WE32K32-120G1UQ [WEDC]

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68;
WE32K32-120G1UQ
型号: WE32K32-120G1UQ
厂家: WHITE ELECTRONIC DESIGNS CORPORATION    WHITE ELECTRONIC DESIGNS CORPORATION
描述:

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总14页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
WE32K32-XXX  
White Electronic Designs  
32Kx32 EEPROM MODULE, SMD 5962-94614  
FEATURES  
Data Retention at 25°C, 10 Years  
Write Endurance, 10,000 Cycles  
Access Times of 80*, 90, 120, 150ns  
MIL-STD-883 Compliant Devices Available  
Packaging:  
Organized as 32Kx32; User Configurable 64Kx16  
or 128Kx8  
• 68 lead, Hermetic CQFP (G2U), 122ꢀ4mm  
(0ꢀ880") square, 3ꢀ56mm (0ꢀ140") height  
(Package 510)ꢀ  
Commercial, Industrial and Military Temperature  
Ranges  
• 68 lead, Hermetic CQFP (G1U)1, 23ꢀ9mm  
(0ꢀ940") square, 3ꢀ56mm (0ꢀ140") high (Pack  
age 519)  
Automatic Page Write Operation  
Page Write Cycle Time: 10ms Max  
Data Polling for End of Write Detection  
Hardware and Software Data Protection  
TTL Compatible Inputs and Outputs  
5 Volt Power Supply  
• 68 lead, Hermetic CQFP (G1T), 23ꢀ9mm  
(0ꢀ940") square, 4ꢀ06mm (0ꢀ160"), (Package  
524)  
• 66-pin, PGA Type, 1ꢀ075" square, Hermetic  
Ceramic HIP (Package 400)  
Low Power CMOS, 10mA Standby Typical  
Built-in Decoupling Caps and Multiple Ground  
Pins for Low Noise Operation  
*
80nsspeedisnotfullycharacterizedandissubjecttochangeor  
cancellation without noticeꢀ  
NOTE 1: Package not recommended for new design  
FIGꢀ 1 PIN CONFIGURATION FOR WE32K32N-XH1X  
TOP VIEW  
PIN DESCRIPTION  
1
12  
23  
34  
45  
56  
I/O0-31 Data Inputs/Outputs  
I/O  
8
9
WE  
2
I/O15  
I/O14  
I/O13  
I/O12  
OE  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
A0-14  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
I/O  
CS2  
CS  
4
4
I/O10  
GND  
I/O11  
WE  
Output Enable  
Power Supply  
A
13  
14  
A
6
7
I/O27  
VCC  
A
A10  
A11  
A12  
VCC  
A
A
3
4
5
3
3
A0  
A1  
A2  
GND  
NC  
Ground  
NC  
NC  
NC  
NC  
NC  
A
Not Connected  
WE  
1
A
8
9
A
BLOCK DIAGRAM  
I/O  
I/O  
I/O  
I/O  
7
A
WE  
CS  
I/O23  
I/O22  
I/O21  
I/O20  
WE3 CS3  
WE4 CS4  
WE1 CS1  
WE2 CS2  
OE  
I/O  
I/O  
I/O  
0
CS  
NC  
I/O  
1
6
I/O16  
I/O17  
I/O18  
A
0-14  
1
2
5
4
GND  
I/O19  
32K x 8  
32K x 8  
32K x 8  
32K x 8  
3
11  
22  
33  
44  
55  
66  
8
8
8
8
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
1
White Electronic Designs Corporation • (602) 437-1520 • wwwꢀwhiteedcꢀcom  
October 2002 Revꢀ 3  
WE32K32-XXX  
White Electronic Designs  
FIGꢀ 2 PIN CONFIGURATION FOR WE32K32-XG2UX, WE32K32-XG1UX1,  
AND WE32K32-XG1TX  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31 Data Inputs/Outputs  
A0-14  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
9
8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
7
I/O16  
I/O17  
I/O18  
I/O19  
I/O20  
I/O21  
I/O22  
I/O23  
GND  
I/O24  
I/O25  
I/O26  
I/O27  
I/O28  
I/O29  
I/O30  
I/O31  
VCC  
GND  
NC  
Not Connected  
GND  
I/O  
8
9
I/O  
I/O10  
I/O11  
I/O12  
I/O13  
I/O14  
I/O15  
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
BLOCK DIAGRAM  
WE3 CS3  
WE4 CS4  
WE2 CS2  
WE1 CS1  
OE  
A
0-14  
32K x 8  
32K x 8  
32K x 8  
32K x 8  
8
8
8
8
I/O16-23  
I/O24-31  
I/O8-15  
I/O0-7  
Note 1: Package not recommended for new design  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
2
WE32K32-XXX  
White Electronic Designs  
