BTA310-800D [WEEN]
3Q Hi-Com Triac;型号: | BTA310-800D |
厂家: | WeEn Semiconductors |
描述: | 3Q Hi-Com Triac 三端双向交流开关 |
文件: | 总13页 (文件大小:241K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BTA310-800E
3Q Hi-Com Triac
15 September 2018
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic package.
This "series E" triac balances the requirements of commutation performance and gate sensitivity
and is intended for interfacing with low power drivers including microcontrollers.
2. Features and benefits
•
3Q technology for improved noise immunity
•
•
•
•
•
•
•
Direct interfacing with low power drivers and microcontrollers
Good immunity to false turn-on by dV/dt
High commutation capability with sensitive gate
High voltage capability
Planar passivated for voltage ruggedness and reliability
Sensitive gate for easy logic level triggering
Triggering in three quadrants only
3. Applications
•
•
•
Electronic thermostats (heating and cooling)
Motor controls e.g. washing machines and vacuum cleaners
Refrigeration and air-conditioner compressor controls
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDRM
repetitive peak off-
state voltage
-
-
800
V
IT(RMS)
ITSM
RMS on-state current
full sine wave; Tmb ≤ 106 °C; Fig. 1;
Fig. 2; Fig. 3
-
-
-
-
-
-
-
-
10
A
non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
85
A
tp = 20 ms; Fig. 4; Fig. 5
full sine wave; Tj(init) = 25 °C;
tp = 16.7 ms
93
A
Tj
junction temperature
125
°C
Static characteristics
IGT gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
0.5
0.5
-
-
10
10
mA
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
0.5
-
10
mA
IH
holding current
on-state voltage
VD = 12 V; Tj = 25 °C; Fig. 9
IT = 12 A; Tj = 25 °C; Fig. 10
-
-
-
15
mA
V
VT
1.25
1.5
Dynamic characteristics
dVD/dt
rate of rise of off-state VDM = 536 V; Tj = 125 °C; (VDM = 67%
50
2
-
-
-
-
V/µs
voltage
of VDRM); exponential waveform; gate
open circuit
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 10 V/µs; gate open circuit
3
6
-
-
-
-
A/ms
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 1 V/µs; gate open circuit
5. Pinning information
Table 2. Pinning information
Pin
1
Symbol Description
Simplified outline
Graphic symbol
T1
T2
G
main terminal 1
main terminal 2
gate
mb
T2
T1
G
2
sym051
3
mb
T2
mounting base; main
terminal 2
1
2 3
TO-220AB (SOT78)
6. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
Version
BTA310-800E
TO-220AB
plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78
©
BTA310-800E
All information provided in this document is subject to legal disclaimers.
WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDRM
repetitive peak off-state
voltage
-
800
V
IT(RMS)
ITSM
RMS on-state current
full sine wave; Tmb ≤ 106 °C; Fig. 1;
Fig. 2; Fig. 3
-
-
10
85
A
A
non-repetitive peak on-
state current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
Fig. 4; Fig. 5
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
tp = 10 ms; SIN
-
-
-
93
A
I2t
I2t for fusing
36.1
100
A²s
A/µs
dIT/dt
rate of rise of on-state
current
IG = 0.2 A
IGM
peak gate current
peak gate power
-
2
A
PGM
PG(AV)
Tstg
Tj
-
5
W
W
°C
°C
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.5
150
125
-40
-
003aaj688
003aaj686
12
50
I
T(RMS)
(A)
106 °C
I
T(RMS)
(A)
40
30
20
10
8
4
0
0
-2
-1
10
-50
0
50
100
150
10
1
10
T
(°C)
surge duration (s)
mb
f = 50 Hz; Tmb = 106 °C
Fig. 1. RMS on-state current as a function of mounting
base temperature; maximum values
Fig. 2. RMS on-state current as a function of surge
duration; maximum values
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BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
003aaj690
102.5
15
conduction form
T
P
mb(max)
tot
angle
(degrees)
factor
a
(°C)
(W)
12
°
α = 180
107
30
60
90
120
180
2.816
1.967
1.570
1.329
1.110
°
120
α
°
°
90
60
9
6
3
0
111.5
116
°
30
120.5
125
0
2.5
5
7.5
10
12.5
I
(A)
T(RMS)
α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values
003aaj692
120
I
TSM
(A)
100
80
60
40
20
0
I
I
TSM
t
T
1/f
= 25 °C max
T
j(init)
2
3
1
10
10
10
number of cycles (n)
f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
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BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
003aaj693
3
10
I
TSM
(A)
(1)
2
10
I
I
T
TSM
t
t
p
T
j(init)
= 25 °C max
10
10
-5
-4
-3
-2
10
-1
10
10
10
t (s)
p
tp ≤ 20 ms
(1) dIT/dt limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
1.5
2
Unit
K/W
K/W
Rth(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6
half cycle; Fig. 6
-
-
-
-
Rth(j-a)
thermal resistance
from junction to
ambient free air
in free air
-
60
-
K/W
003aaj343
10
Z
th(j-mb)
(K/W)
1
(1)
(2)
-1
-2
-3
10
10
10
P
D
t
t
p
-5
-4
-3
-2
-1
10
10
10
10
10
1
10
t
p
(s)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
9. Characteristics
Table 6. Characteristics
Symbol
Static characteristics
IGT gate trigger current
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
0.5
0.5
0.5
-
-
-
-
-
-
-
10
10
10
25
30
25
mA
mA
mA
mA
mA
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
IL
latching current
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 8
VD = 12 V; IG = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 8
-
VD = 12 V; IG = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 8
-
IH
holding current
VD = 12 V; Tj = 25 °C; Fig. 9
IT = 12 A; Tj = 25 °C; Fig. 10
-
-
-
-
15
1.5
1
mA
V
VT
VGT
on-state voltage
gate trigger voltage
1.25
0.7
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
Fig. 11
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
Fig. 11
0.25
-
0.4
0.1
-
V
ID
off-state current
VD = 800 V; Tj = 125 °C
0.5
mA
Dynamic characteristics
dVD/dt
rate of rise of off-state VDM = 536 V; Tj = 125 °C; (VDM = 67%
50
2
-
-
-
-
V/µs
voltage
of VDRM); exponential waveform; gate
open circuit
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 10 V/µs; gate open circuit
3
6
-
-
-
-
A/ms
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 1 V/µs; gate open circuit
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
003aaj695
003aaj694
3
3
(1)
I
I
GT
L
I
