5962-8863402XC [XICOR]
EEPROM, 32KX8, 120ns, Parallel, CMOS, CDIP28;
| 型号： | 5962-8863402XC |
| 厂家： | 
XICOR INC. |
| 描述： | EEPROM, 32KX8, 120ns, Parallel, CMOS, CDIP28 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 CD |
| 文件： | 总21页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
90-01-26
APPROVED
M. A. Frye
Added case outline letter U to the drawing. Removed ESDS
requirements from drawing. Editorial changes throughout.
B
C
Changes in accordance with NOR 5962-R117-92
92-01-27
92-12-18
M. A. Frye
M.A. Frye
Redrawn with changes. Add device type 05. Add software data
protect. Added vendor CAGE 60395 and 61394 as approved sources.
Editorial changes throughout.
D
E
Changes in accordance with NOR 5962-R216-93
M.A. Frye
93-08-20
00-08-07
Updated boilerplate. Removed data retention and endurance tests
from drawing. Removed programming specifics from drawing. - glg
Raymond Monnin
F
Boilerplate update and part of five year review. tcr
07-03-29
Robert M. Heber
REV
SHEET
REV
F
F
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F
SHEET
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18
19
REV STATUS
OF SHEETS
REV
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
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PREPARED BY
Kenneth Rice
PMIC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Ray Monnin
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
32K x 8 EEPROM, MONOLITHIC SILICON
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
89-02-13
AMSC N/A
REVISION LEVEL
F
SIZE
A
CAGE CODE
5962-88634
67264
SHEET
1 OF 19
DSCC FORM 2233
APR 97
5962-E270-07
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-88634
01
U
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device
type
Generic
number
Circuit
function
Access Write
time speed Write mode End of write indicator
Endurance
01
02
03
04
05
See 6.6
See 6.6
See 6.6
See 6.6
See 6.6
32K x 8 EEPROM 120 ns 10 ms
32K x 8 EEPROM 120 ns 3 ms
32K x 8 EEPROM 90 ns 10 ms
byte/page
byte/page
byte/page
byte/page
byte/page
DATA polling/toggle bit 10,000 cycles
DATA polling/toggle bit 10,000 cycles
DATA polling/toggle bit 10,000 cycles
DATA polling/toggle bit 10,000 cycles
DATA polling/toggle bit 10,000 cycles
32K x 8 EEPROM 90 ns
3 ms
32K x 8 EEPROM 70 ns 10 ms
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
U
X
Y
Z
See figure 1
GDIP1-T28 or CDIP2-T28
CQCC1-N32
28
28
32
28
Pin grid array
Dual-in-line
Rectangular leadless chip carrier
Flat pack
CDFP4-F28
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ........................................................-0.3 V dc to +6.25 V dc
Storage temperature range........................................................-65°C to +150°C
Maximum power dissipation (PD) ...............................................1.0 W
Lead temperature (soldering, 10 seconds).................................+300°C
Junction temperature (TJ) 2/......................................................+175°C
Thermal resistance, junction-to-case (θJC).................................See MIL-STD-1835
Input voltage range (VIL, VIH)......................................................-0.3 V dc to +6.25 V dc
Data retention ............................................................................20 years (minimum)
Endurance..................................................................................10,000 cycles (minimum)
Chip clear voltage (Vh) ...............................................................13.0 V dc
1.4 Recommended operating conditions. 1/
Supply voltage range (VCC) ........................................................+4.5 V dc to +5.5 V dc
Case operating temperature range (TC).....................................-55°C to +125°C
Input voltage, low range (VIL) .....................................................-0.1 V dc to +0.8 V dc
Input voltage, high range (VIH) ...................................................+2.0 V dc to VCC + 0.3 V dc
1/ All voltages are referenced to VSS (ground).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
2
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.2 Truth table(s). The truth table(s) for unprogrammed devices shall be as specified on figure 3.
