ferrite chip bead which withstanding current over 1.5A, as the

operating temperature over 85℃, the derating current information is

necessary to consider with. For the detail derating of current, please

refer to the Derated Current vs. Operating Temperature curve.

1.5A

125

Environment Temperature+△ Temperature(°C)

Soldering and Mounting

L (mm)

G (mm)

H (mm)

WLFI1608

2.60

0.60

0.80

Page 5 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be

avoided, the preferred technique is the utilization of hot air soldering tools.

Note.

If wave soldering is used ,there will be some risk.

Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

Lead Free Solder re-flow

Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)

Soldering Iron:

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be

employed the following precautions are recommended. for Iron Soldering in Figure 2.

‧Preheat circuit and products to 150℃

‧350℃ tip temperature (max)

‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm

‧1.0mm tip diameter (max)

‧Limit soldering time to 4~5sec.

Packaging Specification

■Material of taping is paper

:4±0.1

Size

Bo(mm) Ao(mm) Ko(mm) P(mm)

t(mm)

060303 0.70±0.06 0.40±0.06 0.45max 2.0±0.05 0.45max

100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.05 0.60±0.03

:4±0.1

:2±0.1

Size

Bo(mm)

Ao(mm)

Ko(mm)

P(mm)

4.0±0.10

t(mm)

160808

201209

1.80±0.05 0.96+0.05/-0.03 0.95±0.05

0.95±0.05

2.10±0.05

1.30±0.05

0.95±0.05

■Material of taping is plastic

:2±0.05

Po:4±0.1

Size

Bo(mm) Ao(mm) Ko(mm) P(mm)

t(mm) D1(mm)

201212 2.10±0.10 1.28±0.10 1.28±0.10 4.0±0.10 0.22±0.05 1.0±0.10

321611 3.35±0.10 1.75±0.10 1.25±0.10 4.0±0.10 0.23±0.05 1.0±0.10

322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10

321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10

SECTION A-A

Page 6 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

Approval Sheet

The force for tearing off cover tape is 15 to 60 grams in the arrow

direction under the following conditions

165° to180°

Top cover tape

Room

Temp.

(℃)

Room

Humidity

(%)

Tearing

Speed

mm/min

Room atm

(hPa)

Base tape

5~35

45~85

860~1060

300

Products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.

Quantity per reel ： 4k pcs / reel

Page 7 of 7

ASC_ WLFI1608 Series_V1.0

SEP - 2017

WLFI1608Z0M2R2PB [WALSIN]

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