TRUTH TABLE  
WE Mode  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
TA  
Unit  
°C  
°C  
V
CS  
H
LL H  
LH  
X
OE  
X
Data I/O  
High Z  
X
Read  
Standby  
Data  
Operating Temperature  
Storage Temperature  
Signal Voltage Relative to GND  
Voltage on OE and A9  
NOTE:  
-55 to +125  
-65 to +150  
-0%6 to +6%25  
-0%6 to +13%5  
Out  
In  
TSTG  
VG  
L
Write  
X
Data  
Out Disable  
Write  
H
X
LX  
High Z/Data Out  
V
X
X
H
Inhibit  
Stresses above those listed under "Absolute Maximum Ratings"  
may cause permanent damage to the device% This is a stress  
rating only and functional operation of the device at these or any  
other conditions above those indicated in the operational sections  
of this specification is not implied% Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability%  
CAPACITANCE  
(TA = 25° C)  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
Condition  
Max Unit  
Parameter  
Symbol  
VCC  
VIH  
Min  
4%5  
2%0  
-0%5  
-55  
-40  
Max  
5%5  
Unit  
V
Address Input Capacitance  
OE Capacitance  
CAD  
COE  
VIN = 0V, f = 1%0MHz 50 pF  
Supply Voltage  
Input High Voltage  
Input Low Voltage  
Operating Temp% (Mil%)  
Operating Temp% (Ind%)  
VCC + 0%3  
+0%8  
V
CS1-4 Capacitance  
WE1-4 Capacitance  
CCS  
CWE  
CI/O  
VIN = 0V, f = 1%0MHz 20 pF  
VIN = 0V, f = 1%0MHz 20 pF  
VIN = 0V, f = 1%0MHz 20 pF  
VIL  
V
TA  
+125  
°C  
°C  
Data I/  
O Capacitance  
TA  
+85  
This parameter is guaranteed by design but not tested%  
DC CHARACTERISTICS  
(VCC = 5ꢀ0V, GND = 0V, TA = -55°C TO +125°C)  
Parameter  
Symbol  
Conditions  
-80  
-90  
-120  
-150Units  
Min Max Min Max Min Max Min Max  
Input Leakage Current  
Output Leakage Current  
ILI  
VCC = 5%5, VIN = GND to VCC  
10  
10  
10  
10  
10  
10  
10  
10  
µA  
µA  
mA  
mA  
V
ILO x 32 CS = VIH, OE = VIH, VOUT = GND to VCC  
Operating Supply Current x 32 Mode ICC x 32 CS = VIL, OE = VIH, f = 5MHz  
320  
2%5  
250  
2%5  
200  
2%5  
150  
2%5  
Standby Current  
ISB  
VOL  
VOH  
CS = VIH, OE = VIH, f = 5MHz  
IOL = 2%1mA, VCC = 4%5V  
IOH = -400µA, VCC = 4%5V  
Output Low Voltage  
Output High Voltage  
0%45  
0%45  
0%45  
0%45  
2%4  
2%4  
2%4  
2%4  
V
NOTE: DC test conditions: VIH = VCC -0%3V, VIL = 0%3V  
FIGꢀ 3 AC TEST CIRCUIT  
AC TEST CONDITIONS  
Typ  
Parameter  
Unit  
V
Input Pulse Levels  
VIL = 0, VIH = 3%0  
Input Rise and Fall  
5
ns  
V
Input and Output Reference Level  
Output Timing Reference Level  
1%5  
1%5  
V
Notes:  
VZ is programmable from -2V to +7Vꢀ  
IOL & IOH programmable from 0 to 16mAꢀ  
Tester Impedance Z0 = 75 Wꢀ  
VZ is typically the midpoint of VOH and VOLꢀ  
IOL & IOH are adjusted to simulate a typical resistive load circuitꢀ  
ATE tester includes jig capacitanceꢀ  
3
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
WRITE  
erationꢀ Each subsequent WE transition from high to  
low that occurs before the completion of the 150 µsec  
time out will restart the timer from zeroꢀ The operation  
of the timer is the same as a retriggerable one-shotꢀ  
A write cycle is initiated when OE is high and a low pulse  
is on WE or CS with CS or WE lowꢀ The address is  
latched on the falling edge of CS or WE whichever oc-  
curs lastꢀ The data is latched by the rising edge of CS  
or WE, whichever occurs firstꢀ A byte write operation  
will automatically continue to completionꢀ  
WRITE CYCLE TIMING  
