PC87384 [WINBOND]
Micro Peripheral IC,;型号: | PC87384 |
厂家: | WINBOND |
描述: | Micro Peripheral IC, |
文件: | 总4页 (文件大小:121K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Product Brief
February 2006
Revision 1.0
PC87384
Legacy-Reduced SuperI/O with Serial Port, Parallel Port
and GPIOs for Notebook and Docking Applications
General Description
Outstanding Features
The PC87384, a member of the Winbond LPC SuperI/O
family, is targeted for a wide range of notebook and docking
applications where an FIR port is not required. The
PC87384 is PC2001 and ACPI compliant, and features Se-
rial Port, Parallel Port and General-Purpose Input/Output
(GPIO) support for a total of 21 ports.
■ LPC bus interface, based on Intel’s LPC Interface
Specification Revision 1.1, August 2002 (supports
CLKRUN and LPCPD signals)
■ PC2001 and ACPI Revision 3.0 compliant
■ Serial IRQ support (15 options)
■ Protection features, including GPIO lock and pin con-
figuration lock
■ 21 GPIO ports, including 14 with “assert IRQ” capability
■ XOR Tree and TRI-STATE device pins (for ICT) test-
ability modes.
■ 5V tolerant and back-drive protected pins (except LPC
bus pins)
■ 64-pin TQFP package
System Block Diagram
Portable
Platform
South Bridge
LPC Bus
Embedded
Controller
TPM
PC87382
Dock LPC Bus
Docking
Station
PC87384
Parallel
Interface Interface
Serial
I/O
Ports
© 2006 Winbond Electronics Corporation
www.winbond.com
Features
■ LPC System Interface
■ Serial Port
— Software compatible with the 16550A and the 16450
— Synchronous cycles, up to 33 MHz bus clock
— 8-bit I/O cycles
— Shadow register support for write-only bit monitoring
— UART data rates up to 1.5 Mbaud
— Up to four 8-bit DMA channels
— LPCPD and CLKRUN support
■ IEEE 1284-compliant Parallel Port
— Implements PCI mobile design guide recommenda-
tion (PCI Mobile Design Guide 1.1, Dec. 18, 1998)
— ECP, with Level 2 (14 mA sink and source output
buffers)
■ PC2001 and ACPI Compliant
— PnP Configuration Register structure
— Flexible resource allocation for all logical devices
■ Relocatable base address
— Software or hardware control
— Enhanced Parallel Port (EPP) compatible with EPP
1.7 and EPP 1.9
— Supports EPP as mode 4 of the Extended Control
Register (ECR)
■ 15 IRQ routing options
— Selection of internal pull-up or pull-down resistor for
■ Three optional 8-bit DMA channels (where appli-
cable) selected from four possible DMA chan-
nels
Paper End (PE) pin
— Supports a demand DMA mode mechanism and a
DMA fairness mechanism for improved bus utiliza-
tion
— Supports ACPI Specification Revision 3.0 September 2,
2004
— Protection circuit that prevents damage to the
parallel port when a printer connected to it is pow-
ered up or is operated at high voltages (in both
cases, even if the PC87384 is in power-down state)
■ Clock Sources
— 14.318 MHz or 48 MHz clock input
— LPC clock, up to 33 MHz
■ Power Supply
■ Strap Configuration
— Base Address (BADDR) strap to determine the base
— 3.3V supply operation
address of the Index-Data register pair
— All pins are 5V tolerant, except LPC bus pins
— Strap Inputs to select testability mode
■ Testability
— All pins are back-drive protected, except LPC bus
pins
— XOR Tree
■ 21 General-Purpose I/O (GPIO) Ports
— 14 support assert IRQ
— TRI-STATE device pins
— Programmable drive type for each output pin (open-
drain, push-pull or output disable)
— Programmable option for internal pull-up resistor on
each input pin
— Output lock option
— Programmable option for input debounce mechanism
www.winbond.com
2
Revision1.0
Physical Dimensions
All dimensions are in millimeters
64-Pin Thin Quad Flatpack (TQFP)
Order Number 87384MG/K1
Revision 1.0
3
www.winbond.com
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended
for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic
signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore,
Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein
personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Headquarters
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 1-408-9436666
TEL: 86-21-62365999
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
FAX: 1-408-5441798
FAX: 86-21-62365998
Taipei Office
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 81-45-4781881
TEL: 852-27513100
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
FAX: 81-45-4781800
FAX: 852-27552064
For Advanced PC Product Line information contact: APC.Support@winbond.com
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners
www.winbond.com
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