3.2.2.1 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.2.3 Case outlines. The case outlines shall be in accordance with figure 1 and 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
3
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
mA
Test
Symbol
V
SS = 0 V, 4.5 V < VCC < 5.5 V,
unless otherwise specified 1/
Min
Max
Supply current
ICC1
1, 2, 3
1, 2, 3
1, 2, 3
All
80
CE = OE = VIL, WE = VIH,
all I/O's = 0.0 mA,
(operating)
inputs = VCC = 5.5 V,
t
AVAV = tAVAV(min)
Supply current
(TTL standby)
ICC2
01, 02
3
mA
CE = VIH, OE = VIL,
all I/O's = 0.0 mA,
inputs = VCC - 0.3 V,
f = 0.0 MHz
03, 04,
05
60
Supply current
ICC3
01, 02
350
60
µA
CE = VCC - 0.3 V,
(CMOS standby)
all I/O's = 0.0 mA,
inputs = VIL or VCC - 0.3 V,
f = 0.0 MHz
03, 04,
05
mA
Input leakage (high)
Input leakage (low)
Output leakage (high)
IIH
VIN = 5.5 V
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
10
10
µA
µA
µA
IIL
VIN = 0.1 V
-10
IOHZ
VOUT = 5.5 V, CE = VIH 2/
VOUT = 0.1 V, CE = VIH 2/
Output leakage (low)
IOLZ
1, 2, 3
All
-10
µA
Input voltage low
Input voltage high
Output voltage low
VIL
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
-0.1
0.8
V
V
V
VIH
VOL
2.0 VCC
+0.3 V
0.45
IOL = 6.0 mA, VIH = 2.0 V,
VCC = 4.5 V, VIL = 0.8 V
Output voltage high
VOH
IOH = -4.0 mA, VIH = 2.0 V,
VCC = 4.5 V, VIL = 0.8 V
1, 2, 3
All
2.4
V
See footnotes at end of table.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TC ≤ +125°C
SS = 0 V, 4.5 V < VCC < 5.5 V,
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
V
unless otherwise specified 1/
Min
-10
Max
IOE
VH = 13 V
1, 2, 3
All
100
µA
OE high leakage
(chip erase)
Input capacitance
Output capacitance
Read cycle time
CI
VI = 0 V, VCC = 5.0 V,
TA = +25°C, f = 1 MHz,
see 4.3.1c 3/ 4/
4
All
All
10
10
pF
pF
ns
CO
VO = 0 V, VCC = 5.0 V,
TA = +25°C, f = 1 MHz,
see 4.3.1c 3/ 4/
4
tAVAV
See figure 4 5/
9, 10, 11
01, 02
03, 04
05
120
90
70
Address access time
tAVQV
9, 10, 11
9, 10, 11
01, 02
03, 04
05
120
90
ns
ns
70
Chip enable
access time
tELQV
01, 02
03, 04
05
120
90
70
Output enable access
tOLQV
9, 10, 11
9, 10, 11
01, 02
50
ns
ns
03, 04,
05
40
Chip enable to output
in low Z 4/
tELQX
All
10
See footnotes at end of table.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
ns
Test
Symbol
V
SS = 0 V, 4.5 V < VCC < 5.5 V,
unless otherwise specified 1/
Min
10
Max
Chip disable to output
in high Z 4/
tEHQZ
See figure 4 5/
9, 10, 11
01, 02
50
03, 04,
05
40
Output enable to
output in low Z 4/
tOLQX
9, 10, 11
9, 10, 11
All
ns
ns
Output disable to
output in high Z 4/
tOHQX
01, 02
50
40
03, 04,
05
Output hold from
address change
tAXQX
9, 10, 11
9, 10, 11
All
0
ns
Write cycle time
tWHWL1
01, 03,
05
10
3
ms
tEHEL1
tAVEL
02, 04
All
Address setup time
9, 10, 11
20
ns
tAVWL
Address hold time
Write setup time
Write hold time
tELAX
tWLAX
tWLEL
tELWL
tEHWH
tWHEH
9, 10, 11
9, 10, 11
9, 10, 11
All
All
All
50
0
ns
ns
ns
0
See footnotes at end of table.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TC ≤ +125°C
SS = 0 V, 4.5 V < VCC < 5.5 V,
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
V
unless otherwise specified 1/
Min
0
Max
tOHEL
See figure 4 5/
9, 10, 11
9, 10, 11
9, 10, 11
All
All
All
ns
ns
ns
OE setup time
tOHWL
tEHOL
0
OE hold time
tWHOL
tELEH
150
WE pulse width
Data setup time
Data hold time
tWLWH
tDVEH
9, 10, 11
9, 10, 11
All
All
50
0
ns
ns
tDVWH
tEHDX
tWHDX
Byte load cycle
tWHWL2
9, 10, 11
9, 10, 11
All
All
.20
149
0
µs
Last byte loaded to
data polling 4/
tWHEL
tEHEL
ns
tELWL1
9, 10, 11
All
5
µs
CE setup time
Output setup time
tOVHWL
tWHEH1
9, 10, 11
9, 10, 11
All
All
5
5
µs
µs
CE hold time
OE hold time
tWHOH
9, 10, 11
All
5
µs
See footnotes at end of table.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TC ≤ +125°C
SS = 0 V, 4.5 V < VCC < 5.5 V,
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
V
unless otherwise specified 1/
Min
12
Max
High voltage
VH
See figure 4 5/
9, 10, 11
9, 10, 11
9, 10, 11
All
All
All
13
V
Chip erase
tWLWH2
tWLWH1
210
ms
ms
10
WE pulse width for
chip erase
1/ DC and read mode.
2/ Connect all address inputs and OE to VIH and measure IOLZ and IOHZ with the output under test connected to VOUT
3/ All pins not being tested are to be open.
.
4/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the
limits specified in table I.
