WS512K32-17G2TQA [WEDC]
SRAM Module, 512KX32, 17ns, CMOS, CQMA68, CERAMIC, QFP-68;
| 型号： | WS512K32-17G2TQA |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | SRAM Module, 512KX32, 17ns, CMOS, CQMA68, CERAMIC, QFP-68 静态存储器 内存集成电路 |
| 文件： | 总11页 (文件大小：588K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n Packaging
n 5 Volt Power Supply
n Low Power CMOS
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400).
n Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm
(0.140") (Package 502)1, Package to be developed.
• 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
n Weight
WS512K32-XH1X - 13 grams typical
WS512K32-XG2TX1 - 8 grams typical
WS512K32-XG1UX - 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX1 - 20 grams typical
• 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 519) 3.57mm (0.140") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
*15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
Note 1: Package Not Recommended For New Design
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940") square
(Package 524) 4.06mm (0.160") height.
n
Organized as 512Kx32, User Configurable as 1Mx16 or
2Mx8
n Commercial, Industrial and Military Temperature Ranges
n TTL Compatible Inputs and Outputs
FIG. 1
I/O0-31 DataInputs/Outputs
A0-18
WE1-4
CS1-4
OE
AddressInputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
VCC
GND
NC
Not Connected
November 2001 Rev. 9
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
FIG. 2
I/O0-31 Data Inputs/Outputs
A0-18
WE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
CS1-4
OE
VCC
GND
NC
Not Connected
Note 1: Package Not Recommended For New Design
FIG. 3
I/O0-31 DataInputs/Outputs
A0-18
WE1-4
CS1-4
OE
AddressInputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
VCC
GND
NC
The White 68 lead CQFP fills
the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But it has the TCE and
lead inspection advantage of
the CQFP form.
Not Connected
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
H
L
X
L
X
H
H
L
Standby
Read
High Z
Data Out
High Z
Standby
Active
Active
Active
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Junction Temperature
Supply Voltage
TA
TSTG
VG
-55
-65
-0.5
+125
+150
Vcc+0.5
150
°C
°C
V
L
H
X
Out Disable
Write
L
Data In
TJ
°C
V
VCC
-0.5
7.0
Supply Voltage
VCC
VIH
VIL
4.5
5.5
VCC + 0.3
+0.8
V
V
OEcapacitance
COE
CWE
V
V
IN = 0 V, f = 1.0 MHz
IN = 0 V, f = 1.0 MHz
50
pF
Input High Voltage
Input Low Voltage
Operating Temp (Mil)
2.2
-0.5
-55
WE1-4 capacitance
HIP (PGA)
pF
20
50
20
V
CQFPG4T
CQFPG2T/G1U/G1T
TA
+125
°C
CS1-4 capacitance
CCS
CI/O
CAD
V
IN = 0 V, f = 1.0 MHz
I/O = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
20
20
50
pF
pF
pF
DataI/Ocapacitance
V
Addressinputcapacitance
This parameter is guaranteed by design but not tested.
InputLeakageCurrent
OutputLeakageCurrent
ILI
ILO
VCC = 5.5, VIN =GND to VCC
10
10
µA
µA
CS=VIH, OE=VIH,VOUT =GNDtoVCC
CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5
CS=VIH, OE = VIH, f = 5MHz, Vcc = 5.5
OperatingSupplyCurrentx32Mode
StandbyCurrent
ICC x 32
ISB
660
80
mA
mA
V
OutputLowVoltage
VOL
IOL = 8mA for 15 - 35ns,
0.4
IOL = 2.1mA for 45 - 55ns, Vcc = 4.5
OutputHighVoltage
VOH
IOH = -4.0mA for 15 - 35ns,
IOH = -1.0mA for 45 - 55ns, Vcc = 4.5
2.4
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
DataRetentionSupplyVoltage
DataRetentionCurrent
VDR
CS ³ VCC £ 0.2V
VCC = 3V
2.0
5.5
28
16
V
ICCDR1
mA
mA
Low Power Data Retention
Current (WS512K32L-XXX)
ICCDR2
VCC = 3V
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
Read Cycle Time
tRC
tAA
15
0
17
0
20
0
25
0
35
0
45
0
55
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
AddressAccessTime
15
17
20
25
35
45
55
OutputHoldfromAddressChange
Chip Select Access Time
tOH
tACS
tOE
15
8
17
9
20
10
25
12
35
25
45
25
55
25
OutputEnabletoOutputValid
ChipSelecttoOutputinLowZ
OutputEnabletoOutputinLowZ
ChipDisabletoOutputinHighZ
OutputDisabletoOutputinHighZ
tCLZ1
tOLZ1
tCHZ1
tOHZ1
2
0
2
0
2
0
2
0
4
0
4
0
4
0
12
12
12
12
12
12
12
12
15
15
20
20
20
20
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice.