Figures 4 and 5 show the write cycle timing relation-  
shipsꢀ A write cycle begins with address application,  
write enable and chip selectꢀ Chip select is accom-  
plished by placing the CS line lowꢀ Write enable con-  
sists of setting the WE line lowꢀ The write cycle begins  
when the last of either CS or WE goes lowꢀ  
The WE line transition from high to low also initiates an  
internal 150 µsec delay timer to permit page mode op-  
AC WRITE CHARACTERISTICS  
(VCC = 5ꢀ0V, GND = 0V, TA = -55°C TO +125°C)  
WRITE  
CYCLE  
-80-90-120-150  
Write Cycle Parameter  
Symbol  
tWC  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Write Cycle Time, TYP = 6ms  
Address Set-up Time  
10  
10  
10  
10  
tAS  
0
100  
0
0
100  
0
30  
150  
0
30  
150  
0
Write Pulse Width (WE or CS)  
Chip Select Set-up Time  
Address Hold Time  
tWP  
tCS  
tAH  
50  
0
50  
0
100  
10  
0
100  
10  
0
Data Hold Time  
tDH  
Chip Select Hold Time  
Data Set-up Time  
tCSH  
tDS  
0
0
50  
50  
10  
10  
50  
50  
10  
10  
100  
50  
10  
10  
100  
50  
10  
10  
Write Pulse Width High  
Output Enable Set-up Time  
Output Enable Hold Time  
tWPH  
tOES  
tOEH  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
4
WE32K32-XXX  
White Electronic Designs  
FIGꢀ 4 WRITE WAVEFORMS WE CONTROLLED  
t
WC  
OE  
t
t
OEH  
OES  
ADDRESS  
t
CSH  
t
AS  
t
AH  
CS 1-4  
WE 1-4  
t
CS  
t
WP  
t
WPH  
DH  
t
t
DS  
DATA IN  
FIGꢀ 5 WRITE WAVEFORMS CS CONTROLLED  
tWC  
OE  
tOEH  
t OES  
ADDRESS  
tCSH  
tAS  
tAH  
WE1 - 4  
CS1 - 4  
tCS  
tWP  
t WPH  
t DH  
tDS  
DATA IN  
5
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
READ  
The WE32K32-XXX stores data at the memory loca-  
tion determined by the address pinsꢀ When CS and  
OE are low and WE is high, this data is present on the  
outputsꢀ When CS and OE are high, the outputs are in  
a high impedance stateꢀ This 2 line control prevents  
bus contentionꢀ  
AC READ CHARACTERISTICS (SEE FIGURE 6)  
(VCC = 5ꢀ0V, GND = 0V, TA = -55°C TO +125°C)  
READ CYCLE  
Symbol  
-80-90-12U0-n15it0  
Parameter  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Read Cycle Time  
tRC  
tACC  
tACS  
tOH  
80  
90  
120  
150  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
CS Access Time  
80  
80  
90  
90  
120  
120  
150  
150  
Output Hold from Add% Change, OE or CS  
Output Enable to Output Valid  
Chip Select or OE to Output in High Z  
0
0
0
0
tOE  
40  
40  
50  
50  
85  
70  
85  
70  
tDF  
FIGꢀ 6 READ WAVEFORMS  
t RC  
ADDRESS VALID  
ADDRESS  
CS  
tACS  
tOE  
OE  
NOTES:  
tDF  
1ꢀ OE may be delayed up to tACS - tOE after the falling  
edge of CS without impact on tOE or by tACC - tOE after  
an address change without impact on tACCꢀ  
2ꢀ tCHZ, tOHZ are specified from OE or CS whichever  
occurs first (CL = 5pF)ꢀ  
tACC  
t OH  
HIGH Z  
OUTPUT  
VALID  
OUTPUT  
3ꢀ All I/O transitions are measured ±200 mV from steady  
state with loading as specified in "Load Test Circuitsꢀ"  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
6
WE32K32-XXX  
White Electronic Designs  
DATA POLLING  
The WE32K32-XXX offers a data polling feature  
which allows a faster method of writing to the  
deviceꢀ Figure 7 shows the timing diagram for this  
functionꢀ During a byte or page write cycle, an  
attempted read of the last byte written will result in  
the complement of the written data on D7 (for each  
chipꢀ) Once the write cycle has been completed,  
