W55RFS27R1BW_技术文档

W55RFS27R1B Data Sheet

SUPER-REGENERATION RF RECEIVER

Table of Content-

1.

GENERAL DESCRIPTION ......................................................................................................... 2

1.1

1.2

W55RFS27R1B Features............................................................................................... 2

W55RFS27R1B Pad Definition....................................................................................... 3

1.2.1

Pad Description ............................................................................................................3

1.2.2

Mode selection .............................................................................................................4

2.

3.

SYSTEM DESCRIPTION............................................................................................................ 5

2.1

2.2

W55RFS27R1B System Block Diagram......................................................................... 5

W55RFS27R1B Functional Description ......................................................................... 6

ELECTRONIC CHARACTERISTICS.......................................................................................... 7

3.1

3.2

3.3

3.4

W55RFS27R1B Absolute Maximum Ratings ................................................................. 7

W55RFS27R1B DC Characteristics ............................................................................... 8

W55RFS27R1B Ordering Information............................................................................ 9

W55RFS27R1B Package Information............................................................................ 9

3.4.1

W55RFS27R1B Bonding Pad List................................................................................9

3.4.2

W55RFS27R1B Bonding Pad Diagram......................................................................10

4.

5.

DESIGN INFORMATION .......................................................................................................... 11

4.1

W55RFS27R1B Reference Design .............................................................................. 11

4.1.1

W55RFS27R1B Application Circuit ............................................................................11

4.2

W55RFS27R1B Smart-Detector^WBFunction................................................................ 13

4.2.1

4.2.2

4.2.3

Introduction.................................................................................................................13

Using Smart-Detector^WBin Manual-mode...................................................................13

Using Smart-Detector^WBin uC-mode..........................................................................13

4.3

W55RFS27R1B Layout Guide...................................................................................... 14

REVISION HISTORY................................................................................................................ 15

Publication Release Date:June 8, 2005

- 1 -

Revision A2

W55RFS27R1B

1. GENERAL DESCRIPTION

The Winbond W55RFS27R1B is a fully integrated, S-R (Super-regeneration) RF receiver with full-

function baseband command decoder for R/C vehicles, toys, or wireless data communication

applications.

The W55RFS27R1B provides two input modes: uC-mode, for general-purpose, micro-controller

interfaces to the RF transmitter (the decoder is disabled); and manual-mode, for a 6-function,

baseband command decoder and RF receiver that works conveniently with the W55RFS27T1B to

provide a simple remote control capability with low cost and high performance.

The W55RFS27R1B includes the Smart-Detector^WBfunction, which makes the W55RFS27R1B the

most suitable receiver for mass-produced applications. Smart-Detector^WBovercomes the effects of

component deviation and various kinds of environmental problems, such as temperature, moisture, or

object-caused, antenna characteristic changes, to maintain maximum sensitivity.

The Super-Regenerative RF front-end architecture operates at 27 MHz, 35 MHz, 40 MHz, or 49MHz

with a minimum number of external components. In addition, the W55RFS27R1B accommodates a

wide range of operating voltages (2.1 V to 5.5 V) and supports 2- or 3-battery R/C applications.

1.1 W55RFS27R1B Features

•

Operating frequencies: 27 MHz, 35 MHz, 40 MHz, 49 MHz

Smart-Detector^WBfunction overcomes component deviation and environmental problems to

maintain highest sensitivity

•

Wide operating voltage: 2.1 V ~ 5.5 V

S-R (Super-regeneration) demodulation scheme

(uC-mode) Receiving data rates up to 1.25Kbps for 50% duty cycle signals

(manual-mode) R/C-toy baseband control command decoder, supporting 6 functions; Forward,

Backward, Left-turn, Right-turn, and 2 user-defined functions F1 and F2

•

Minimum current consumption

Very low power-down current consumption (uC-mode only)

Minimum number of external components

Dice form available for PCB bonding

Operating temperature: 0°C ~ 70°C

- 2 -

W55RFS27R1B

1.2 W55RFS27R1B Pad Definition

1.2.1 Pad Description

PAD

SYMBOL

I/O

FUNCTIONAL DESCRIPTION

NO.

GND

CMFB

RBIAS

RSAW

VDDA

OSCin

OSCout

GNDA

Reset

1

2

3

Ground Ground return path

O

I

Common-mode feedback capacitor connection

Resistor to adjust internal circuit bias

Resistor to control internal saw generator

Regulated voltage output

4

5

6

7

8

9

10

11

12

O

Power

I

Oscillator tank input

O

Oscillator tank output

Ground Regulator ground return path

I

Reset = 0 resets whole chip, internally pulled high

Mode0

Mode1

TEST

Mode select LSB, please see 1.2.2 for details

Mode select MSB, please see 1.2.2 for details

TEST = 1 for chip testing; must be set to “0” for regular operation.

