I17150XYR01 [WINBOND]

Speech Synthesizer With RCDG, 300s, DIE;


型号：	I17150XYR01
厂家：	WINBOND
描述：	Speech Synthesizer With RCDG, 300s, DIE CD 商用集成电路
文件：	总24页 (文件大小：351K)
中文：	中文翻译
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PRELIMINARY

ISD1700

Series

Multi-Message

Single-Chip

Voice Record & Playback Devices

Publication Release Date: January 23, 2007

Revision 1.3-S2

ISD1700 SERIES

TABLE OF CONTENTS

GENERAL DESCRIPTION..............................................................................................................3

FEATURES......................................................................................................................................4

BLOCK DIAGRAM...........................................................................................................................5

PINOUT CONFIGURATION............................................................................................................6

PIN DESCRIPTION .........................................................................................................................7

MODES OF OPERATIONS.............................................................................................................8

6.1 Standalone (Push-Button) Mode .............................................................................................8

6.2 SPI Mode .................................................................................................................................8

TIMING DIAGRAMS........................................................................................................................8

7.1 Standalone Operation..............................................................................................................8

7.2 SPI Operation.........................................................................................................................12

ABSOLUTE MAXIMUM RATINGS................................................................................................13

8.1 Operating Conditions .............................................................................................................13

ELECTRICAL CHARACTERISTICS .............................................................................................14

9.1 DC Parameters ......................................................................................................................14

9.2 AC Parameters.......................................................................................................................15

10 TYPICAL APPLICATION CIRCUITS.............................................................................................16

10.1 Good Audio Design Practices................................................................................................18

11 PACKAGING .................................................................................................................................19

11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19

11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20

11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21

11.4 Die Information.......................................................................................................................21

12 ORDERING INFORMATION.........................................................................................................22

13 VERSION HISTORY......................................................................................................................23

- 2 -

ISD1700 SERIES

1 GENERAL DESCRIPTION

The Winbond^®ISD1700 ChipCorder^®Series is a high quality, fully integrated, single-chip multi-

message voice record and playback device ideally suited to a variety of electronic systems. The

message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the

specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz

with an external resistor, giving the user greater flexibility in duration versus recording quality for each

application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices

are optimized for a wide range of battery or line-powered applications.

The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device

incorporates a proprietary message management system that allows the chip to self-manage address

locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a

simple push-button environment. The devices include an on-chip oscillator (with external resistor

control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-

aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width

Modulation (PWM) Class D speaker driver, and current/voltage output.

The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new

message indicator. With vAlert, the device flashes an external LED to indicate that a new message is

present. Besides, four special sound effects are reserved for audio confirmation of operations, such as

“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.

Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique

single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS)

technology. Audio data are stored directly in solid-state memory without digital compression, providing

superior quality voice and music reproduction.

Voice signals can be fed into the chip through two independent paths: a differential microphone input

and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)

Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a

standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a

single-ended current or voltage output to drive an external amplifier.

While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power

conservation after an operation is completed.

In the SPI mode, the user has full control via the serial interface in operating the device. This includes

random access to any location inside the memory array by specifying the start address and end

address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.

This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default

configuration for standalone mode can also be modified by storing the APC data into a non-volatile

have the control and flexibility to implement voice functionality into the high-end products.

Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or

Representatives to verify current or future specifications. Also refer to the website for any related application notes.

Publication Release Date: January 23, 2007

- 3 -

Revision 1.3-S2

ISD1700 SERIES

2 FEATURES

Integrated message management systems for single-chip, push-button applications

REC : level-trigger for recording

PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially

ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages

FWD : edge-trigger to advance to the next message or fast message scan during the playback

VOL : 8 levels output volume control

: ready or busy status indication

RDY INT

RESET : return to the default state

o Automatic power-down after each operation cycle

Selectable sampling frequency controlled by an external oscillator resistor

Sampling Frequency

Rosc

12 kHz

8 kHz

6.4 kHz

5.3 kHz

4 kHz

Selectable

message

53 kΩ

80 kΩ

100 kΩ

120 kΩ

160 kΩ

duration

o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen

Sample Freq. ISD1730 ISD1740 ISD1750 ISD1760 ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240

