W25X32-VSSI [WINBOND]
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| 型号： | W25X32-VSSI |
| 厂家： | 
WINBOND |
| 描述： | 暂无描述 闪存 输出元件 |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W25X16, W25X32, W25X64
16M-BIT, 32M-BIT, AND 64M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date:
- 1 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES................................................................................................................................. 4
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
PIN CONFIGURATION WSON 6X5-MM.................................................................................... 5
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM............................... 6
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1
8.2
8.3
8.4
8.5
8.6
8.7
Package Types............................................................................................................... 8
Chip Select (/CS)............................................................................................................ 8
Serial Data Output (DO) ................................................................................................. 8
Write Protect (/WP)......................................................................................................... 8
HOLD (/HOLD) ............................................................................................................... 8
Serial Clock (CLK) .......................................................................................................... 8
Serial Data Input / Output (DIO) ..................................................................................... 8
9.
BLOCK DIAGRAM ...................................................................................................................... 9
FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.
10.1 SPI OPERATIONS ....................................................................................................... 10
10.1.1 SPI Modes....................................................................................................................10
10.1.2 Dual Output SPI............................................................................................................10
10.1.3 Hold Function ...............................................................................................................10
10.2 WRITE PROTECTION.................................................................................................. 11
10.2.1 Write Protect Features..................................................................................................11
11.
CONTROL AND STATUS REGISTERS................................................................................... 12
11.1 STATUS REGISTER .................................................................................................... 12
11.1.1 BUSY............................................................................................................................12
11.1.2 Write Enable Latch (WEL)............................................................................................12
11.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
11.1.4 Top/Bottom Block Protect (TB).....................................................................................12
11.1.5 Reserved Bits ...............................................................................................................12
11.1.6 Status Register Protect (SRP)......................................................................................13
11.1.7 Status Register Memory Protection..............................................................................14
11.2 INSTRUCTIONS........................................................................................................... 16
11.2.1 Manufacturer and Device Identification.........................................................................16
11.2.2 Instruction Set...............................................................................................................17
11.2.3 Write Ensable (06h)......................................................................................................18
- 2 -
W25X16, W25X32, W25X64
11.2.4 Write Disable (04h).......................................................................................................18
11.2.5 Read Status Register (05h) ..........................................................................................19
11.2.6 Write Status Register (01h) ..........................................................................................20
11.2.7 Read Data (03h)...........................................................................................................21
11.2.8 Fast Read (0Bh) ...........................................................................................................22
11.2.9 Fast Read Dual Output (3Bh) .......................................................................................23
11.2.10 Page Program (02h)...................................................................................................24
11.2.11 Sector Erase (20h) .....................................................................................................25
11.2.12 Block Erase (D8h) ......................................................................................................26
11.2.13 Chip Erase (C7h)........................................................................................................27
11.2.14 Power-down (B9h)......................................................................................................28
11.2.15 Release Power-down / Device ID (ABh) .....................................................................29
11.2.16 Read Manufacturer / Device ID (90h) .........................................................................31
11.2.17 JEDEC ID (9Fh)..........................................................................................................32
12.
ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 33
12.1 Absolute Maximum Ratings.......................................................................................... 33
12.2 Operating Ranges......................................................................................................... 33
12.3 Endurance and Data Retention .................................................................................... 34
12.4 Power-up Timing and Write Inhibit Threshold .............................................................. 34
12.5 DC Electrical Characteristics........................................................................................ 35
12.6 AC Measurement Conditions........................................................................................ 36
12.7 AC Electrical Characteristics ........................................................................................ 37
12.8 AC Electrical Characteristics (Cont’d) .......................................................................... 38
12.9 Serial Output Timing..................................................................................................... 39
12.10 Input Timing................................................................................................................. 39
12.11 Hold Timing ................................................................................................................. 39
PACKAGE SPECIFICATION.................................................................................................... 40
13.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40
13.2 8-Pin PDIP 300-mil (Package Code DA)...................................................................... 41
13.3 8-contact 6x5 WSON.................................................................................................... 42
13.4 8-contact 6x5 WSON (Cont’d)...................................................................................... 43
13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44
ORDERING INFORMATION .................................................................................................... 45
REVISION HISTORY................................................................................................................ 46
13.
14.
15.
Publication Release Date:
- 3 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
1. GENERAL DESCRIPTION
The W25X16 (16M-bit), W25X32 (32M-bit), and W25X64 (64M-bit) Serial Flash memories provide a
storage solution for systems with limited space, pins and power. The 25X series offers flexibility and
performance well beyond ordinary Serial Flash devices. They are ideal for code download applications
as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply
with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in
space-saving packages.
The W25X16/32/64 array is organized into 8,192/16,384/32,768 programmable pages of 256-bytes
each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can
be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase).
The W25X16/32/64 has 512/1024/2048 erasable sectors and 32/64/128 erasable blocks respectively.
The small 4KB sectors allow for greater flexibility in applications that require data and parameter
storage. (See figure 2.)
The W25X16/32/64 supports the standard Serial Peripheral Interface (SPI), and a high performance
dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial Data Out. SPI
clock frequencies of up to 75MHz are supported allowing equivalent clock rates of 150MHz when
using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and
16-bit Parallel Flash memories.
A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control
features, provide further control flexibility. Additionally, the device supports JEDEC standard
manufacturer and device identification.
