885012005059 [WURTH]

WCAP-CSGP Ceramic Capacitors;


型号：	885012005059
厂家：	WURTH ELEKTRONIK GMBH & CO. KG, GERMANY.
描述：	WCAP-CSGP Ceramic Capacitors
文件：	总6页 (文件大小：709K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

A Dimensions: [mm]

B Recommended land pattern: [mm]

D1 Electrical Properties:

Properties

Capacitance

Rated voltage

Test conditions

1±0.2 Vrms, 1 MHz ±10%

Value

6.8

Unit

Tol.

± 0.5 pF

max.

V (DC)

Dissipation factor 1±0.2 Vrms, 1 MHz ±10% DF Q ≥ 400 + 20 C

typ.

Isolation Resistance Apply U for 120 s max. ≥ 10

GΩ

Iso

Precondition for Class II MLCC measurement: Apply a preheat treatment @150±10°C for 1 hour. The measurement

should be applied after 24±2 hrs the part was stored under ambient conditions. There is not any precondition necessary

for Class I MLCC.

C Schematic:

E General information:

General Purpose MLCC

Ceramic Type:

NP0 Class I

Temperature Coeffecient:

Storage Conditions:

Operating Temperature:

Dielectric Strength:

General Test conditions:

FIT according to

± 30 ppm max.

35°C, <45% RH

-55 °C bis +125 °C

5 sec. @250% U ; Charge & Discharge Current < 50mA

25°C, 30-70% RH; if not specified differently

separate documentation

DESCRIPTION

L ± 0.05

1.0

0.5

W ± 0.05

WCAP-CSGP Ceramic Capacitors

H ± 0.05

0.5

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

E +0.05/-0.10

0.25

1.50

0.50

Order.- No.

SIZE

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.

Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before

the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.

D2 Mechanical Properties:

Properties

Definition

0402 & 0603

> 0603

Adhesive Strength of Termination

10 ±1 sec; 5N

10 ±1 sec; 10N

all 3 directions, 2 hours each @ 10 - 55 - 10 Hz,

amplitude 0.75 mm or 10 g

Vibration Resistance

Resistance to Solder Heat

Solder Temperature

Dipping Time

Specific

260°C ±5°C

10 ±1 sec

Refer to Soldering Profile

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

Order.- No.

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

SIZE

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

H Soldering Specifications:

H2: Classification Reflow Profiles

H1: Classification Reflow Profile for SMT components:

Profile Feature

Pb-Free Assembly

Preheat

- Temperature Min (T

)

150°C

200°C

60-120 seconds

smin

- Temperature Max (T

- Time (t ) from (T

)

smax

to T )

smin

smax

Ramp-up rate (T to T )

3°C/ second max.

Liquidous temperature (T )

217°C

60-150 seconds

Time (t ) maintained above T

Peak package body temperature (T )

See Table H3

Time within 5°C of actual peak temperature (t )

20-30 seconds

6°C/ second max.

8 minutes max.

Ramp-down rate (T to T )

Time 25°C to peak temperature

refer to IPC/JEDEC J-STD-020D

H3: Package Classification Reflow Temperature

Package Thickness

Volume mm³

<350

Volume mm³

350 - 2000

Volume mm³

>2000

PB-Free Assembly

< 1.6 mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 - 2.5 mm

≥ 2.5 mm

PB-Free Assembly

refer to IPC/JEDEC J-STD-020D

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

74638 Waldenburg

Germany

Order.- No.

SIZE

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

I Cautions and Warnings:

The following conditions apply to all goods within the product series of WCAP-CSGP

of Würth Elektronik eiSos GmbH & Co. KG:

1. General

•Operating voltage across the terminals including AC and DC peaks and AC or pulse overshooting, Vp-p as well as irregular voltage becau-

se of resonance or switching must be below the rated voltage.

•Due to self-heating the reliability of the capacitor may be reduced, if high frequency AC or pulse is applied.

•Avoid any overload or conditions that are not specified in the capacitors datasheet.