20 secs

30 secs

37 secs

45 secs

60 secs

26 secs

40 secs

50 secs

60 secs

33 secs

50 secs

62 secs

75 secs

40 secs

60 secs

80 secs 100 secs 120 secs 140 secs 160 secs

12 kHz

8 kHz

90 secs 120 secs 150 secs 180 secs 210 secs 240 secs

75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs

90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs

6.4 kHz

5.3 kHz

4 kHz

80 secs 100 secs 120 secs 180 secs 240 secs 300 secs 360 secs 420 secs 480 secs

Message and operation indicators

o Four customizable Sound Effects (SEs) for audible indication

o Optional vAlert (voiceAlert) to indicate the presence of new messages

o LED: stay on during recording, blink during playback, forward and erase operations

Dual operating modes

o Standalone mode:

Integrated message management techniques

Automatic power-down after each operation cycle

o SPI mode:

Fully user selectable and controllable options via APC register and various SPI commands

Two individual input channels

o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)

o AnaIn: single-ended auxiliary analog input for recording or feed-through

Dual output channels

o Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer

o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier

ChipCorder standard features

o High-quality, natural voice and audio reproduction

o 2.4V to 5.5V operating voltage

o 100-year message retention (typical)

o 100,000 record cycles (typical)

- 4 -

ISD1700 SERIES

Temperature options:

Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

Industrial: -40°C to +85°C (packaged units)

Packaging types: available in die, PDIP, SOIC and TSOP

Package option: Lead-free packaged units

3 BLOCK DIAGRAM

Internal

Clock

Sampling

Clock

Timing

R_OSC

AnaIn

AUD /

Amp

AUX

Amp

Anti-

Aliasing

Filter

Nonvolatile

Multi-Level Storage

Array

SP+

Smoothing

Filter

Volume

Amp

Control

MIC+

AGC

SP-

Amp

MIC-

Automatic

Gain Control

AGC

SPI Interface

Device Control

Power Conditioning

V_SSA

V_CCP

V_SSDV_CCD

_SSP1V_SSP2

V_CCA

REC PLAY ERASE FWD

RESET VOL INT/RDY LED SS SCLK MOSI MISO

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 5 -

ISD1700 SERIES

4 PINOUT CONFIGURATION

Refer to Design Guide for details before performing any design or PCB layout.

V_CCD

V_SSD

INT / RDY

FWD

LED

RESET

MISO

ERASE

MOSI

REC

SCLK

PLAY

ISD1700

V_SSA

V_CCA

R_OSC

AnaIn

MIC+

VOL

AGC

MIC-

V_SSP2

AUD / AUX

V_SSP1

SP-

V_CCP

Sp+

SOIC / PDIP

V_SSA

SCLK

MOSI

MISO

AnaIn

MIC+

MIC-

V_SSP2

RESET

LED

SP-

V_CCP

V_CCD

ISD1700

Sp+

V_SSP1

V_SSD

INT / RDY

FWD

AUD/AUX

AGC

ERASE

REC

VOL

R_OSC

PLAY

V_CCA

TSOP

- 6 -

ISD1700 SERIES

5 PIN DESCRIPTION

Refer to Design Guide for details before performing any design or PCB layout.

PIN NAME

V_CCD

FUNCTIONS

Digital Power Supply: Power supply for digital circuitry.

LED: An LED output.

LED

RESET: When active, the device enters into a known state.

RESET

MISO

Master In Slave Out: Data is shifted out on the falling edge of SCLK.

When the SPI is inactive ( SS = high), it’s tri-state.

MOSI

SCLK

Master Out Slave In: Data input of the SPI interface when ISD1700 is a

slave. Data is latched into the device on the rising edge of SCLK.

Serial Clock: Clock of the SPI interface.

Slave Select: Selects as a slave device and enables the SPI interface.

V_SSA

Analog Ground: Ground path for analog circuitry.

AnaIn

MIC+

MIC-

AnaIn: Auxiliary analog input to the device for recording or feed-through.

MIC+: Non-inverting input of the differential microphone signal.

MIC-: Inverting input of the differential microphone signal.

V_SSP2

SP-

Ground: Ground path for negative PWM speaker drive.