2. FEATURES
• Family of Serial Flash Memories
• Low Power Consumption, Wide
Temperature Range
– Single 2.7 to 3.6V supply
– 5mA active current, 1µA Power-down (typ)
– -40° to +85°C operating range
– W25X16: 16M-bit / 2M-byte (2,097,152)
– W25X32: 32M-bit / 4M-byte (4,194,304)
– W25X64: 64M-bit / 8M-byte (8,388,608)
– 256-bytes per programmable page
– Uniform 4K-byte Sectors / 64K-byte Blocks
• Software and Hardware Write Protection
– Write-Protect all or portion of memory
– Enable/Disable protection with /WP pin
– Top or bottom array protection
• SPI with Single or Dual Outputs
– Clock, Chip Select, Data I/O, Data Out
– Optional Hold function for SPI flexibility
• Space Efficient Packaging
• Data Transfer up to 150M-bits / second
– Clock operation to 75MHz
– Fast Read Dual Output instruction
– Auto-increment Read capability
– 8-pin SOIC 208-mil (W25X16, X32)
– 8-pin PDIP 300-mil (W25X16, X32, X64)
– 16-pin SOIC 300-mil (W25X16, X32, X64)
– 8-pad WSON 6x5-mm (W25X16)
– 8-pad WSON 8x6-mm (W25X32, X64)
• Flexible Architecture with 4KB sectors
– Sector Erase (4K-bytes)
– Block Erase (64K-byte)
– Page program up to 256 bytes <2ms
– Up to 100,000 erase/write cycles
– 20-year retention
- 4 -
W25X16, W25X32, W25X64
3. PIN CONFIGURATION SOIC 208-MIL
Figure 1a. W25X16 and W25X32 Pin Assignments, 8-pin SOIC (Package Code SS)
4. PIN CONFIGURATION WSON 6X5-MM
Figure 1b. W25X16 Pin Assignments, 8-pin WSON (Package Code ZP)
Publication Release Date:
- 5 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
5. PIN CONFIGURATION PDIP 300-MIL
Figure 1c. W25X16, W25X32, W25X64 Pin Assignments, 8-pin PDIP (Package Code DA)
6. PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM
PAD NO.
PAD NAME
/CS
I/O
I
FUNCTION
1
2
3
4
5
6
7
8
Chip Select Input
Data Output
DO
O
I
/WP
Write Protect Input
Ground
GND
DIO
I/O
Data Input / Output
Serial Clock Input
Hold Input
CLK
I
I
/HOLD
VCC
Power Supply
- 6 -
W25X16, W25X32, W25X64
7. PIN CONFIGURATION SOIC 300-MIL
Figure 1d. W25X16, W25X32 and W25X64 Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
8. PIN DESCRIPTION SOIC 300-MIL
PAD NO.
PAD NAME
/HOLD
VCC
N/C
I/O
FUNCTION
1
2
I
Hold Input
Power Supply
No Connect
3
4
N/C
No Connect
5
N/C
No Connect
6
N/C
No Connect
7
/CS
I
O
I
Chip Select Input
Data Output
Write Protect Input
Ground
8
DO
9
/WP
GND
N/C
10
11
12
13
14
15
16
No Connect
N/C
No Connect
N/C
No Connect
N/C
No Connect
DIO
I/O
I
Data Input / Output
Serial Clock Input
CLK
Publication Release Date:
February 26, 2007, Revision E
- 7 -
W25X16, W25X32, W25X64
8.1 Package Types
At the time this datasheet was published not all package types had been finalized. Contact Winbond
to confirm availability of these packages before designing to this specification. W25X16 and W25X32
are offered in an 8-pin plastic 208-mil width SOIC (package code SS). The W25X16 in 6x5-mm
WSON (package code ZP) and 25X32 and 25X64 in 8x6-mm WSON. (package code ZE). The 25X16,
W25X32 and W25X64 are offered in 16-pin plastic 300-mil width SOIC (package code SF) and 300-
mil DIP (package code DA). See figures 1a-d. Package diagrams and dimensions are illustrated at the
end of this datasheet.
8.2 Chip Select (/CS)
The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is
deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices
power consumption will be at standby levels unless an internal erase, program or status register cycle
is in progress. When /CS is brought low the device will be selected, power consumption will increase
to active levels and instructions can be written to and data read from the device. After power-up, /CS
must transition from high to low before a new instruction will be accepted. The /CS input must track
the VCC supply level at power-up (see “Write Protection” and figure 20). If needed a pull-up resister
on /CS can be used to accomplish this.
8.3 Serial Data Output (DO)
The SPI Serial Data Output (DO) pin provides a means for data and status to be serially read from
(shifted out of) the device. Data is shifted out on the falling edge of the Serial Clock (CLK) input pin.
8.4 Write Protect (/WP)
The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (BP2, BP1, and BP0) bits and Status Register
Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The /WP pin is
active low.
8.5 HOLD (/HOLD)
The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought
low, while /CS is low, the DO pin will be at high impedance and signals on the DIO and CLK pins will
be ignored (don’t care). When /HOLD is brought high, device operation can resume. The /HOLD
function can be useful when multiple devices are sharing the same SPI signals. (“See Hold function”)
8.6 Serial Clock (CLK)
The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See
SPI Operations")
8.7 Serial Data Input / Output (DIO)
The SPI Serial Data Input/Output (DIO) pin provides a means for instructions, addresses and data to
be serially written to (shifted into) the device. Data is latched on the rising edge of the Serial Clock
(CLK) input pin. The DIO pin is also used as an output when the Fast Read Dual Output instruction is
executed.
- 8 -
W25X16, W25X32, W25X64
9. BLOCK DIAGRAM
7FFF00h
7F0000h
7FFFFFh
7F00FFh
40FF00h
400000h
3FFF00h
3F0000h
40FFFFh
4000FFh
3FFFFFh
3F00FFh
20FF00h
20FFFFh
/WP
200000h
1FFF00h
2000FFh
1FFFFFh
1F0000h
1F00FFh
00FF00h
000000h
00FFFFh
0000FFh
/HOLD
CLK
/CS
DIO
DO
Figure 2. W25X16, W25X32 and W25X64 Block Diagram
Publication Release Date:
- 9 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
10. FUNCTIONAL DESCRIPTION
10.1 SPI OPERATIONS
10.1.1 SPI Modes
The W25X16/32/64 is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (/CS), Serial Data Input/Output (DIO) and Serial Data Output (DO). Both SPI bus
operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode
3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not
being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low. For Mode 3 the CLK
signal is normally high. In either case data input on the DIO pin is sampled on the rising edge of the
CLK. Data on the DO and DIO pins are clocked out on the falling edge of CLK.
10.1.2 Dual Output SPI
The W25X16/32/64 supports Dual output operation when using the "Fast Read with Dual Output" (3B
hex) instruction. This feature allows data to be transferred from the Serial Flash memory at twice the
rate possible with the standard SPI. This instruction is ideal for quickly downloading code from Flash
to RAM upon power-up (code-shadowing) or for applications that cache code-segments to RAM for
execution. The Dual output feature simply allows the SPI input pin to also serve as an output during
this instruction. All other operations use the standard SPI interface with single output signal.