(manual mode) Decoder F2 output

(uC-mode) $ENB ("0" = power down)*

(manual mode) Decoder F1 output

(uC-mode) Not used; set to “0”*

(manual mode) Decoder Right-turn output

(uC-mode) HOPCLK; set to “0”*

(manual mode) Decoder Left-turn output

(uC-mode) $OAGC2; set to “0” *

F2

F1

R

13

14

15

16

17

18

O/I

L

(manual mode) Decoder Backward output

(uC-mode) $OAGC1; set to “1” *

(manual mode) Decoder Forward output

(uC-mode) $OAGC0; set to “0” *

B

F

RXD

VSPLY

19

20

O/I

Power

Receiver data output

Power input

(* For uC-mode control, please see section 4.2 W55RFS27R1B Smart-Detector^WBFunction)

Publication Release Date:June 8, 2005

Revision A3

- 3 -

W55RFS27R1B

1.2.2 Mode selection

(MODE1,MODE0)

FUNCTION DESCRIPTION

NOTE

(0,0)

Disable Smart-Detector^WBFunction

uC-mode,

Function evaluation only

Smart-Detector^WBfunction is externally-

Baseband decoder is disabled

Function evaluation only

(0,1)

controlled

Manual-mode,

Enable half of Smart-Detector^WBfunction

OAGC OFF , HOPPING ON

Manual-mode,

(1,0)

(1,1)

Enable Smart-Detector^WBfunction

Suitable for mass-production

OAGC ON, HOPPING ON

- 4 -

W55RFS27R1B

2. SYSTEM DESCRIPTION

2.1 W55RFS27R1B System Block Diagram

Ring osc

Amp.&

Rectifier

S.C. Filter

OSCin

Oscillator

OSCout

Power

Regulator

RSAW

Data Slicer

Saw Generator

RXD

MODE0

MODE1

Baseband

Decoder

Power-On Reset

F

B

L

R

F1

F2

RESET

Publication Release Date:June 8, 2005

Revision A3

- 5 -

W55RFS27R1B

2.2 W55RFS27R1B Functional Description

Power Regulator

The W55RFS27R1B built-in power regulator provides stable operating performance for operating

voltages from 2.1 to 5.5 V, a very wide range of voltages suitable for 2- or 3-battery R/C toys or R/C

vehicles.

RF Receiver

The W55RFS27R1B has been implemented using a "Super-Regenerative" receiving architecture. The

resulting high noise immunity is suitable for getting higher RF receiving performance in very noisy

environments. In addition, the Smart-Detector^WBfunction overcomes component deviation and

various environmental problems to provide the highest receiver sensitivity, making it quite suitable for

mass-produced applications.

Baseband Control Function Decoder

The W55RFS27R1B has a built-in, 6-function baseband control function decoder for R/C toys. The six

functions include Forward; Backward; Left-turn; Right-turn, and two user-defined functions F1 and F2.

- 6 -

W55RFS27R1B

3. ELECTRONIC CHARACTERISTICS

3.1 W55RFS27R1B Absolute Maximum Ratings

PARAMETER

RATING

UNIT

Supply Voltage to Ground Potential

Applied Input/Output Voltage

Power Dissipation (T_a= 70°C)

Ambient Operating Temperature

Storage Temperature

- 0.3 to 6.5

150

V

mW

°C

0 to 70

-40 to 85

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability

of the device.

Publication Release Date:June 8, 2005

- 7 -

Revision A3

W55RFS27R1B

3.2 W55RFS27R1B DC Characteristics

(VDD-VSS = 3 V, Ta = 25°C; unless otherwise specified)

PARAMETER

Power Supply

SYM.

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Operating Voltage

Operating Current

Stand-by Current

V_DD

I_OP

2.1

-

5.5

2.8

2

V

mA

µA

V

I_SBY

V_DDA

$ENB= 0

-

Regulated Voltage

Digital Input/Output Pin

1.65

1.8

2.1

0.8*V_D

Input High Voltage

V_IH

V_IL

I_OH

-

V_DD

0.1*V_DD

-

V

D

Input Low Voltage

F,B,L,R,F1,F2 Output High

Source Current

F,B,L,R,F1,F2 Output Low

Sink Current

RXD Output High Source

Current

V_SS

6

VOH=0.7 * V_DD

VOL=0.3 * V_DD

VOH=0.7 * V_DD

VOL=0.3 * V_DD

mA

I_OL

I_OH

I_OL

6

2

-

mA

RXD Output Low Sink

Current

Crystal Oscillator

Operation Frequency

On-chip Ring Oscillator

frequency

F_C

27

-

49.8

250

MHz

KHz

T_OSC

170

200

Baseband Decoder Section

Modulation Duty Cycle

M_DYT

R_DTT

40

-

50

60

-

%

50% Duty-cycle

Received Data Rate

1.25

Kbps

Manchester Code

- 8 -

W55RFS27R1B

3.3 W55RFS27R1B Ordering Information

The W55RFS27R1B is available in two types: Dice form and Wafer form.

