SCG002B-G [WJCI]
InGaP HBT Gain Block; 的InGaP HBT增益模块
| 型号： | SCG002B-G |
| 厂家： | 
WJ COMMUNICATION. INC. |
| 描述： | InGaP HBT Gain Block |
| 文件： | 总4页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The Communications Edge TM
SCG002
InGaP HBT Gain Block
Product Information
Product Features
Product Description
Functional Diagram
GND
The SCG002 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the SCG002 typically provides 21
dB of gain, +29 dBm Output IP3, and +15.5 dBm P1dB.
• DC – 6 GHz
4
• +15.5 dBm P1dB at 1 GHz
• +29 dBm OIP3 at 1 GHz
• 21 dB Gain at 1 GHz
• 3.8 dB Noise Figure
The SCG002 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is housed in a lead-
free/green/RoHS-compliant SOT-89 SMT package. All
devices are 100% RF and DC tested.
1
2
3
• Available in Lead-free / green
SOT-89 Package Style
RF IN
GND
RF OUT
• Internally matched to 50 Ω
Function
Input
Pin No.
1
3
2, 4
Output/Bias
Ground
Applications
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the SCG002 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and
mobile wireless.
• Mobile Infrastructure
• CATV / FTTX
• W-LAN / ISM
• RFID
• WiMAX / WiBro
Specifications (1)
Typical Performance (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Test Frequency
Gain
Units Min Typ Max
Parameter
Frequency
S21
S11
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
MHz
MHz
dB
DC
6000
500
21.6
-17
900
21
-17
-18
1900
20.5
-15
2140
19.7
-14.5
-21
+14.9
+29
3.8
1000
21
S22
-18
-21
dBm
dBm
MHz
dB
+15.5
+29
2000
20
Output P1dB
Output IP3 (2)
Noise Figure
+15.8 +15.5
+15
+29
3.8
+28
3.8
+29
3.7
19
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
dB
dB
dBm
dBm
dB
14
20
+15
+29
3.8
V
mA
3.5
3.9
4.3
45
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +5 V, Rbias = 24 Ω, 50 Ω system.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Rating
Ordering Information
Operating Case Temperature
Storage Temperature
Device Current
-40 to +85 °C
-55 to +150 °C
150 mA
Part No.
SCG002B-G
Description
InGaP HBT Gain Block
RF Input Power (continuous)
Junction Temperature
+12 dBm
+250 °C
(lead-free/green/RoHS-compliant SOT-89 package)
SCG002B-PCB
700 –2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
Page 1 of 4 April 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
The Communications Edge TM
SCG002
InGaP HBT Gain Block
Product Information
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24 Ω, Icc = 45 mA
Frequency
S21
MHz
dB
100
22
500
21.6
-17
900
21
1900
20.5
-15
2140
19.7
-15
2400
19.2
-15
3500
17.4
-16
5800
14.3
-19
S11
dB
-18
-16
-18
S22
dB
-16.7
-17
-20
-21
-22
-35
-16
Output P1dB
Output IP3
Noise Figure
dBm
dBm
dB
+15.4 +15.6 +15.5
+15
+29
3.8
+15
+29
3.8
+15
+29
3.9
+14.5
+11
+28
3.9
+28
3.8
+29
3.8
1. Test conditions: T = 25 ºC, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24 Ω, Icc = 45 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
S11, S22 vs. Frequency
Vdevs. Icc
120
100
80
60
40
20
0
22
20
18
16
14
12
0
-5
-10
-15
-20
-25
-30
-35
-40
S11
+25C
S22
+25C -40C +85C
0
1
2
3
4
5
6
0.0
1.0
2.0
Vde (V)
3.0
4.0
5.0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (GHz)
OIP3 vs. Frequency
Noise Figure vs. Frequency
P1dB vs. Frequency
32
30
28
26
24
4.5
20
4
3.5
3
18
16
14
12
10
2.5
+25C -40C +85C
+25C -40C +85C
2
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
Typical Device S-Parameters
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-33.66
-25.70
-22.88
-20.95
-21.62
-22.23
-21.00
-20.58
-22.29
-24.96
-38.73
-27.75
-22.85
S11 (ang)
160.38
57.47
73.66
88.39
77.79
25.60
16.65
10.75
4.19
19.24
11.58
-158.73
-167.85
S21 (dB)
22.12
21.92
21.40
20.67
19.85
19.15
18.29
17.55
16.72
15.98
15.29
14.67
14.12
S21 (ang)
177.97
160.79
142.72
126.57
111.46
99.29
86.85
74.67
62.69
51.73
S12 (dB)
-23.51
-23.66
-23.41
-23.49
-23.03
-23.10
-22.58
-22.06
-21.59
-20.86
-20.66
-19.86
-19.66
S12 (ang)
-0.74
0.45
0.69
1.82
2.10
1.10
2.16
0.98
-1.56
-5.93
-8.63
-10.67
-12.11
S22 (dB)
S22 (ang)
-42.92
-25.55
-22.04
-16.66
-14.30
-15.12
-13.92
-12.97
-11.90
-10.64
-9.87
-10.61
-59.74
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-132.34
-164.52
-178.04
-177.70
170.72
153.21
137.74
126.68
121.15
119.72
122.34
41.78
32.60
23.12
-10.03
-10.68
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
Page 2 of 4 April 2006
The Communications Edge TM
SCG002
InGaP HBT Gain Block
Product Information
Recommended Application Circuit
Vcc
Icc = 45 mA
SCG002B-PCB
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
SCG002B
C2
C1
Blocking
Capacitor
Blocking
Capacitor
Recommended Component Values
Recommended Bias Resistor Values
Reference
Designator
L1
Frequency (MHz)
Supply
Voltage
5 V
6 V
8 V
9 V
10 V
12 V
R1 value
Size
50
820 nH
.018 µF
500
220 nH
1000 pF
900
68 nH
100 pF
1900
27 nH
68 pF
2200
22 nH
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
24.4 ohms
46.7 ohms
91 ohms
113 ohms
136 ohms
180 ohms
0805
0805
1210
1210
2010
2010
C1, C2, C4
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
Value / Type
Size
L1
39 nH wirewound inductor
56 pF chip capacitor
0.018 μF chip capacitor
Do Not Place
0603
0603
0603
C1, C2
C3
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V.
1% tolerance resistor is recommended.
A
C4
R4
0805
24Ω 1% tolerance
Specifications and information are subject to change without notice
Page 3 of 4 April 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
The Communications Edge TM
SCG002
InGaP HBT Gain Block
Product Information
SCG002B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“S002G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“S002”
designator
followed
by
an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
Page 4 of 4 April 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
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