10.1.3 Hold Function
The /HOLD signal allows the W25X16/32/64 operation to be paused while it is actively selected (when
/CS is low). The /HOLD function may be useful in cases where the SPI data and clock signals are
shared with other devices. For example, consider if the page buffer was only partially written when a
priority interrupt requires use of the SPI bus. In this case the /HOLD function can save the state of the
instruction and the data in the buffer so programming can resume where it left off once the bus is
available again.
To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will
activate on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not
already low the /HOLD condition will activate after the next falling edge of CLK. The /HOLD condition
will terminate on the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not
already low the /HOLD condition will terminate after the next falling edge of CLK.
During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data
Input/Output (DIO) and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept
active (low) for the full duration of the /HOLD operation to avoid resetting the internal logic state of the
device.
- 10 -
W25X16, W25X32, W25X64
10.2 WRITE PROTECTION
Applications that use non-volatile memory must take into consideration the possibility of noise and
other adverse system conditions that may compromise data integrity. To address this concern the
W25X16/32/64 provides several means to protect data from inadvertent writes.
10.2.1 Write Protect Features
•
•
•
•
•
•
•
Device resets when VCC is below threshold.
Time delay write disable after Power-up.
Write enable/disable instructions.
Automatic write disable after program and erase.
Software write protection using Status Register.
Hardware write protection using Status Register and /WP pin.
Write Protection using Power-down instruction.
Upon power-up or at power-down the W25X16/32/64 will maintain a reset condition while VCC is
below the threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 20). While
reset, all operations are disabled and no instructions are recognized. During power-up and after the
VCC voltage exceeds VWI, all program and erase related instructions are further disabled for a time
delay of tPUW. This includes the Write Enable, Page Program, Sector Erase, Block Erase, Chip Erase
and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC
supply level at power-up until the VCC-min level and tVSL time delay is reached. If needed a pull-up
resister on /CS can be used to accomplish this.
After power-up the device is automatically placed in a write-disabled state with the Status Register
Write Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page
Program, Sector Erase, Chip Erase or Write Status Register instruction will be accepted. After
completing a program, erase or write instruction the Write Enable Latch (WEL) is automatically
cleared to a write-disabled state of 0.
Software controlled write protection is facilitated using the Write Status Register instruction and setting
the Status Register Protect (SRP) and Block Protect (TB, BP2, BP1, and BP0) bits. These Status
Register bits allow a portion or all of the memory to be configured as read only. Used in conjunction
with the Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under
hardware control. See Status Register for further information.
Additionally, the Power-down instruction offers an extra level of write protection as all instructions are
ignored except for the Release Power-down instruction.
Publication Release Date:
- 11 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11. CONTROL AND STATUS REGISTERS
The Read Status Register instruction can be used to provide status on the availability of the Flash
memory array, if the device is write enabled or disabled, and the state of write protection. The Write
Status Register instruction can be used to configure the devices write protection features. See Figure 3.
11.1 STATUS REGISTER
11.1.1 BUSY
BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing
a Page Program, Sector Erase, Block Erase, Chip Erase or Write Status Register instruction. During
this time the device will ignore further instructions except for the Read Status Register instruction (see
tW, tPP, tSE, TBE, and tCE in AC Characteristics). When the program, erase or write status register
instruction has completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for
further instructions.
11.1.2 Write Enable Latch (WEL)
Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to a 1 after executing
a Write Enable Instruction. The WEL status bit is cleared to a 0 when the device is write disabled. A
write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page
Program, Sector Erase, Block Erase, Chip Erase and Write Status Register.
11.1.3 Block Protect Bits (BP2, BP1, BP0)
The Block Protect Bits (BP2, BP1, and BP0) are non-volatile read/write bits in the status register (S4,
S3, and S2) that provide Write Protection control and status. Block Protect bits can be set using the
Write Status Register Instruction (see tW in AC characteristics). All, none or a portion of the memory
array can be protected from Program and Erase instructions (see Status Register Memory Protection
table). The factory default setting for the Block Protection Bits is 0, none of the array protected. The
Block Protect bits can not be written to if the Status Register Protect (SRP) bit is set to 1 and the Write
Protect (/WP) pin is low.
11.1.4 Top/Bottom Block Protect (TB)
The Top/Bottom bit (TB) controls if the Block Protect Bits (BP2, BP1, BP0) protect from the Top
(TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table.
The TB bit is non-volatile and the factory default setting is TB=0. The TB bit can be set with the Write
Status Register Instruction provided that the Write Enable instruction has been issued. The TB bit can
not be written to if the Status Register Protect (SRP) bit is set to 1 and the Write Protect (/WP) pin is
low.
11.1.5 Reserved Bits
Status register bit location S6 is reserved for future use. Current devices will read 0 for this bit
location. It is recommended to mask out the reserved bit when testing the Status Register. Doing this
will ensure compatibility with future devices.
- 12 -
W25X16, W25X32, W25X64
11.1.6 Status Register Protect (SRP)
The Status Register Protect (SRP) bit is a non-volatile read/write bit in status register (S7) that can be
used in conjunction with the Write Protect (/WP) pin to disable writes to status register. When the SRP
bit is set to a 0 state (factory default) the /WP pin has no control over status register. When the SRP
pin is set to a 1, the Write Status Register instruction is locked out while the /WP pin is low. When the
/WP pin is high the Write Status Register instruction is allowed.