true data is valid on all outputs and the next cycle  
may beginꢀ Data polling may begin at any time  
during the write cycleꢀ  
DATA POLLING CHARACTERISTICS  
(VCC = 5ꢀ0V, GND = 0V, TA = -55°C TO +125°C)  
Parameter  
Symbol Min Max Unit  
Data Hold Time  
OE Hold Time  
tDH  
tOEH  
tOE  
10  
10  
ns  
ns  
ns  
ns  
OE To Output Valid  
Write Recovery Time  
100  
tWR  
0
FIGꢀ 7 DATA POLLING WAVEFORMS  
WE1-4  
CS1-4  
tOEH  
OE  
tOE  
tDH  
I/O7  
HIGH Z  
tWR  
ADDRESS  
7
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
The usual procedure is to increment the least signifi-  
cant address lines from A0 through A5 at each write  
cycleꢀ In this manner a page of up to 64 bytes can be  
loaded in to the EEPROM in a burst mode before be-  
ginning the relatively long interval programming cycleꢀ  
PAGE WRITE OPERATION  
The WE32K32-XXX has a page write operation that al-  
lows one to 64 bytes of data to be written into the device  
and consecutively loads during the internal programming  
periodꢀ Successive bytes may be loaded in the same  
manner after the first data byte has been loadedꢀ An in-  
ternal timer begins a time out operation at each write cycleꢀ  
If another write cycle is completed within 150µs or less, a  
new time out period beginsꢀ Each write cycle restarts the  
delay periodꢀ The write cycles can be continued as long  
as the interval is less than the time out periodꢀ  
After the 150µs time out is completed, the EEPROM  
begins an internal write cycleꢀ During this cycle the  
entire page of bytes will be written at the same timeꢀ  
The internal programming cycle is the same regardless  
of the number of bytes accessedꢀ  
PAGE WRITE CHARACTERISTICS  
(VCC = 5ꢀ0V, GND = 0V, TA = -55°C TO +125°C)  
PAGE MODE WRITE CHARACTERISTICS  
Parameter  
Symbol  
-80-90 -120U-1n5i0t  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Write Cycle Time, TYP = 6ms  
Data Set-up Time  
tWC  
tDS  
10  
10  
10  
10  
ms  
ns  
ns  
ns  
µs  
ns  
50  
0
50  
0
100  
10  
100  
10  
Data Hold Time  
tDH  
Write Pulse Width  
tWP  
tBLC  
tWPH  
100  
100  
150  
150  
Byte Load Cycle Time  
Write Pulse Width High  
150  
150  
150  
150  
50  
50  
50  
50  
FIGꢀ 8 PAGE WRITE WAVEFORMS  
OE  
CS  
tWP  
tBLC  
tWPH  
WE  
tDS  
tDH  
ADDRESS (1)  
VALID  
ADDRESS  
tWC  
VALID DATA  
DATA  
BYTE 0  
BYTE 1  
BYTE 2  
BYTE 3  
BYTE n  
BYTE n + 1  
NOTE:  
1ꢀ Decoded Address Lines must be valid for the duration of the writeꢀ  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
8
WE32K32-XXX  
White Electronic Designs  
FIGꢀ 9  
SOFTWARE BLOCK DATA  
PROTECTION ENABLE ALGORITHM(1)  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA A0  
WRITES ENABLED(2)  
TO  
ADDRESS 5555  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
LOAD LAST BYTE  
ENTER DATA  
TO  
PROTECT STATE  
LAST ADDRESS  
NOTES:  
1ꢀ Data Format: D7 - D0 (Hex);  
Address Format: A14 - A0 (Hex)ꢀ  
2ꢀ Write Protect state will be activated at end of write even if no  
other data is loadedꢀ  
3ꢀ Write Protect state will be deactivated at end of write period  
even if no other data is loadedꢀ  
4ꢀ 1 to 64 bytes of data may be loadedꢀ  
9
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
SOFTWARE DATA PROTECTION  
FIG10  
A software write protection feature may be enabled  
or disabled by the userꢀ When shipped by White  
Microelectronics, the WE32K32-XXX has the  