I
L(25°C)
GT(25°C)
(2)
2
2
(3)
1
1
0
-50
0
-50
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2- G-
(2) T2+ G+
(3) T2+ G-
Fig. 8. Normalized latching current as a function of
junction temperature
Fig. 7. Normalized gate trigger current as a function of
junction temperature
003aaj697
003aaj696
3
40
I
T
I
H
(A)
I
H(25°C)
30
2
20
10
0
1
(1)
1
(2)
(3)
0
-50
0
50
100
150
0
2
3
T (°C)
j
V
(V)
T
Vo = 1.103 V; Rs = 0.030 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 9. Normalized holding current as a function of
junction temperature
Fig. 10. On-state current as a function of on-state
voltage
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
003aaj698
1.6
V
GT
V
GT(25°C)
1.2
0.8
0.4
-50
0
50
100
150
T (°C)
j
Fig. 11. Normalized gate trigger voltage as a function of junction temperature
©
BTA310-800E
All information provided in this document is subject to legal disclaimers.
WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
10. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
p
A
A
1
q
mounting
D
1
base
D
(1)
(1)
L
L
1
2
Q
(2)
b
1
L
(3×)
(2)
b
2
(2×)
1
2
3
b(3×)
c
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
2
(2)
(2)
(1)
1
UNIT
mm
A
A
b
b
b
c
D
D
1
E
e
L
L
p
q
Q
1
1
2
max.
4.7
4.1
1.40
1.25
0.9
0.6
1.6
1.0
1.3
1.0
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
15.0 3.30
12.8 2.79
3.8
3.5
3.0
2.7
2.6
2.2
2.54
3.0
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
08-04-23
08-06-13
SOT78
SC-46
3-lead TO-220AB
Fig. 12. Package outline TO-220AB (SOT78)
©
BTA310-800E
All information provided in this document is subject to legal disclaimers.
WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
10 / 13
WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
Right to make changes — WeEn Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11. Legal information
Suitability for use — WeEn Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical
or safety-critical systems or equipment, nor in applications where failure
or malfunction of an WeEn Semiconductors product can reasonably
be expected to result in personal injury, death or severe property or
environmental damage. WeEn Semiconductors and its suppliers accept no
liability for inclusion and/or use of WeEn Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Data sheet status
Document
Product
Definition
status [1][2] status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Product
[short] data
sheet
Production
This document contains the product
specification.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. WeEn Semiconductors makes
no representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
[1] Please consult the most recently issued document before initiating or
completing a design.
Customers are responsible for the design and operation of their applications
and products using WeEn Semiconductors products, and WeEn
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the WeEn Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.ween-semi.com.
Definitions
WeEn Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using WeEn
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). WeEn does not accept any liability in this respect.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. WeEn Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local WeEn
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
WeEn Semiconductors and its customer, unless WeEn Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the WeEn Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Disclaimers
Non-automotive qualified products — Unless this data sheet expressly
states that this specific WeEn Semiconductors product is automotive
qualified, the product is not suitable for automotive use. It is neither qualified
nor tested in accordance with automotive testing or application requirements.
WeEn Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications.
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, WeEn Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability for
the consequences of use of such information. WeEn Semiconductors takes
no responsibility for the content in this document if provided by an information
source outside of WeEn Semiconductors.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without WeEn Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
WeEn Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies WeEn Semiconductors for
any liability, damages or failed product claims resulting from customer
design and use of the product for automotive applications beyond WeEn
Semiconductors’ standard warranty and WeEn Semiconductors’ product
specifications.
In no event shall WeEn Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, WeEn Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of WeEn
Semiconductors.
©
BTA310-800E
All information provided in this document is subject to legal disclaimers.
WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
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WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
12 / 13
WeEn Semiconductors
BTA310-800E
3Q Hi-Com Triac
12. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Limiting values............................................................. 3
8. Thermal characteristics............................................... 6
9. Characteristics..............................................................7
10. Package outline........................................................ 10
11. Legal information..................................................... 11
© WeEn Semiconductors Co., Ltd. 2018. All rights reserved
For more information, please visit: http://www.ween-semi.com
For sales office addresses, please send an email to: salesaddresses@ween-semi.com
Date of release: 15 September 2018
©
BTA310-800E
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WeEn Semiconductors Co., Ltd. 2018. All rights reserved
Product data sheet
15 September 2018
13 / 13
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