Figure 3. Status Register Bit Locations
Publication Release Date:
- 13 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.1.7 Status Register Memory Protection
STATUS REGISTER(1)
W25X64 (64M-BIT) MEMORY PROTECTION
DENSITY
TB BP2 BP1 BP0
BLOCK(S)
ADDRESSES
PORTION
(KB)
x
0
0
0
0
0
0
1
1
1
1
1
1
x
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
1
1
0
0
1
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
NONE
126 and 127
124 and 127
120 thru 127
112 thru 127
96 thru 127
64 thru 127
0 and 1
0 thru 3
0 thru 7
0 thru 15
0 thru 31
NONE
NONE
1M -bit
2M-bit
4M-bit
8M-bit
16M-bit
32M-bit
1M-bit
2M-bit
4M-bit
8M-bit
16M-bit
16M-bit
64M-bit
NONE
7E0000h - 7FFFFFh
7C0000h - 7FFFFFh
780000h - 7FFFFFh
700000h - 7FFFFFh
600000h - 7FFFFFh
400000h - 7FFFFFh
000000h - 01FFFFh
000000h - 03FFFFh
000000h - 07FFFFh
000000h – 0FFFFFh
000000h – 1FFFFFh
000000h – 3FFFFFh
000000h - 7FFFFFh
Upper 1/64
Upper 1/32
Upper 1/16
Upper 1/8
Upper 1/4
Upper 1/2
Lower 1/64
Lower 1/32
Lower 1/16
Lower 1/8
Lower 1/4
Lower 1/2
ALL
0 thru 63
0 thru 127
STATUS REGISTER(1)
W25X32 (32M-BIT) MEMORY PROTECTION
DENSITY
TB
BP2 BP1 BP0
BLOCK(S)
ADDRESSES
PORTION
(KB)
x
0
0
0
0
0
0
1
1
1
1
1
1
x
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
1
1
0
0
1
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
NONE
63
NONE
NONE
512K-bit
1M-bit
2M-bit
4M-bit
NONE
3F0000h - 3FFFFFh
3E0000h - 3FFFFFh
3C0000h - 3FFFFFh
380000h - 3FFFFFh
300000h - 3FFFFFh
200000h - 3FFFFFh
000000h - 00FFFFh
000000h - 01FFFFh
000000h - 03FFFFh
000000h - 07FFFFh
000000h – 0FFFFFh
000000h – 1FFFFFh
000000h - 3FFFFFh
Upper 1/64
Upper 1/32
Upper 1/16
Upper 1/8
Upper 1/4
Upper 1/2
Lower 1/64
Lower 1/32
Lower 1/16
Lower 1/8
Lower 1/4
Lower 1/2
ALL
62 and 63
60 thru 63
56 thru 63
48 thru 63
32 thru 63
0
0 and 1
0 thru 3
0 thru 7
0 thru 15
0 thru 31
0 thru 63
8M-bit
16M-bit
512K-bit
1M-bit
2M-bit
4M-bit
8M-bit
16M-bit
32M-bit
- 14 -
W25X16, W25X32, W25X64
STATUS REGISTER(1)
W25X16 (16M-BIT) MEMORY PROTECTION
ADDRESSES DENSITY (KB)
NONE NONE
TB
BP2 BP1 BP0
BLOCK(S)
NONE
PORTION
NONE
x
0
0
0
0
0
1
1
0
0
0
0
1
1
0
0
0
1
1
1
0
0
1
1
0
0
0
1
1
0
0
1
0
1
0
1
0
1
1
0
1
0
1
x
31
1F0000h - 1FFFFFh
1E0000h - 1FFFFFh
1C0000h - 1FFFFFh
180000h - 1FFFFFh
100000h - 1FFFFFh
000000h - 00FFFFh
000000h - 01FFFFh
000000h - 03FFFFh
000000h - 07FFFFh
000000h - 0FFFFFh
000000h - 1FFFFFh
512K-bit
1M-bit
2M-bit
4M-bit
8M-bit
512K-bit
1M-bit
2M-bit
4M-bit
8M-bit
16M-bit
Upper 1/32
Upper 1/16
Upper 1/8
Upper 1/4
Upper 1/2
Lower 1/32
Lower 1/16
Lower 1/8
Lower 1/4
Lower 1/2
ALL
30 and 31
28 thru 31
24 thru 31
16 thru 31
0
0 and 1
0 thru 3
0 thru 7
0 thru 15
0 thru 31
1
1
1
x
Note:
1. x = don’t care
Publication Release Date:
- 15 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2 INSTRUCTIONS
The instruction set of the W25X16/32/64 consists of fifteen basic instructions that are fully controlled
through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked into the DIO input provides the instruction code. Data on
the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 19. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a
full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects
the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or
when the Status Register is being written, all instructions except for Read Status Register will be
ignored until the program or erase cycle has completed.
11.2.1 Manufacturer and Device Identification
MANUFACTURER ID
(M7-M0)
Winbond Serial Flash
EFH
(ID15-ID0)
9Fh
Device ID
Instruction
W25X16
(ID7-ID0)
ABh, 90h
14h
3015h
3016h
3017h
W25X32
15h
W25X64
16h
- 16 -
W25X16, W25X32, W25X64
11.2.2 Instruction Set (1)
INSTRUCTION
NAME
BYTE 1 BYTE 2
CODE
BYTE 3
BYTE 4 BYTE 5
BYTE 6
N-BYTES
Write Enable
06h
04h
Write Disable
Read Status
Register
(2)
05h
(S7–S0)(1)
Write Status
Register
01h
03h
0Bh
S7–S0
Read Data
A23–A16
A23–A16
A15–A8
A15–A8
A7–A0
A7–A0
(D7–D0)
dummy
(Next byte)
(D7–D0)
continuous
(Next Byte)
continuous
Fast Read
I/O =
(D6,D4,D2,D0)
O =
(one byte
per 4 clocks,
continuous)
Fast Read Dual
Output
3Bh
A23–A16
A15–A8
A7–A0
dummy
(D7,D5,D3,D1)
Up to 256
bytes
Page Program
02h
D8h
20h
A23–A16
A23–A16
A23–A16
A15–A8
A15–A8
A15–A8
A7–A0
A7–A0
A7–A0
(D7–D0)
(Next byte)
Block Erase
(64KB)
Sector Erase
(4KB)
Chip Erase
Power-down
Release Power-
down / Device ID
Manufacturer/
Device ID (3)
C7h
B9h
ABh
90h
dummy
dummy
dummy
dummy
dummy
00h
(ID7-ID0)(4)
(M7-M0)
(ID7-ID0)
(ID15-ID8)
Memory
Type
(M7-M0)
Manufacturer
(ID7-ID0)
Capacity
JEDEC ID
9Fh
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being
read from the device on the DO pin.