SP-: The negative Class D PWM speaker output.

V_CCP

Power Supply for PWM Speaker Driver: Power for PWM speaker drive.

SP+: The positive Class D PWM speaker output.

SP+

V_SSP1

AUD/AUX

Ground: Ground path for positive PWM speaker drive.

Auxiliary Output: Either an AUD (current) or AUX (voltage) output.

Automatic Gain Control (AGC): The AGC adjusts the gain of the

microphone preamplifier circuitry.

AGC

Volume: This control has 8 levels of volume adjustment.

VOL

R_OSC

Oscillator Resistor: A resistor determines the sample frequency of the

device, which sets the duration.

V_CCA

Analog Power Supply. Power supply for analog circuitry.

Feed-through: Enable the feed-through path for AnaIn signal to the

outputs.

Playback: Plays the recorded message individually, or plays messages

sequential in a looping mode.

PLAY

Record: When active, starts recording message.

REC

Erase: When active, can erase individual message or do global erase.

Forward: Advances to the next message from the current location.

An open drain output. Can review ready or interrupt status.

ERASE

FWD

RDY INT

V_SSD

Digital Ground: Ground path for digital circuitry

Publication Release Date: January 23, 2007

- 7 -

Revision 1.3-S2

ISD1700 SERIES

6 MODES OF OPERATIONS

The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.

6.1 STANDALONE (PUSH-BUTTON) MODE

One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a

desired operation. As completed, the device automatically enters into the power-down state.

6.2 SPI MODE

In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI

commands.

For technical details, please refer to the design guide.

7 TIMING DIAGRAMS

The following estimated timing diagrams are not in proper scale.

7.1 BASIC OPERATION

T_r

T_f

REC

RDY

T_Deb

T_Sc1

T_Set1

T_RU

T_RD

T_ER

LED

Mic+/-,

AnaIn

Figure 12.1: Record Operation with No Sound Effect

- 8 -

ISD1700 SERIES

> T_Deb

T_r

T_f

T_Deb

PLAY

RDY

T_Deb

T_RDT_Set1

T_Sc1T_Sc2T_RUT_LH

T_Cyc

LED

Sp+, Sp-

Figure 12.2: Start and Stop Playback Operation

> T_Deb

T_r

T_f

ERASE

RDY

T_Deb

T_RD

T_Sc2

T_Sc2T_E

T_Sc1

T_LS2

LED

Figure 12.3: Single Erase Operation with No Sound Effect

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 9 -

ISD1700 SERIES

> T_Deb

T_r

T_f

FWD

RDY

T_Deb

T_RD

T_Sc2

T_LS1or T_LS2

T_Sc1

LED

Figure 12.4: Forward Operation with No Sound Effect

T_r

ERASE

T_Deb

T_f

T_RD

RDY

)

GE2

T_LS4or T_SE4

3x(T_LS1or T_SE1

T_GE1or (T_E+ T_LS2or T_SE2)

T_Sc2

T_Sc1

LED

Sp+, Sp-

Note: If SEs are recorded, then Sp+/- will have output.

Figure 12.5: Global Erase Operation with or without Sound Effects

- 10 -

ISD1700 SERIES

T_r

T_f

RESET

T_Reset

T_Set2

Device returns to Power Down state

RDY

LED

Figure 12.6: Reset Operation

> T_Deb

T_r

T_f

PLAY

T_Deb

T_RD

RDY

T_Sc1T_Sc2T_RUT_LH

T_Cyc

LED

AUD

T_RU

T_RD

Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 11 -

ISD1700 SERIES

7.2 SPI OPERATION

T_SSmin

T_SSH

T_SCKlow

T_SSS

T_SCKhi

SCLK

MOSI

T_DIS

T_DIH

LSB

MSB

T_PD

T_DF

(TRISTATE)

MISO

LSB

MSB

Figure 12.8: SPI Operation

PARAMETER

SS Setup Time

SYMBOL

T_SSS

MIN

TYP

MAX

UNITS

500

nsec

T_SSH

500

nsec

SS Hold Time

Data in Setup Time

Data in Hold Time

Output Delay

T_DIS

T_DIH

T_PD

200

nsec

µsec

500

Output Delay to HighZ

T_DF

T_SSmin

SS HIGH

SCLK High Time

SCLK Low Time

CLK Frequency

T_SCKhi

T_SCKlow

F₀

400

nsec

KHz

1,000

Power-Up Delay ^[1]

T_PUD

msec

[1]

Notes:

The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for

slower sampling frequency.