•Consider carefully possible specific changes of electrical characteristics like capacitance over temperature, voltage and time as well as

the specific performance over frequency for the actual use conditions. For detailed information see datasheet.

•The capacitor is engineered, designed and manufactured to be used within the datasheet specified values.

•Do not use the capacitor neither short term nor long term outside the specified values, which are given in the data sheet.

•Do not apply any kind of flexural or compressive force onto soldered or unsoldered component.

•Prevent the capacitor surface from any damage or scratches with sharp edges (e.g. chassis, screwdrivers, pincers)

2. Product specific

The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of

the customer. All technical specifications for standard products do also apply to customer specific products.

Follow all instructions mentioned in the data sheet, especially the following items:

2.4 Design of the P.C. board

•The chip capacitor shall be located to minimize any possible mechanical stress from deflection or board wrap.

•It is recommended to position the chip capacitor in parallel to slits and perforations and as far away from slits, perforations, separation

points, screw holes, frames and edges of the P.C. board to avoid mechanical stress.

•Determine the shape and size of the solder pads to have proper amount of solder on the terminations as the amount of solder at the ter-

minations has a direct effect on the reliability of the capacitor.

2.1 Storage conditions

•These ceramic capacitors must be stored in stable conditions within an ambient temperature between 5°C to 40°C with a relative humi-

dity of <70%.

•Provide individual solder pads for each termination. Solder pads are specified in the datasheet.

•The PCB design (e.g. land pattern design and grounding planes) must be evaluated for each individual circuit to achieve the optimal sol-

dering results.

•The environment in which the capacitors are operated and stored has to have atmospheric characteristics and must be free of dew con-

densation and toxic gases (e.g. chlorine, ammonia, sulfur, hydrogen sulphide and hydrogen sulfate).

•All products shall be used before the end of the period of 12 months based on the product date code, if not, a 100% solderability cannot

be guaranteed.

2.5 Mounting

•The capacitance tolerance as specified within the datasheet is only valid on the date of delivery.

•Avoid any stress from the mounting head to avoid cracks.

•Adjust the bottom dead center of the mounting head not to press on the P.C. board surface.

•The mounting head pressure has to be adjusted to 1 N up to 3 N of static force.

•Provide support from the bottom side of the P.C. board by a support pin for minimizing the impact energy from the mounting head.

•Provide sufficient close up dimension, preventive maintenance and replacement of the centering jaw to avoid a crack when it is worn out.

2.2 Operating climatic conditions

•Do not exceed the lower nor the upper specified temperature under no condition.

•Be aware that the specified capacitance tolerance is only valid at the date delivery and according specified measurement criteria.

•Do not use the capacitors under high humidity, high temperature nor under high or low atmospheric pressure which may affect capacitors

reliability.

2.6 Adhesive

•Surface temperature including self-heating must be kept below the maximum operating temperature.

•The temperature rise of the capacitor´s temperature compared to ambient temperature shall be below 20°C.

•Avoid any water or heavy dust on capacitors surface, which may cause electrical leakage, damage, overheating or corrosion.

Selection of adhesive

•The adhesive should have sufficient coating and viscosity and should harden rapidly.

•The adhesive should be strong enough to hold parts on the board during the mounting and solder process and should have sufficient

strength at high temperatures.

2.3 Operating load conditions

•Do not use the capacitor with any higher than specified voltage.

•The adhesive should have corrosion resistance, excellent insulation characteristics and no emission of toxic gasses nor any effect on the

human body.

•Violation of the technical product specifications such as exceeding the specified voltage will void the warranty.

•Do not use too much adhesive to avoid pollution of the soldering pads.

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

Order.- No.

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

SIZE

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

I Cautions and Warnings (2):

The following conditions apply to all goods within the product series of WCAP-CSGP

of Würth Elektronik eiSos GmbH & Co. KG:

2.7 Soldering

•The detailed soldering instructions for reflow and wave soldering are given within Soldering Specification in the datasheet.

•The soldering profile has to be compliant with the technical soldering specification, otherwise this will void the warranty.

•Avoid any other than specified temperature and / or time conditions during soldering.

•Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a sufficient

solder result according to the relevant criteria of IPC-A-610.

2.8 Cleaning

•Cleaning agents that are used to clean the customer application might damage or change the characteristics of the component, body,

pins or termination.

•Avoid Halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.

•Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the capacitor due

to defective contacts.

2.9 Coating, molding and potting of the P.C. board

•When coating and molding the P.C. board verify the quality influence on the capacitor.

•Do not use excessive nor insufficient flux.

•Provide enough washing when water-soluble flux is used.

•Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing.

•Do not exceed the maximal temperature rise of 20°C.

•Consider the preheating conditions as follows to avoid thermal shock:

•If the product is potted in customer applications, the potting material might shrink during and after hardening. The product is exposed to

the pressure of the potting material with the effect that the body and termination is possibly damaged and so the electrical as well as the

mechanical characteristics are endangered to be affected. After the potting material is cured, the body and termination of the product ha-

ve to be checked if any reduced electrical or mechanical functions or destructions have occurred.

Soldering

Size

Temperature difference (ΔT)

ΔT ≤ 150°C

Wave soldering

0603, 0805

Reflow soldering 1206 or less

ΔT ≤ 190°C

Reflow soldering 1210 or more ΔT ≤ 130°C

Manual soldering 1206 or less ΔT ≤ 190°C

Manual soldering 1210 or more ΔT ≤ 130°C

2.10 Handling after chip is mounted

•Direct mechanical impact to the product shall be prevented.

•After soldering please pay attention not to bend, twist or distort the P.C. board in handling and storage.

•Avoid excessive pressure during the functional check of the P.C. board.

•Avoid bending stress while breaking the P.C. board.

•It is recommended to use air for natural cooling. When dipping the chips into a solvent for cleaning, the temperature difference (∆T) must

be less than 100°C.

•For reflow soldering two times limitation is recommended.

2.11 Handling of loose chip capacitor

•Wave soldering is recommended only for the following case sizes: 0603 and 0805, thickness< 1mm.

•Once dropped do not use the chip capacitor.

•After mounting avoid piling up P.C. boards to avoid hitting the chip capacitor of another board.

•Please ensure for manual soldering (solder iron) not to exceed the general temperature capabilities as specified above.

•The following conditions are recommended for solder repair by solder iron:

Size

1206 or less 330 ± 20°C >150°C

1210 or more 280°C max >150°C

Temp. (°C)

Preheating Temp. (°C) Temperature difference (ΔT) Atmosphere

ΔT ≤ 190°C

ΔT ≤ 130°C

Room air

•Typical time of actual peak temperature: <5 sec (300°C), <3 sec (350°C); as short as possible

•Do not make direct contact with the ceramic dielectric.

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

Order.- No.

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

SIZE

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

J Important Notes:

The following conditions apply to all goods within the product range of

Würth Elektronik eiSos GmbH & Co. KG:

1. General Customer Responsibility

Some goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain

application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-

as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-

lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to

the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described

in the product specification is valid and suitable for the respective customer application or not.

6. Product Life Cycle

Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-

dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about

inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available.

Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-

pectancy before or when the product for application design-in disposal is considered.

2. Customer Responsibility related to Specific, in particular Safety-Relevant Applications

It has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-

The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.

not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.

7. Property Rights

In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure

of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of

the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.

All the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as

well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth

Elektronik eiSos GmbH & Co. KG.

Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at

www.we-online.com.

Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any pa-

tent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth

Elektronik eiSos GmbH & Co. KG components or services are used.

3. Best Care and Attention

Any product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.

8. General Terms and Conditions

Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth

4. Customer Support for Product Specifications

Elektronik eiSos Group”, last version available at www.we-online.com.

Some products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-

cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in

charge should be contacted who will be happy to support in this matter.

5. Product R&D

Due to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product

Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the

PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-

on 1 and 2 remains unaffected.

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

Order.- No.

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

SIZE

885012005006

Size: 0402

1.0

2014-11-10

DATE

SSt

PSL

REV

CHECKED

885012005059 [WURTH]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E