2. The Status Register contents will repeat continuously until /CS terminates the instruction.
3. See Manufacturer and Device Identification table for Device ID information.
4. The Device ID will repeat continuously until /CS terminates the instruction.
Publication Release Date:
- 17 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.3 Write Enable (06h)
The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to
a 1. The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase
and Write Status Register instruction. The Write Enable instruction is entered by driving /CS low,
shifting the instruction code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then
driving /CS high.
Figure 4. Write Enable Instruction Sequence Diagram
11.2.4 Write Disable (04h)
The Write Dissable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status
Register to a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction
code “04h” into the DIO pin and then driving /CS high. Note that the WEL bit is automatically reset
after Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, Block
Erase and Chip Erase instructions.
Figure 5. Write Disable Instruction Sequence Diagram
- 18 -
W25X16, W25X32, W25X64
11.2.5 Read Status Register (05h)
The Read Status Register instruction allows the 8-bit Status Register to be read. The instruction is
entered by driving /CS low and shifting the instruction code “05h” into the DIO pin on the rising edge of
CLK. The status register bits are then shifted out on the DO pin at the falling edge of CLK with most
significant bit (MSB) first as shown in figure 6. The Status Register bits are shown in figure 3 and
include the BUSY, WEL, BP2-BP0, TB and SRP bits (see description of the Status Register earlier in
this datasheet).
The Status Register instruction may be used at any time, even while a Program, Erase or Write Status
Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the
cycle is complete and if the device can accept another instruction. The Status Register can be read
continuously, as shown in Figure 6. The instruction is completed by driving /CS high.
Figure 6. Read Status Register Instruction Sequence Diagram
Publication Release Date:
- 19 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.6 Write Status Register (01h)
The Write Status Register instruction allows the Status Register to be written. A Write Enable
instruction must previously have been executed for the device to accept the Write Status Register
Instruction (Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by
driving /CS low, sending the instruction code “01h”, and then writing the status register data byte as
illustrated in figure 7. The Status Register bits are shown in figure 3 and described earlier in this
datasheet.
Only non-volatile Status Register bits SRP, TB, BP2, BP1 and BP0 (bits 7, 5, 4, 3 and 2) can be
written to. All other Status Register bit locations are read-only and will not be affected by the Write
Status Register instruction.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not
done the Write Status Register instruction will not be executed. After /CS is driven high, the self-timed
Write Status Register cycle will commence for a time duration of tW (See AC Characteristics). While
the Write Status Register cycle is in progress, the Read Status Register instruction may still accessed
to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status Register cycle and a
0 when the cycle is finished and ready to accept other instructions again. After the Write Register
cycle has finished the Write Enable Latch (WEL) bit in the Status Register will be cleared to 0.
The Write Status Register instruction allows the Block Protect bits (TB, BP2, BP1 and BP0) to be set
for protecting all, a portion, or none of the memory from erase and program instructions. Protected
areas become read-only (see Status Register Memory Protection table). The Write Status Register
instruction also allows the Status Register Protect bit (SRP) to be set. This bit is used in conjunction
with the Write Protect (/WP) pin to disable writes to the status register. When the SRP bit is set to a 0
state (factory default) the /WP pin has no control over the status register. When the SRP pin is set to a
1, the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is
high the Write Status Register instruction is allowed.
Figure 7. Write Status Register Instruction Sequence Diagram
- 20 -
W25X16, W25X32, W25X64
11.2.7 Read Data (03h)
The Read Data instruction allows one more data bytes to be sequentially read from the memory. The
instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed
by a 24-bit address (A23-A0) into the DIO pin. The code and address bits are latched on the rising
edge of the CLK pin. After the address is received, the data byte of the addressed memory location
will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The
address is automatically incremented to the next higher address after each byte of data is shifted out
allowing for a continuous stream of data. This means that the entire memory can be accessed with a
single instruction as long as the clock continues. The instruction is completed by driving /CS high. The
Read Data instruction sequence is shown in figure 8. If a Read Data instruction is issued while an
Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any
effects on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of
fR (see AC Electrical Characteristics).
Figure 8. Read Data Instruction Sequence Diagram
Publication Release Date:
- 21 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.8 Fast Read (0Bh)
The Fast Read instruction is similar to the Read Data instruction except that it can operate at the
highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding
eight “dummy” clocks after the 24-bit address as shown in figure 9. The dummy clocks allow the
devices internal circuits additional time for setting up the initial address. During the dummy clocks the
data value on the DIO pin is a “don’t care”.
Figure 9. Fast Read Instruction Sequence Diagram
- 22 -
W25X16, W25X32, W25X64
11.2.9 Fast Read Dual Output (3Bh)
The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction
except that data is output on two pins, DO and DIO, instead of just DO. This allows data to be
transferred from the W25X16/32/64 at twice the rate of standard SPI devices. The Fast Read Dual
Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for
applications that cache code-segments to RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24-bit address as shown in figure 10. The dummy clocks allow the device's
internal circuits additional time for setting up the initial address. The input data during the dummy
clocks is “don’t care”. However, the DIO pin should be high-impedance prior to the falling edge of the
first data out clock.
Figure 10. Fast Read Dual Output Instruction Sequence Diagram
Publication Release Date:
- 23 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.10 Page Program (02h)
The Page Program instruction allows up to 256 bytes of data to be programmed at previously erased
to all 1s (FFh) memory locations. A Write Enable instruction must be executed before the device will
accept the Page Program Instruction (Status Register bit WEL must equal 1). The instruction is
initiated by driving the /CS pin low then shifting the instruction code “02h” followed by a 24-bit address
(A23-A0) and at least one data byte, into the DIO pin. The /CS pin must be held low for the entire
length of the instruction while data is being sent to the device. The Page Program instruction
sequence is shown in figure 11.
If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address
bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceed the
remaining page length, the addressing will wrap to the beginning of the page. In some cases, less
than 256 bytes (a partial page) can be programmed without having any effect on other bytes within the
same page. One condition to perform a partial page program is that the number of clocks can not
exceed the remaining page length. If more than 256 bytes are sent to the device the addressing will
wrap to the beginning of the page and overwrite previously sent data.