- 12 -

ISD1700 SERIES

8 ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (DIE) ^[1]

CONDITIONS

VALUES

Junction temperature

150⁰C

-65⁰C to +150⁰C

Storage temperature range

Voltage Applied to any pads

(V_SS- 0.3V) to (V_CC+ 0.3V)

-0.3V to +7.0V

Power supply voltage to ground potential

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) ^[1]

CONDITIONS

VALUES

Junction temperature

150⁰C

-65⁰C to +150⁰C

Storage temperature range

Voltage Applied to any pins

(V_SS- 0.3V) to (V_CC+ 0.3V)

(V_SS– 1.0V) to (V_CC+ 1.0V)

-0.3V to +7.0V

Voltage applied to any pin (Input current limited to +/-20 mA)

Power supply voltage to ground potential

[1]

Stresses above those listed may cause permanent damage to the device. Exposure to the absolute

maximum ratings may affect device reliability. Functional operation is not implied at these conditions.

8.1

OPERATING CONDITIONS

OPERATING CONDITIONS (DIE)

CONDITIONS

Operating temperature range

VALUES

0°C to +50°C

Supply voltage (V_CC) ^[1]

Ground voltage (V_SS) ^[2]

Input voltage (V_CC) ^[1]

+2.4 V to +5.5 V

0 V

0 V to 5.5 V

Voltage applied to any pins

(V_SS–0.3 V) to (V_CC+0.3 V)

OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

-40°C to +85°C

Operating temperature range (Case temperature)

Supply voltage (V_DD) ^[1]

+2.4V to +5.5V

Ground voltage (V_SS) ^[2]

Input voltage (V_DD) ^[1]

0V to 5.5V

Voltage applied to any pins

(V_SS–0.3V) to (V_DD+0.3V)

[1]

= V_CCA= V_CCD= V_CCP

[2]

= V_SSA= V_SSD= V_SSP1V_SSP2

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 13 -

ISD1700 SERIES

9 ELECTRICAL CHARACTERISTICS

9.1 DC PARAMETERS

PARAMETER

Supply Voltage

SYMBOL

V_DD

MIN

2.4

TYP ^[1]

MAX

5.5

UNITS

CONDITIONS

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage

Record Current

Playback Current

Erase Current

Standby Current

Input Leakage Current

Input Current Low

V_IL

V_IH

V_OL

V_OH

I_{DD_Record}

I_{DD_Playback}

I_{DD_Erase}

I_SB

V_SS-0.3

0.7xV_DD

V_SS-0.3

0.7xV_DD

0.3xV_DD

V_DD

0.3xV_DD

V_DD

I_OL= 4.0 mA^[2]

I_OH= -1.6 mA^[2]

V_DD= 5.5 V, No load,

µA

kꢀ

Sampling freq = 12 kHz

[3] [4]

±1

-10

I_ILPD1

Force V_DD

I_ILPD2

-3

Force V_SS, others at Vcc

Power-up AGC

When active

Preamp Input Impedance R_MIC+,R_MIC-

AnaIn Input Impedance

MIC Differential Input

AnaIn Input Voltage

R_AnaIn

V_IN1

V_IN2

300

Peak-to-Peak^[5]

Peak-to-Peak

Gain from MIC to SP+/-

A_MSP

V_IN= 15~300 mV, AGC =

4.7 µF, V_CC= 2.4V~5.5V

Speaker Output Load

AUX Output Load

Speaker Output Power

R_SPK

R_Aux

Pout

ꢀ

kꢀ

Across both Speaker pins

When active

1Vp-p,

1 kHz sine

wave at

AnaIn. R_SPK

= 8 ꢀ.

