WLPH252010_S [WALSIN]
SMD Molded Power Inductors;
| 型号： | WLPH252010_S |
| 厂家： | 
Walsin Technology |
| 描述： | SMD Molded Power Inductors |
| 文件： | 总8页 (文件大小：521K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WLPH252010_S Series (High Current)
SMD Molded Power Inductors
*Contents in this sheet are subject to change without prior notice.
Page 1 of 8
ASC_WLPH252010_S Series
2019.03
Features
1. High saturation current realized by material properties and structure design
2. Low DC resistance to achieve high conversion efficiency and lower temperature rising
3. Low Profile: 2.5 mm × 2.0 mm × 1.0 mm.
4. Magnetically shielded structure to accomplish high resolution in EMC protection.
5. Halogen free, Lead Free, RoHS Compliance.
Applications
1. WLPH Series is generic applied in portable DC to DC converter line.
2. Smart phone, PAD applications high current and low profile power supplier.
3. DC/DC converter
4. Thin-type power supply module,
Shape and Dimension
Code
Dimensions(mm)
2.5 ± 0.2
L
W
T
2.0 ± 0.2
1.0 MAX.
0.6 ±0.3
e
Recommend Pattern
B
A
B
C
[mm]
[mm]
[mm]
2.0
1.2
2.8
A
(Unit: mm)
C
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ASC_WLPH252010_S Series
2019.03
Ordering Information
WL
PH
2520
10
M
R24
P
S
Product
Code
Series
Dimensions
Thickness
Tolerance
Value
Packing Code
WL:
Inductor
SMD
molded
power
2.5 * 2.0mm
1.0mm
R24=0.24uH
2R2=2.20uH
P=7” Reeled
(Embossed tape)
S:High Current
M: ± 20%
inductor.
Electrical Characteristics
WLPH252010_S series
RDC
DC Resistance
(mΩ)
Isat[A]
Saturation Current
Irms[A]
Heat Rating Current
Tolerance
Walsin Part Number
L(uH)
(±%)
(Typ) Max
Typ
Max
Typ
Max
WLPH252010MR33PS
WLPH252010MR47PS
WLPH252010M1R0PS
WLPH252010M2R2PS
0.33
0.47
1
20
20
20
20
(17) 22
7.8
7.0
5.6
4.8
(23) 29
(41) 52
(88)110
6.6
4.4
3.3
6.0
4.0
3.0
5.2
3.4
2.4
4.4
3.1
2.1
2.2
1: Customized design is available, please contact us.
2: All test referenced to 26℃ ambient
3: Inductance tolerance +/- 20%
4: Inductance is measured with Agilent® LCR meter 4285A (or equivalent) at 1MHz/1V.
5: DC resistance is measured with HIOKI® micro-ohm meter RM3542 or equivalent.
6: Isat means that DC current will cause a 30% inductance reduction from initial value.
7: Irms means that DC current will cause coil temp. rising to 40℃ whichever is smaller.
General specifications
Temperature Specifications
Operating Temperature range
Storage Temperature range
: -40℃ to +125℃
: -50℃ to +125℃
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ASC_WLPH252010_S Series
2019.03
Electrical Properties
Page 4 of 8
ASC_WLPH252010_S Series
2019.03
Reliability Testing
Test item
Test condition
Criteria
1. More than 95 % of terminal
electrode should be covered with
new solder
1. Solder temperature : 260 ± 5℃
2. Flux : Rosin
Resistance to Solder Heat
2. No mechanical damage
3. DIP time : 10 ± 1 sec
3. Inductance value should be
within ± 20 % of the initial value
1. Reflow temperature : 245℃ It shall be
Soldered on the substrate applying
direction parallel to the substrate
2. Apply force(F) : 5 N
1. No mechanical damage
2. Soldering the products on PCB
after the pulling test force > 5 N
Adhesive Test
3. Test time : 10 sec
1. Temperature:-50 ~ 125℃ For 30
minutes each
1. No mechanical damage
2. Cycle: 500 cycles
2. Inductance should be within
Temperature Cycle
3. Measurement: At ambient temperature ±20% of the initial value
24 hours after test completion
1. Temperature: 85 ± 2℃
2. Testing time: 500 hours
1. No mechanical damage
Dry Heat Test
3. Applied current: Full rated current
2. Inductance should be within ±
4. Measurement: At ambient temperature 20% of the initial value
24 hours after test completion
1. Temperature: 60 ± 2℃
2. Humidity: 90-95 % RH
1. No mechanical damage
2. Inductance should be within
±20% of the initial value
3. Applied current: Full rated current
4. Testing time: 500 hours
Humidity Test
5. Measurement: At ambient temperature
24 hours after test completion
Page 5 of 8
ASC_WLPH252010_S Series
2019.03
Taping Package and Label Marking
Carrier tape dimensions
A0
B0
2.8±0.1
K0
1.35±0.1
t
mm
2.25±0.05
0.22±0.05
Taping reel dimensions
PART SIZE
(EIA SIZE)
2520(1008)
Qty.(pcs)
BOX
3,000
5
reels / inner box
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ASC_WLPH252010_S Series
2019.03
Taping specifications
There shall be the portion having no product in both the head and the end of taping, and there shall be
the cover tape in the head of taping.
Label Marking
The label specified as follows shall be put on the side of reel.
(1) Part No
(2) Quantity
(3) Lot No
* Part No. And Quantity shall be marked on outer packaging.
Quantity of products in the taping package
(1)Standard quantity：3000pcs/Reel
(2)Shipping quantity is a multiple of standard quantity.
Precautions for Handling
Precaution for handling of substrate
Do not exceed to bend the board after soldering this product extremely. (reference examples)
• Mounting place must be as far as possible from the position, which is close to the break line of
board, or on the line of large holes of board.
• Do not bend extremely the board, in mounting another components.
If necessary, use back-up pin (support pin) to prevent from bending extremely.
• Do not break the board by hand. We recommend to use the machine or the jig to break it.
Precaution for soldering
Note that this product will be easily damaged by rapid heating, rapid cooling or local heating.
Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and
gradual cooling.
Recommendable reflow soldering
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ASC_WLPH252010_S Series
2019.03
Reference IPC-020c-5-1
Profile Feature
Pb free Assembly
Average Ramp Rate
3 ℃/second max
(Ts max to Tp)
Preheat
-
-
-
Temperature Min (Tsmin
Temperature Min (Tsmax
Time(tsmin to tsmin
)
150℃
)
200℃
)
60-180 seconds
Time maintained above:
-
-
Temperature (TL)
Time (tL)
217℃
60-150 seconds
260℃ +0/-5 ℃
Peak Temperature (Tp)
Time within 5 ℃ of actual Peak
Temperature (Tp)
20-40 seconds
Ramp-Down Rate
6 ℃/second max.
Time 25℃ to Peak Temperature
8 minutes max
Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
(1)The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under
30 W.
(2)The soldering gun tip shall not touch this product directly.
Soldering volume
Note that excess of soldering volume will easily get crack the body of this product.
Taping Package Storage Condition
Storage Temperature : 5 to 40 ℃
Relative Humidity: < 65%RH
Storage Time : 12 months max.
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ASC_WLPH252010_S Series
2019.03
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