As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last
byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS
is driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See
AC Characteristics). While the Page Program cycle is in progress, the Read Status Register
instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during
the Page Program cycle and becomes a 0 when the cycle is finished and the device is ready to accept
other instructions again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit
in the Status Register is cleared to 0. The Page Program instruction will not be executed if the
addressed page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register
Memory Protection table).
Figure 11. Page Program Instruction Sequence Diagram
- 24 -
W25X16, W25X32, W25X64
11.2.11 Sector Erase (20h)
The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state
of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector
Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS
pin low and shifting the instruction code “20h” followed a 24-bit sector address (A23-A0) (see Figure
2). The Sector Erase instruction sequence is shown in figure 12.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not
done the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector
Erase instruction will commence for a time duration of tSE (See AC Characteristics). While the Sector
Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the
status of the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the
cycle is finished and the device is ready to accept other instructions again. After the Sector Erase
cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector
Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB,
BP2, BP1, and BP0) bits (see Status Register Memory Protection table).
Figure 12. Sector Erase Instruction Sequence Diagram
Publication Release Date:
- 25 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.12 Block Erase (D8h)
The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of
all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block
Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS
pin low and shifting the instruction code “D8h” followed a 24-bit block address (A23-A0) (see Figure
2). The Block Erase instruction sequence is shown in figure 13.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not
done the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block
Erase instruction will commence for a time duration of tBE (See AC Characteristics). While the Block
Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the
status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the
cycle is finished and the device is ready to accept other instructions again. After the Block Erase cycle
has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase
instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1,
and BP0) bits (see Status Register Memory Protection table).
Figure 13. Block Erase Instruction Sequence Diagram
- 26 -
W25X16, W25X32, W25X64
11.2.13 Chip Erase (C7h)
The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A
Write Enable instruction must be executed before the device will accept the Chip Erase Instruction
(Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and
shifting the instruction code “C7h”. The Chip Erase instruction sequence is shown in figure 14.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip
Erase instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction
will commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in
progress, the Read Status Register instruction may still be accessed to check the status of the BUSY
bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is
ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable
Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed
if any page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory
Protection table).
Figure 14. Chip Erase Instruction Sequence Diagram
Publication Release Date:
- 27 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.14 Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC
Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code
“B9h” as shown in figure 15.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-
down instruction will not be executed. After /CS is driven high, the power-down state will entered
within the time duration of tDP (See AC Characteristics). While in the power-down state only the
Release from Power-down / Device ID instruction, which restores the device to normal operation, will
be recognized. All other instructions are ignored. This includes the Read Status Register instruction,
which is always available during normal operation. Ignoring all but one instruction makes the Power
Down state a useful condition for securing maximum write protection. The device always powers-up in
the normal operation with the standby current of ICC1.
Figure 15. Deep Power-down Instruction Sequence Diagram
- 28 -
W25X16, W25X32, W25X64
11.2.15 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, obtain the devices electronic identification (ID) number
or do both.
When used only to release the device from the power-down state, the instruction is issued by driving
the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 16. After
the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other
instructions will be accepted. The /CS pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated
by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The
Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as
shown in figure 17. The Device ID values for the W25X16, W25X32, AND W25X64 are listed in
Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction
is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction
is the same as previously described, and shown in figure 17, except that after /CS is driven high it
must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the
device will resume normal operation and other instructions will be accepted.
If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write
cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on
the current cycle
Figure 16. Release Power-down Instruction Sequence
Publication Release Date:
- 29 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
Figure 17. Release Power-down / Device ID Instruction Sequence Diagram
- 30 -
W25X16, W25X32, W25X64
11.2.16 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 18. The Device ID values for the W25X16, W25X32, AND W25X64 are listed in
Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device
ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can
be read continuously, alternating from one to the other. The instruction is completed by driving /CS
high.
Figure 18. Read Manufacturer / Device ID Diagram
Publication Release Date:
- 31 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
11.2.17 JEDEC ID (9Fh)
For compatibility reasons, the W25X16/32/64 provides several instructions to electronically determine
the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for
SPI compatible serial memories that was adopted in 2003.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The
JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type
(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant
bit (MSB) first as shown in figure 19. For memory type and capacity values refer to Manufacturer and
Device Identification table.
Figure 19. Read JEDEC ID
- 32 -
W25X16, W25X32, W25X64
(1)
12. ELECTRICAL CHARACTERISTICS
(2)
12.1 Absolute Maximum Ratings
PARAMETERS
SYMBOL CONDITIONS
RANGE
UNIT
V
Supply Voltage
VCC
–0.6 to +4.0
–0.6 to VCC +0.4
Voltage applied to any Pin
VIO
Relative to Ground
V
<20nS Transient
Relative to Ground
Transient Voltage on any Pin
VIOT
–2.0V to VCC+2.0V
V
Storage Temperature
TSTG
TLEAD
VESD
–65 to +150
See Note (3)
°C
°C
V
Lead Temperature
Electrostatic Discharge Voltage
Human Body Model(4)
–2000 to +2000
Notes:
1. Specifications for W25X32 and W25X64 are preliminary. See preliminary designation at the end of
this datasheet.
2. This device has been designed and tested for the specified operation ranges. Proper operation
outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device
reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
3. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly
and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
4. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 ohms, R2=500 ohms).
12.2 Operating Ranges
SPEC
PARAMETER
SYMBOL CONDITIONS
UNIT
V
MIN
2.7
3.0
3.0
0
MAX
3.6
FR = 50MHz, fR = 33MHz
Supply Voltage(1)
VCC
TA
F
R0 = 70MHz, fR = 33MHz
R1 = 75MHz, fR = 33MHz
3.6
F
3.6
Commercial (2)
+70
+85
Ambient Temperature,
Operating
°C
Industrial
–40
Note:
1. VCC voltage during Read can operate across the min and max range but should not exceed ±10% of the
programming (erase/write) voltage.
2. Commercial temperature only applies to Fast Read (FR0 & FR1) and 100K cycles endurance for 4K byte sectors .
Industrial temperature applies to all other parameters.
Publication Release Date:
- 33 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
12.3 Endurance and Data Retention
PARAMETER
CONDITIONS
MIN
MAX
UNIT
Erase/Program Cycles 4KB sector, 64KB block or full chip.