670

313

117

V_DD= 5.5 V

V_DD= 4.4 V

V_DD= 3 V

V_DD= 2.4 V

Speaker Output Voltage

V_OUT1

V_DD

R_SPK= 8ꢀ (Speaker),

Typical buzzer

AUX Output Swing

AUX Output DC Level

AUD

V_OUT2

V_OUT3

I_AUD

Peak-to-Peak

When active

V_DD=4.5 V, R_EXT= 390 ꢀ

8 steps of 4dB each

reference to output

1.2

-3.0

0 to -28

Volume Output

A_Vol

Total Harmonic Distortion THD

15 mV p-p 1 kHz sine

wave, Cmessage

weighted

[1]

Notes:

Conditions: V_CC= 4.5V, 8 kHz sampling frequency and T_A= 25°C, unless otherwise stated.

LED output during Record operation.

[2]

[3]

V_CCA, V_CCDand V_CCPare connected together. V_SSA, V_SSP1,V_SSP2and V_SSDare connected together.

[4]

[5]

REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at V_CCD

Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or

MIC- input is recommended no more than 150 mV p-p.

- 14 -

ISD1700 SERIES

9.2 AC PARAMETERS

CHARACTERISTIC

Sampling Frequency ^[2]

Duration ^[3]

SYMBOL

F_S

MIN

TYP ^[1]

MAX

UNITS

kHz

CONDITIONS

[2] [4]

[3]

Refer to

duration

table

T_Dur

sec

Rising Time

T_r

100

nsec

msec

Falling Time

T_f

[4]

Debounce Time

Ramp Up Time

Ramp Down Time

T_Deb

T_RU

T_RD

T_Sc1

192/F_S

128/F_S

Initial Scan Time after

power is applied

DRN/8/F_S

msec DRN= device row# ^[4]

Initial Scan Time from PD T_Sc2

state

DRN/16/F_Smsec After a PB operation

is run ^[4]

[4]

End Recording Time

LED High Time

T_ER

T_LH

32/F_S

msec

[4]

0.5K/F_S

LED Flash Time for SE1 T_LS1

LED Flash Time for SE2 T_LS2

LED Flash Time for SE3 T_LS3

LED Flash Time for SE4 T_LS4

SE1 Recorded Duration T_SE1

SE2 Recorded Duration T_SE2

SE3 Recorded Duration T_SE3

SE4 Recorded Duration T_SE4

3.5K/F_S

7.5K/F_S

sec SE1 not recorded ^[5]

sec SE2 not recorded ^[5]

sec SE3 not recorded ^[5]

sec SE4 not recorded ^[5]

11.5K/F_S

15.5K/F_S

[4] [5]

4K/F_S

sec

[4] [5]

sec

[4] [5]

sec

[4] [5]

sec

Erase Time

T_E

10MRN/F_S

34/F_S

sec

MRN=message row # ^[4]

[4] [5]

Global Erase Wait Time T_GE1

20K/F_S

Global Erase Time

RESET Pulse

T_GE2

T_Reset

T_Set1

T_Set2

T_LErr

T_Cyc

sec

All Fs ^[4]

μsec

msec

[4]

Settle Time

128/F_S

64/F_S

27.5K/F_S

[4]

Settle Time after Reset

LED Error Time

[4] [5]

LED Cycle frequency

Pending upon F_S

Notes: ^[1]Typical values: V_CC= 4.5 V, F_S= 8 kHz and @ T_A= 25°C, unless otherwise stated.

^[2]Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage

ranges.

^[3]Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges.

^[4]Vcc=2.4 V~5.5V

^[5]K = 1024

Publication Release Date: January 23, 2007

- 15 -

Revision 1.3-S2

ISD1700 SERIES

10 TYPICAL APPLICATION CIRCUITS

The following typical applications examples on ISD1700 Series are for references only. They make no

representation or warranty that such applications shall be suitable for the use specified. Each design

has to be optimized in its own system for the best performance on voice quality, current consumption,

functionalities and etc.

The below notes apply to the following applications examples:

These capacitors may be needed in order to optimize for the best voice quality, which is also dependent

upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.

Please refer to the applications notes or consult Winbond for layout advice.

** It is important to have a separate path for each ground and power back to the related terminals to minimize

the noise. Also, the power supplies should be decoupled as close to the device as possible.