PART NUMBER

PACKAGE

REMARKS

W55RFS27R1B(H)

W55RFS27R1B(W)

Dice form

Wafer form

3.4 W55RFS27R1B Package Information

3.4.1 W55RFS27R1B Bonding Pad List

---------------------------------------------------------------------------

Window : (xl = -929.000, yl = -625.000),

(xh = 929.000, yh = 625.000)

Windows size : Width = 1858.000, length = 1250.000

===========================================================================

PAD NO

PAD NAME

PIN NAME

X

Y

---------------------------------------------------------------------------

1

2

3

4

5

6

7

8

* GND

CMFB

RBIAS

RSAW

VDDA

OSCin

OSCout

GNDA

reset

MODE0

MODE1

TEST

F2

* 1

2

-13.000

-365.950

-472.950

-579.950

-689.350

-801.150

-795.075

-667.875

-555.150

-128.675

-21.675

85.325

192.325

302.925

790.325

675.875

561.425

446.975

332.525

218.075

98.400

540.000

-540.000

540.000

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

9

10

11

12

13

14

15

16

17

18

19

20

21

F1

R

L

B

F

RXD

VSPLY

(*: Bonding Sequence start from GND(Pin1))

Publication Release Date:June 8, 2005

Revision A3

- 9 -

W55RFS27R1B

3.4.2 W55RFS27R1B Bonding Pad Diagram

6

5

4

3

2

1

2

0

1

9

1

8

1

7

1

6

1

5

1

LOGO

W55RFS27R1B

1

0

1

2

1

3

1

4

7

8

9

- 10 -

W55RFS27R1B

4. DESIGN INFORMATION

4.1 W55RFS27R1B Reference Design

4.1.1 W55RFS27R1B Application Circuit

VDD

16K(1%)

R3

C7

+

10u

R2(1%)

C4

100nF

JP2

1

2

3

4

5

6

ANT1

U1

W55RFS27R1B

Output

C1

L0

VDDA

+

C6

C5

VDD

JP3

JP4

47n

10u

C2

C3

1

2

3

1

2

3

MODE0SEL

MODE1SEL

27MHz: C1=15pF, C2=27pF, C3=27pF, L0=1.5uH, R2=36K

35MHz: C1=10pF, C2=24pF, C3=24pF, L0=1.2uH, R2=39K

40MHz: C1= 7pF, C2=16pF, C3=18pF, L0=.82uH, R2=51K

49MHz: C1= 4pF, C2=16pF, C3=18pF, L0=.82uH, R2=47K

Size

A

Rev

A1

^{Document N}W^um5^b5^erRFS27R1B Application Circuit

Date:

Wednesday, May 19, 2004

Sheet

1

of

1

(* Note: The component values are suitable for a 15-cm antenna. Different antenna might change RSAW (R2).)

Publication Release Date:June 8, 2005

Revision A3

- 11 -

W55RFS27R1B

W55RFS27R1B Application Schematic BOM:

Item Qty Reference

________________________________________________________________________________

Part

1

2

3

4

5

6

7

8

1

2

1

ANT1

C1

C2

C3

C4

C7,C5

C6

JP2

JP3

JP4

L0

ANTENNA

4pF

16P

18P

100nF

10u

47n

Output

MODE0SEL

MODE1SEL

0.82u

47K(1%)

16K(1%)

W55RFS27R1B

9

10

11

12

13

14

R2

R3

U1

- 12 -

W55RFS27R1B

4.2 W55RFS27R1B Smart-Detector^WBFunction

4.2.1 Introduction

maintaining the highest sensitivity in different

environments.

The Smart-Detector^WBfunction is designed to

overcome the effects of component deviation

and environmental changes. It enables the on-

chip OAGC (Oscillator Auto-Gain-Control) and

hopping clock functions, dynamically searching

for the best operating conditions and

In manual-mode, the control mechanism is

built in while, in uC-mode, the OAGC and

hopping functions are fixed or controlled by the

external

MCU.