100,000
20
cycles
years
Data Retention
Full Temperature Range
12.4 Power-up Timing and Write Inhibit Threshold
SPEC
PARAMETER
SYMBOL
UNIT
MIN
10
1
MAX
VCC (min) to /CS Low
tVSL(1)
tPUW(1)
VWI(1)
µs
ms
V
Time Delay Before Write Instruction
Write Inhibit Threshold Voltage
10
2
1
Note:
1. These parameters are characterized only.
Figure 20. Power-up Timing and Voltage Levels
- 34 -
W25X16, W25X32, W25X64
12.5 DC Electrical Characteristics
SPEC
UNIT
PARAMETER
SYMBOL CONDITIONS
MIN
TYP
MAX
Input Capacitance
CIN(1)
VIN = 0V(2)
6
pf
pf
Output Capacitance Cout(1)
VOUT = 0V(2)
8
Input Leakage
I/O Leakage
ILI
±2
±2
µA
µA
ILO
/CS = VCC,
VIN = GND or VCC
Standby Current
ICC1
25
<1
50
10
µA
µA
/CS = VCC,
VIN = GND or VCC
Power-down Current ICC2
Current Read Data /
Dual Output Read
1MHz(2)
C = 0.1 VCC / 0.9 VCC
DO = Open
ICC3
ICC3
ICC3
ICC3
4/5
6/7
6/7.5
9/10
mA
mA
mA
mA
Current Read Data /
Dual Output Read
33MHz(2)
C = 0.1 VCC / 0.9 VCC
DO = Open
Current Read Data /
Dual Output Read
50MHz(2)
C = 0.1 VCC / 0.9 VCC
DO = Open
7/8
10/12
15/16.5
Current Read Data /
Dual Output Read
75MHz(2)
C = 0.1 VCC / 0.9 VCC
DO = Open
10/11
Current Page
Program
ICC4
ICC5
ICC6
/CS = VCC
/CS = VCC
20
8
25
12
25
mA
mA
mA
Current Write Status
Register
Current Sector/Block
Erase
/CS = VCC
/CS = VCC
20
20
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
ICC7
VIL
25
mA
V
–0.5
VCC x 0.3
VCC +0.4
0.4
VIH
VOL
VCC x0.7
V
IOL = 1.6 mA
V
Output High Voltage VOH
IOH = –100 µA
VCC –0.2
V
Notes:
1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V.
2. Checker Board Pattern.
Publication Release Date:
- 35 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
12.6 AC Measurement Conditions
SPEC
PARAMETER
SYMBOL
UNIT
MIN
MAX
30
15
5
Load Capacitance
CL
pF
Load Capacitance for FR1 only
Input Rise and Fall Times
Input Pulse Voltages
TR, TF
VIN
ns
V
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
0.5 VCC to 0.5 VCC
Input Timing Reference Voltages
Output Timing Reference Voltages
IN
V
OUT
V
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
Figure 21. AC Measurement I/O Waveform
- 36 -
W25X16, W25X32, W25X64
12.7 AC Electrical Characteristics
SPEC
DESCRIPTION
SYMBOL ALT
UNIT
MIN
TYP
MAX
Clock frequency
for all instructions, except Read Data (03h)
FR
fC
D.C.
50
MHz
2.7V-3.6V VCC & Industrial Temperature
Clock frequency
for all instructions, except Read Data (03h)
3.0V-3.6V VCC & Commercial Temperature
(4)
FR0
fC0
D.C.
D.C.
70
MHz
MHz
Clock frequency, for Fast Read (0Bh, 3Bh) only
3.0V-3.6V VCC & Commercial Temperature
(4)
FR1
fC1
75
33
Clock freq. Read Data instruction 03h
fR
D.C.
6/7
MHz
ns
Clock High, Low Time, for Fast Read (0Bh, 3Bh) /
other instructions except Read Data (03h)
tCLH,
tCLL
(1)
Clock High, Low Time for Read Data (03h)
instruction
tCRLH,
tCRLL
8
ns
(1)
(2)
Clock Rise Time peak to peak
Clock Fall Time peak to peak
/CS Active Setup Time relative to CLK
/CS Not Active Hold Time relative to CLK
Data In Setup Time
tCLCH
0.1
0.1
5
V/ns
V/ns
ns
(2)
tCHCL
tSLCH
tCHSL
tDVCH
tCHDX
tCHSH
tSHCH
tSHSL
tCSS
5
ns
tDSU
tDH
2
ns
Data In Hold Time
5
ns
/CS Active Hold Time relative to CLK
/CS Not Active Setup Time relative to CLK
/CS Deselect Time
5
ns
5
ns
tCSH
tDIS
100
ns
(2)
Output Disable Time
tSHQZ
7
ns
Clock Low to Output Valid
2.7V-3.6V / 3.0V-3.6V
tCLQV
tCLQX
tV
7 / 6
ns
ns
Output Hold Time
tHO
0
Continued – next page
Publication Release Date:
- 37 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
12.8 AC Electrical Characteristics (cont’d)
SPEC
DESCRIPTION
SYMBOL ALT
UNIT
MIN
5
TYP
MAX
/HOLD Active Setup Time relative to CLK
/HOLD Active Hold Time relative to CLK
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
/HOLD to Output Low-Z
tHLCH
tCHHH
tHHCH
tCHHL
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
5
5
5
(2)
tHHQX
tLZ
7
(2)
/HOLD to Output High-Z
tHLQZ
tWHSL
tSHWL
tHZ
12
(3)
(3)
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
20
100
(2)
tDP
3
3
/CS High to Standby Mode without Electronic
Signature Read
tRES1(2)
tRES2(2)
/CS High to Standby Mode with Electronic
Signature Read
1.8
µs
Write Status Register Time
tW
tBP1
tBP2
tPP
tSE
tBE
tCE
10
100
6
15
150
12
3
ms
µs
µs
ms
ms
s
Byte Program Time (First Byte) (5)
Additional Byte Program Time (After First Byte) (5)
Page Program Time
1.6
150
0.8
Sector Erase Time (4KB)
300
2
Block Erase Time (64KB)
Chip Erase Time W25X16
Chip Erase Time W25X32
Chip Erase Time W25X64
25
40
40
40
80
100
s
s
s
Notes:
1. Clock high + Clock low must be less than or equal to 1/fC.
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.