Example #1: Recording using microphone input via push-button controls

Reset

REC

RESET

LED

0.1μF

PLAY

ERASE

vAlert

1 KΩ

Gnd

Vcc

FWD

V_CCD

V_CCA

V_CCD

V_CCP

VOL

V_CCD

V_SSD

0.1μF

V_CCA

V_SSA

V_CC

0.1

V_CCP

SCLK

MOSI

MISO

4.7 KΩ

V_SSP1

0.1 F

ISD1700

0.1

V_SSP2

4.7

4.7 KΩ

Speaker

or Buzzer

V_CC

SP+

SP-

MIC+

MIC -

0.1

Speaker

0.1

AUD

AUX

AUD/AUX

INT/RDY

8050C

4.7 K

AnaIn

V_CCD

100 KΩ

Optional

390Ω

Rosc ***

0.1μ F

R_OSC

AGC

Optional: based upon the applications

4.7

*** At 8kHz sampling freq, Rosc = 80 K

: Digital ground;

: Analog ground;

: Ground for SP+;

: Ground for SP-

- 16 -

ISD1700 SERIES

Example #2: Recording using AnaIn input via push-button controls

Reset

REC

RESET

PLAY

0.1 F

vAlert

ERASE

1 KΩ

LED

FWD

Vcc

Gnd

V_CCD

VOL

V_CCA

V_CCD

V_SSD

V_CCD

V_CCP

0.1μF

V_CCA

V_SSA

0.1

V_CCP

SCLK

MOSI

MISO

V_CCP

ISD1700

V_SSP116

0.1

V_SSP2

Speaker

or Buzzer

MIC+

MIC -

AnaIn

V_CC

SP+

SP-

Speaker

0.1μF

AUD

AUX

AUD/AUX

INT/RDY

8050C

V_CCD

100 KΩ

Optional

Rosc ***

390

R_OSC

AGC

0.1μ F

4.7

Optional: based upon the applications

*** At 8kHz sampling freq, Rosc = 80 K

: Digital ground;

: Analog ground;

: Ground for SP+; : Ground for SP-

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 17 -

ISD1700 SERIES

Example #3: Connecting the SPI Interface to a microcontroller

Reset

REC

RESET

PLAY

ERASE

0.1μF

vAlert

1 KΩ

LED

FWD

Vcc

Gnd

V_CCD

V_CCA

V_CCD

V_CCP

VOL

V_CCD

V_SSD

0.1

V_CCA

V_SSA

0.1

V_CCP

SCLK

MOSI

MISO

V_CCP

To uC

SPI

ISD1700

V_SSP1

0.1

V_SSP2

Speaker

or Buzzer

V_CC

SP+

SP-

MIC+

MIC -

Speaker

AUD

AUX

0.1μF

AUD/AUX

INT/RDY

8050C

AnaIn

V_CCD

100 KΩ

Optional

Rosc ***

390

R_OSC

AGC

0.1μ F

4.7

Optional: based upon the applications

*** At 8kHz sampling freq, Rosc = 80 K

: Digital ground;

: Analog ground;

: Ground for SP+;

: Ground for SP-

10.1

GOOD AUDIO DESIGN PRACTICES

To ensure the highest quality of voice reproduction, it is important to follow good audio design

practices in layout and power supply decoupling. See recommendations from below links or other

Application Notes in our websites.

Design Considerations for ISD1700 Family

AN-CC1002 Design Considerations for ISD1700 Family.pdf

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

- 18 -

ISD1700 SERIES

11 PACKAGING

11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC

H_D

Dimension in Inches Dimension in mm

Symbol

Max.

1.20

Min. Nom. Max. Min. Nom.

0.047

0.006

0.041

0.05

0.002

0.035

0.15

0.95

0.17

0.040

1.00

0.20

1.05

0.27

0.007 0.008 0.011

0.10

0.004

0.461

0.008

0.465 0.469

0.15

11.80

8.00

0.21

0.006

11.70

11.90

0.311 0.315 0.319

0.520 0.528 0.536

7.90

8.10

13.60

13.40

13.20

0.022

0.020 0.024 0.028

0.031

0.55

0.60

0.80

0.50

0.70

0.000

0.10

0.004

0.00

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 19 -

ISD1700 SERIES

11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)