feature disabledꢀ Write access to the device is  
unrestrictedꢀ  
SOFTWARE BLOCK DATA  
PROTECTION DISABLE ALGORITHM(1)  
To enable software write protection, the user writes  
three access code bytes to three special internal  
locationsꢀ Once write protection has been enabled,  
each write to the EEPROM must use the same  
three byte write sequence to permit writingꢀ After  
setting software data protection, any attempt to  
write to the device without the three-byte command  
sequence will start the internal write timersꢀ No data  
will be written to the device, however, for the  
duration of tWCꢀ The write protection feature can be  
disabled by a six byte write sequence of specific  
data to specific locationsꢀ Power transitions will not  
reset the software write protectionꢀ  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA 80  
TO  
ADDRESS 5555  
LOAD DATA AA  
TO  
ADDRESS 5555  
Each 32KByte block of the EEPROM has indepen-  
dent write protectionꢀ One or more blocks may be  
enabled and the rest disabled in any combinationꢀ  
The software write protection guards against inad-  
vertent writes during power transitions, or unautho-  
rized modification using a PROM programmerꢀ  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA 20  
TO  
ADDRESS 5555  
(3)  
EXIT DATA  
PROTECT STATE  
HARDWARE DATA PROTECTION  
These features protect against inadvertent writes to the  
WE32K32-XXXꢀ These are included to improve reli-  
ability during normal operation:  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
(3)  
LOAD LAST BYTE  
TO  
LAST ADDRESS  
a) VCC power on delay  
As VCC climbs past 3ꢀ8V typical the device will wait  
5msec typical before allowing write cyclesꢀ  
b) VCC sense  
While below 3ꢀ8V typical write cycles are inhibitedꢀ  
c) Write inhibiting  
Holding OE low and either CS or WE high inhibits  
write cyclesꢀ  
d) Noise filter  
Pulses of <8ns (typ) on WE or CS will not initiate a  
write cycleꢀ  
NOTES:  
1ꢀ Data Format: D7 - D0 (Hex);  
Address Format: A14 - A0 (Hex)ꢀ  
2ꢀ Write Protect state will be activated at end of write even if no  
other data is loadedꢀ  
3ꢀ Write Protect state will be deactivated at end of write period  
even if no other data is loadedꢀ  
4ꢀ 1 to 64 bytes of data may be loadedꢀ  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
10  
WE32K32-XXX  
White Electronic Designs  
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)  
27.3 (1.075) 0.25 (0.010) Sꢀ  
PIN 1 IDENTIFIER  
SꢀUARE PAD  
ON BOTTOM  
25.4 (1.0) TYP  
4.34 (0.171)  
MAX  
3.81 (0.150)  
0.13 (0.005)  
1.42 (0.056) 0.13 (0.005)  
0.76 (0.030) 0.13 (0.005)  
2.54 (0.100)  
TYP  
1.27 (0.050) TYP DIA  
15.24 (0.600) TYP  
25.4 (1.0) TYP  
0.46 (0.018) 0.05 (0.002) DIA  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
11  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)  
25.15 (0.990) 0.25 (0.010) Sꢀ  
3.51 (0.140) MAX  
22.36 (0.880) 0.25 (0.010) Sꢀ  
0.25 (0.010) 0.10 (0.002)  
Pin 1  
0.25 (0.010) REF  
R 0.25  
(0.010)  
24.0 (0.946)  
0.25 (0.010)  
0.53 (0.021)  
0.18 (0.007)  
1
/ 7  
1.01 (0.040)  
0.13 (0.005)  
23.87  
(0.940) REF  
DETAIL A  
1.27 (0.050) TYP  
SEE DETAIL "A"  
0.38 (0.015) 0.05 (0.002)  
20.3 (0.800) REF  
The White 68 lead G2U  
CQFP fills the same fit  
and function as the  
JEDEC 68 lead CQFJ or  
68 PLCCꢀ But the G2U  
has the TCE and lead  
inspection advantage of  