1. This parameter is guaranteed by design but not tested.
Write Cycle Time
tWC
tCW
tAW
tDW
tWP
15
13
13
10
13
2
17
15
15
11
15
2
20
15
15
12
15
2
25
17
17
13
17
2
35
25
25
20
25
2
45
35
35
25
35
2
55
50
50
25
40
2
ns
ChipSelecttoEndofWrite
AddressValidtoEndofWrite
DataValidtoEndofWrite
WritePulseWidth
ns
ns
ns
ns
ns
ns
ns
ns
ns
AddressSetupTime
tAS
AddressHoldTime
tAH
0
0
0
0
0
5
5
OutputActivefromEndofWrite
Write Enable to Output in High Z
Data Hold Time
tOW1
tWHZ1
tDH
2
2
3
4
4
5
5
8
9
11
13
15
20
20
0
0
0
0
0
0
0
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice.
1. This parameter is guaranteed by design but not tested.
2. The Address Setup Time of minimum 2ns is for the G2T, G1U and H1 packages. tAS minimum for the G4T package is 0ns.
Input Pulse Levels
VIL = 0, VIH = 3.0
V
ns
V
Input Rise and Fall
5
InputandOutputReferenceLevel
Output Timing Reference Level
1.5
1.5
V
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 ý.
VZ is typically the midpoint of VOH and VOL.
IOL & IOHare adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS32K32-XHX
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
The White 68 lead G2T CQFP
fills the same fit and function
as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2T has the
TCE and lead inspection
advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
The White 68 lead G1U CQFP
fills the same fit and function
as the JEDEC 68 lead CQFJ or
68 PLCC. But the G1U has the
TCE and lead inspection
advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
The White 68 lead G1T CQFP
fills the same fit and function
as the JEDEC 68 lead CQFJ or
68 PLCC. But the G1T has the
TCE and lead inspection
advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
Blank=Goldplatedleads
A =Solderdipleads
Q= MIL-STD-883Compliant
M= MilitaryScreened -55°Cto+125°C
I = Industrial
-40°Cto85°C
0°Cto+70°C
C = Commercial
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2T1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G4T1 = 40mm Low Profile CQFP (Package 502)
G1U = 23.9mm Low Profile CQFP (Package 519)
G1T = 23.9mm Low Profile CQFP (Package 524)
Blank=StandardPower
N=NoConnectatpin21and39inHIPforUpgrades
L = LowPowerDataRetention
User configurable as 1Mx16 or 2Mx8
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
5962-94611 05HTX
5962-94611 06HTX
5962-94611 07HTX
5962-94611 08HTX
5962-94611 09HTX
5962-94611 10HTX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
5962-94611 05HYX
5962-94611 06HYX
5962-94611 07HYX
5962-94611 08HYX
5962-94611 09HYX
5962-94611 10HYX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP (G2T)1
68 lead CQFP (G2T)1
68 lead CQFP (G2T)1
68 lead CQFP (G2T)1
68 lead CQFP (G2T)1
68 lead CQFP (G2T)1
5962-94611 05HMX
5962-94611 06HMX
5962-94611 07HMX
5962-94611 08HMX
5962-94611 09HMX
5962-94611 10HMX
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
512K x 32 SRAM Module
55ns
45ns
35ns
25ns
20ns
17ns
68 lead CQFP (G1U)
68 lead CQFP (G1U)
68 lead CQFP (G1U)
68 lead CQFP (G1U)
68 lead CQFP (G1U)
68 lead CQFP (G1U)
5962-94611 05H9X
5962-94611 06H9X
5962-94611 07H9X
5962-94611 08H9X
5962-94611 09H9X
5962-94611 10H9X
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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