26 25

23 22 21 20 19 18 17

6 7

9 10 11 12 13 14

Plastic Small Outline Integrated Circuit (SOIC) Dimensions

INCHES

Nom

MILLIMETERS

Min

Max

0.711

0.104

0.299

0.0115

0.019

Min

17.81

2.46

Nom

17.93

2.56

7.52

0.22

0.41

1.27

10.31

0.81

Max

18.06

2.64

7.59

0.29

0.48

0.701

0.097

0.292

0.005

0.014

0.706

0.101

0.296

0.009

0.016

0.050

0.406

0.032

7.42

0.127

0.35

0.400

0.024

0.410

0.040

10.16

0.61

10.41

1.02

Lead coplanarity to be within 0.004 inches.

Note:

- 20 -

ISD1700 SERIES

11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)

Plastic Dual Inline Package (PDIP) (P) Dimensions

INCHES

MILLIMETERS

Min

1.445

Nom

1.450

0.150

0.070

Max

1.455

Min

36.70

Nom

36.83

3.81

Max

36.96

0.065

0.600

0.530

0.075

0.625

0.550

0.19

1.65

15.24

13.46

1.78

1.91

15.88

13.97

4.83

0.540

13.72

0.015

0.125

0.015

0.055

0.38

3.18

0.38

1.40

0.135

0.022

0.065

3.43

0.56

1.65

0.018

0.060

0.100

0.010

0.075

0.46

1.52

2.54

0.25

1.91

0.008

0.070

0°

0.012

0.080

15°

0.20

1.78

0°

0.30

2.03

15°

11.4 DIE INFORMATION

For die info, please contact the local Winbond Sales Representatives.

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 21 -

ISD1700 SERIES

12 ORDERING INFORMATION

Product Number Descriptor Key

I17xxxxxxxxx

Special Features Field:

Product Name:

Blank = None

I = ISD

= vAlert

Product Series:

Tape & Reel:

17 = 1700

Blank = None

Duration:

= Tape & Reel

30 : 20 – 60 secs

40 : 26 – 80 secs

50 : 33 – 100 secs

60 : 40 – 120 secs

90 : 60 – 180 secs

120 : 80 – 240 secs

150 : 100 – 300 secs

180 : 120 – 360 secs

210 : 140 – 420 secs

240 : 160 – 480 secs

Temperature:

Industrial (-40°C to +85°C)

Blank = Commercial

•

Die (0°C to +50°C)

Package (0°C to +70°C)

Package Type:

Die

Lead-Free:

= Lead-Free

Thin Small Outline Package (TSOP)

Small Outline Integrated Circuit

(SOIC) Package

Plastic Dual Inline Package (PDIP)

When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond

Sales Representatives for any questions and the availability.

For the latest product information, please contact the Winbond Sales/Rep or

access Winbond’s worldwide web site at http://www.winbond-usa.com

- 22 -

ISD1700 SERIES

13 VERSION HISTORY

VERSION

1.3-S

DATE

DESCRIPTION

Initial version

Sep 2006

Nov 2006

Jan 2007

1.3-S1

1.3-S2

Revise Pinout Configuration & Pin Description sections

Revise Rosc resistor value

Revise Selectable Message Duration section

Update standby current, sampling frequency & duration parameters

Publication Release Date: January 23, 2007

- 23 -

Revision 1.3-S2

ISD1700 SERIES

Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment

intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation

instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or

sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could

result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully

indemnify Winbond for any damages resulting from such improper use or sales.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no

representation or warranties with respect to the accuracy or completeness of the contents of this publication and

reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.

No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this

publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability

whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or

infringement of any Intellectual property.

The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any

express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual

property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for

loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this

documents, even if Winbond has been advised of the possibility of such damages.

Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only

and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.

The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in

the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates

SuperFlash^®.

This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD^®ChipCorder^®

product specifications. In the event any inconsistencies exist between the information in this and other product

documentation, or in the event that other product documentation contains information in addition to the information in

this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is

subject to change without notice.

Winbond Electronics Corporation. SuperFlash^®is the trademark of Silicon Storage Technology, Inc. All other trademarks

are properties of their respective owners.

- 24 -

I17150XYR01 [WINBOND]

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