the CQFP formꢀ  
0.940"  
TYP  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
12  
WE32K32-XXX  
White Electronic Designs  
PACKAGE 519: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE  
CQFP (G1U)1  
25.27 (0.995) 0.13 (0.005) Sꢀ  
3.56 (0.140) MAX  
23.88 (0.940) 0.25 (0.010) Sꢀ  
0.25 (0.010)  
0.61 (0.024)  
0.15 (0.006)  
0.84 (0.033) REF  
DETAIL A  
SEE DETAIL "A"  
1.27 (0.050)  
0.38 (0.015) 0.05 (0.002)  
20.3 (0.800) REF  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
NOTE 1: Package not recommended for new design  
PACKAGE 524: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE  
CQFP (G1T)  
25.27 (0.995) ± 0.13 (0.005) SQ  
4.06 (0.160) MAX  
23.88 (0.940) ± 0.25 (0.010) SQ  
0.25 (0.010) MAX  
0.83 (0.033)  
± 0.32 (0.013)  
0.84 (0.033) REF  
DETAIL A  
SEE DETAIL "A"  
1.27 (0.050)  
0.38 (0.015) ± 0.05 (0.002)  
20.3 (0.800) REF  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
13  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
WE32K32-XXX  
White Electronic Designs  
ORDERING INFORMATION  
W E 32K32 X - XXX X X X  
WHITE ELECTRONIC DESIGNS CORPꢀ  
EEPROM  
ORGANIZATION, 32K x 32  
User Configurable as 64Kx16 or 128Kx8  
IMPROVEMENT MARK  
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade  
ACCESS TIME (ns)  
PACKAGE TYPE:  
H1 = Ceramic Hex In-line Package, HIP (Package 400)  
G2U = 22%4mm Ceramic Quad Flat Pack, CQFP Low Profile (Package 510)  
G1U1 = 23%9mm Ceramic Quad Flat Pack, CQFP Low Profile (Package 519)  
G1T = 23%9mm Ceramic Quad Flat Pack, CQFP (Package 524)  
DEVICE GRADE:  
Q
M
I
=
=
=
=
MIL-STD-883 Compliant  
Military Screened  
Industrial  
-55°C to +125°C  
-40°C to +85°C  
0°C to +70°C  
C
Commercial  
LEAD FINISH:  
Blank = Gold plated leads  
A
=
Solder dip leads  
NOTE 1: Package not recommended for new design  
DEVICE TYPE  
SPEED  
PACKAGE  
SMD NOꢀ  
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
150ns  
120ns  
90ns  
66 pin HIP (H1)  
66 pin HIP (H1)  
66 pin HIP (H1)  
5962-94614 01HXX  
5962-94614 02HXX  
5962-94614 03HXX  
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
150ns  
120ns  
90ns  
68 lead CQFP/J (G2U)  
68 lead CQFP/J (G2U)  
68 lead CQFP/J (G2U)  
5962-94614 01HZX  
5962-94614 02HZX  
5962-94614 03HZX  
1
1
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
32K x 32 EEPROM Module  
150ns  
120ns  
90ns  
68 lead CQFP/J (G1U)  
68 lead CQFP/J (G1U)  
68 lead CQFP/J (G1U)  
5962-94614 01H9X  
5962-94614 02H9X  
5962-94614 03H9X  
1
1
1
1
NOTE 1: Package not recommended for new design  
WhiteElectronicDesignsCorporation•Phoenix,AZ•(602)437-1520  
14  

相关型号:

WE32K32-120G1UQA

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
WEDC

WE32K32-120G2C

x32 EEPROM Module
ETC

WE32K32-120G2CA

EEPROM Module, 128KX8, 120ns, Parallel, CMOS, CQFP68,
MICROSEMI

WE32K32-120G2I

x32 EEPROM Module
ETC

WE32K32-120G2IA

EEPROM Module, 128KX8, 120ns, Parallel, CMOS, CQFP68,
MICROSEMI

WE32K32-120G2M

x32 EEPROM Module
ETC

WE32K32-120G2Q

x32 EEPROM Module
ETC

WE32K32-120G2QA

EEPROM Module, 128KX8, 120ns, Parallel, CMOS, CQFP68,
MICROSEMI

WE32K32-120G2UC

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
MICROSEMI

WE32K32-120G2UCA

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
MICROSEMI

WE32K32-120G2UI

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
MICROSEMI

WE32K32-120G2UI

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
MERCURY