4. Commercial temperature only applies to Fast Read (FR0 & FR1). Industrial temperature applies to all other parameters.
5. For multiple bytes after first byte within a page, tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max), where N
= number of bytes programmed.
- 38 -
W25X16, W25X32, W25X64
12.9 Serial Output Timing
12.10 Input Timing
12.11 Hold Timing
Publication Release Date:
- 39 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
13. PACKAGE SPECIFICATION
13.1 8-Pin SOIC 208-mil (Package Code SS)
MILLIMETERS
INCHES
MIN MAX
SYMBOL
MIN
MAX
A
A1
A2
b
C
D
E
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
E1
e
1.27 BSC
0.050 BSC
L
θ
0.50
0o
0.80
8o
0.020
0o
0.031
8o
y
---
0.10
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
- 40 -
W25X16, W25X32, W25X64
13.2 8-Pin PDIP 300-mil (Package Code DA)
D
8
5
1
E
4
1
B
B
1
E
S
c
Base Plane
2
A
1
A
A
Seating Plane
L
e1
eA
α
Dimension in inch
Dimension in mm
Symbol
Nom
Nom
Min
Max
Min
Max
4.45
0.175
A
0.010
0.125
0.016
0.058
0.008
0.25
3.18
0.41
1.47
0.20
1
A
A
B
B
c
D
E
E
e
0.130
0.018
0.060
0.010
0.360
0.135
0.022
0.064
0.014
0.380
3.30
0.46
1.52
0.25
9.14
7.62
6.35
2.54
3.30
3.43
0.56
1.63
0.36
9.65
7.87
6.48
2.79
2
1
0.310
0.255
0.110
0.290
0.245
0.090
0.300
0.250
0.100
7.37
6.22
2.29
1
1
3.05
0
0.140
15
0.120
0
0.130
3.56
15
L
α
A
e
9.53
1.14
0.335
0.375
0.045
8.51
0.355
9.02
S
Publication Release Date:
- 41 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
13.3 8-contact 6x5 WSON
- 42 -
W25X16, W25X32, W25X64
13.4 8-contact 6x5 WSON Cont’d.
Publication Release Date:
- 43 -
February 26, 2007, Revision E
W25X16, W25X32, W25X64
13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)
MILLIMETERS
INCHES
MIN MAX
SYMBOL
MIN
2.36
0.10
0.33
0.18
10.08
10.01
7.39
MAX
2.64
0.30
0.51
0.28
10.49
10.64
7.59
A
A1
b
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.104
0.012
0.020
0.011
0.413
0.419
0.299
C
D(3)
E
E1(3)
e(2)
L
1.27 BSC
0.050 BSC
0.39
0o
1.27
8o
0.015
0o
0.050
8o
θ
y
---
0.076
---
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
- 44 -
W25X16, W25X32, W25X64
14. ORDERING INFORMATION (1)
Notes:
1a. Only the 2nd letter is used for the part marking.
1b. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel
(shape T), when placing orders.
1c. The “W” prefix is not included on the part marking.
Valid Combinations for W25X16/32/64:
W25X16VSSIG
W25X16VSFIG
W25X16VDAIG
W25X16VZPIG
W25X32VSSIG
W25X32VSFIG
W25X32VDAIG
W25X32VZEIG
W25X64VSFIG
W25X64VDAIG
W25X64VZEIG
Publication Release Date:
February 26, 2007, Revision E
- 45 -
W25X16, W25X32, W25X64
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
02/13/06
New Create
Added W25X64 in the product family of
W25X16/32/64. Added 300mil PDIP package.
Added 6x5 mm WSON package. Updated
Endurance and Data Retention table (11.3),
ICC’s in DC Parameter table (11.5 & 11.6).
Reduced tPP (max) from 5mS to 3mS.
Changed tSHCH from 5nS to 0nS. Added
byte programming parameters (tBP1 & tBPn.
Added additional byte programming
1-4, 6, 32-36,
41, 42
B
06/28/06
parameter, tBP2 and moved multiple byte
programming tBPn with formula to foot note.
Changed tCHSH and tSHCH respectively
from 10nS and 0nS to 5nS to 5nS. Modified
to the ordering information table to eliminate
the hyphen in the part number. Corrected
Write Enable/Disable text. Change ICC2
from 5uA to 10uA.. Added footnotes in the
ordering information table.
C
D
10/19/06
18, 35, 37 & 45
Changed ICC3 specs:
33Mhz (typ): from 10/10mA to 10/13mA
50Mhz (typ): from 10/15mA to 12/15mA
50Mhz (max): from 15/20mA to 17/22mA
2/1/07
4 - 8 & 45
Updated package and ordering information.
Updated Figure 2.
Updated ICC3 specs:
1MHz (typ): from 5/8mA to 4/5mA
1MHz (max): from 10/12mA to 6/7.5mA
33MHz (typ): from 10/13mA to 6/7mA
33MHz (max): from 15/20mA to 9/10mA
6-9, 29, 33, 35, 50MHz (typ): from 12/15mA to 7/8mA
E
2/26/07
38 & 45
50MHz (max): from 17/22mA to 10/12mA
75MHz (typ): from 15/20mA to 10/11mA
75MHz (max): from 20/25mA to 15/16.5mA
Added Valid Combinations for ordering info.
Added transient voltage specification.
Removed preliminary designation for 25X16.
Updated typical ratings on erase operations.
- 46 -
W25X16, W25X32, W25X64
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and spiFlash are trademarks of Winbond Electronics Corporation All other marks are the
property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane
or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Further more, Winbond
products are not intended for applications wherein failure of Winbond products could result or lead to
a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document and
the products and services decribed herein at any time, without notice.
Headquarters
Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
2727 North First Street, San Jose,
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
200336 China
CA 95134, U.S.A.
TEL: 86-21-62365999
FAX: 86-21-62365998
TEL: 1-408-9436666
FAX: 1-408-5441798
http://www.winbond.com.tw/
Taipei Office
Winbond Electronics Corporation Japan
Winbond Electronics (H.K.) Ltd.
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: 81-45-4781881
FAX: 81-45-4781800
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
Publication Release Date:
February 26, 2007, Revision E
- 47 -
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