4.2.2 Using Smart-Detector^WBin Manual-mode

a). Set [MODE1:MODE0] to [00] to disable Smart-Detector^WB. Then, select RSAW to provide the

highest sensitivity. Note the default values for OAGC and HOPCLK are OAGC[2:0] = {0,1,0} and

HOPCLK = 0.

b). Set [MODE1:MODE0] to [11] to enable Smart-Detector^WB. Then, OAGC[2:0] change according to

the following sequence, and HOPCLK toggles once (“0” => “1” or “1” => “0”) every T seconds.

start

(1,0,0)

T

(1,0,0)

(0,0,1)

(0,1,1)

(0,1,0)

T

(0,0,0)

( T ~= 20ms)

c). When a data packet is received, the W55RFS27R1B holds the current OAGC and HOPCLK

settings for around 50ms. When there is no more data input, OAGC and HOPCLK resume sequencing

and toggling.

4.2.3 Using Smart-Detector^WBin uC-mode

In uC-mode, OAGC[2:0] and HOPCLK are externally controlled. They can be fixed at specific values

or changed to follow the sequence described in manual-mode. Winbond recommends using fixed

settings in uC-mode because it can be difficult for the MCU to control these pins.

When OAGC and HOPCLK are fixed, the corresponding pins should be set to OAGC[2:0] = (0,1,0)

and HOPCLK = 0. Component deviation should be controlled tightly for consistent results in mass-

produced applications.

Publication Release Date:June 8, 2005

- 13 -

Revision A3

W55RFS27R1B

When following the sequence above, the switching time T should be based on the data repeat time of

the transmitter. Usually, the switching time is twice the repeat time. For example, if a transmitter sends

data every 10 ms, then the switching time T should be 20 ms.

4.3 W55RFS27R1B Layout Guide

a). Make the antenna signal input path (ANT->C1->L0,C2,C3) as short as possible, and keep it away

from any sources of noise.

b). Place the oscillation tank components (L0,C2,C3) as close to each other as possible and as close

to the OSCin and OSCout pins as possible.

c). Make the oscillator ground return path (GNDA) as short and as wide as possible to GNDA. Keep

this path isolated from noise sources too.

OSCin

Antenna

OSCout

L0

Reduce

Loop

GNDA

Pic.1 Graphic

representation for a),b),c)

d). Separate the oscillation tank ground from the other ground paths, and connect it directly to GNDA.

OSCin

OSCout

Motor Driver & other’s

Ground

Antenna

COB area

Battery

GND

L0

GND

GNDA

Pic.2 Graphic

representation for d)

- 14 -

W55RFS27R1B

5. REVISION HISTORY

VERSION

DATE

PAGE

DESCRIPTION

Preliminary version

Released version A2

A1

A2

A3

2004/5/27

2004/7/15

2005/5/30

-

Revised by Brand and add important notice

Important Notice

Winbond products are not designed, intended, authorized or warranted for use as components

in systems or equipment intended for surgical implantation, atomic energy control instruments,

airplane or spaceship instruments, transportation instruments, traffic signal instruments,

combustion control instruments, or for other applications intended to support or sustain life.

Further more, Winbond products are not intended for applications wherein failure of Winbond

products could result or lead to a situation wherein personal injury, death or severe property

or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Winbond for any damages resulting from such improper

use or sales.

Headquarters

Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

27F, 2299 Yan An W. Rd. Shanghai,

200336 China

2727 North First Street, San Jose,

CA 95134, U.S.A.

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 1-408-9436666

TEL: 86-21-62365999

FAX: 86-21-62365998

TEL: 886-3-5770066

FAX: 1-408-5441798

FAX: 886-3-5665577

http://www.winbond.com.tw/

Taipei Office

Winbond Electronics Corporation Japan

7F Daini-ueno BLDG, 3-7-18

Shinyokohama Kohoku-ku,

Yokohama, 222-0033

Winbond Electronics (H.K.) Ltd.

Unit 9-15, 22F, Millennium City,

No. 378 Kwun Tong Rd.,

Kowloon, Hong Kong

9F, No.480, Rueiguang Rd.,

Neihu Chiu, Taipei, 114,

Taiwan, R.O.C.

TEL: 886-2-8177-7168

FAX: 886-2-8751-3579

TEL: 81-45-4781881

TEL: 852-27513100

FAX: 81-45-4781800

FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.

All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.

Publication Release Date:June 8, 2005

Revision A3

- 15 -


型号：	W55RFS27R1BW
厂家：	WINBOND
描述：	SUPER-REGENERATION RF RECEIVER SUPER -再生RF接收器
文件：	总15页 (文件大小：259K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

W55RFS27R1BW [WINBOND]

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