5/ Tested by application of specified timing signals and conditions, including:
Equivalent ac test conditions for all device types:
Output load: 1 TTL gate and CL = 100 pF (minimum) or equivalent circuit.
Input rise and fall times < 10 ns.
Timing measurements reference levels:
Inputs 1.0 V and 2.0 V.
Input pulse levels: 0.4 V and 2.4 V.
Outputs 0.8 V and 2.0 V.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
3.10.1 Erasure of EEPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics
specified by the manufacturer.
3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified by the manufacturer and shall be made available upon request.
3.10.3 Verification of erasure or programmability of EEPROMS. When specified, devices shall be verified as either
programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a read of the entire array
to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure,
and shall be removed from the lot or sample.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
8
DSCC FORM 2234
APR 97
Inches
.002
.005
.008
.010
.012
.018
.050
.067
.075
.100
.180
.551
.650
mm
0.05
0.13
0.20
0.25
0.30
0.46
1.27
1.70
1.90
2.54
4.57
14.00
16.51
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are for general information only.
FIGURE 1. Case outline U.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
9
DSCC FORM 2234
APR 97
Device types
Case outlines
01 through 05
X, Z, U
Terminal symbol
Y
Terminal number
1
2
A14
NC
A14
A12
A7
A12
A7
3
4
A6
5
A5
A6
6
A4
A5
7
A3
A4
8
A2
A3
9
A1
A2
10
11
12
13
14
15
16
17
18
A0
A1
I/O0
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
I/O6
A0
NC
I/O0
I/O1
I/O2
VSS
NC
I/O3
19
20
21
22
23
24
25
26
27
I/O7
I/O4
I/O5
I/O6
I/O7
CE
A10
OE
A11
CE
A9
A8
A10
OE
NC
A13
A11
WE
VCC
----
28
29
30
A9
A8
----
A13
31
32
----
----
WE
VCC
FIGURE 2. Terminal connections.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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10
DSCC FORM 2234
APR 97
Device types 01 through 05
Mode
Read
I/O
CE
VIL
OE
VIL
WE
VIH
DOUT
Standby
VIH
VIL
VIL
X
X
X
High Z
X
Chip clear
Byte write
Write inhibit
Write inhibit
VH
VIH
VIL
X
VIL
VIL
X
DIN
High Z/DOUT
High Z/DOUT
X
VIH
VIH = High logic level
VIL = Low logic level
VH = Chip clear high voltage
X = Don't care
High Z = High impedance state
DIN = Data in
DOUT = Data out
FIGURE 3. Truth table for unprogrammed devices.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
Read cycle waveform
FIGURE 4. AC waveforms.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
WE controlled byte write programming waveforms
FIGURE 4. AC waveforms - continued.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
CE controlled byte write programming waveforms
FIGURE 4. AC waveforms - continued.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
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DSCC FORM 2234
APR 97
Page write waveform
FIGURE 4. AC waveforms - continued.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
Chip clear waveform
FIGURE 4. AC waveforms - continued.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with
test data.
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity, along with test data.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition D or F. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Devices shall be burned-in containing a checkerboard pattern or equivalent.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CI and CO measurements) shall be measured for initial qualification and after process or design changes
which may affect capacitance. Sample size is 15 devices, all input and output terminals tested, and no failures.
d. As a minimum, subgroups 7 and 8 shall include verification of the truth table.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
17
DSCC FORM 2234
APR 97
4.3.2 Groups C and D inspections. Groups C and D inspections shall be in accordance with method 5005 of MIL-STD-883
and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. All devices requiring end-point electrical testing shall be programmed with a checkerboard or equivalent alternating bit
pattern.
c. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition D or F. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005
of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables of method 5005 of MIL-STD-
883 and as follows.
4.4.1 Voltage and current. All voltages given are referenced to the microcircuit VSS terminal. Currents given are conventional
current and positive when flowing into the referenced terminal.
4.4.2 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be
made available on request.
4.4.3 Erasing procedure. The erasing procedures shall be as specified by the device manufacturer and shall be made
available on request.
4.4.4 Software data protection. The software data protect procedures shall be as specified by the device manufacturer and
shall be made available on request.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
18
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/ 5/
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
1, 7, 9, or
2, 8A, 10
Final electrical test parameters
(method 5004)
1*, 2, 3, 7*, 8A, 8B, 9, 10, 11
Group A test requirements
(method 5005)
1, 2, 3, 4**, 7, 8A, 8B, 9, 10,
11
Groups C and D end-point
electrical parameters
(method 5005)
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1/ (*) Indicates PDA applies to subgroups 1 and 7.
2/ Any or all subgroups may be combined when using multifunction testers.
3/ Subgroups 7, 8A, and 8B shall consist of writing and reading the data
pattern specified in accordance with the limits of table I,
subgroups 9, 10, and 11.
4/ For all electrical tests, the device shall be programmed to the data
pattern specified.
5/ (**) Indicates that subgroup 4 will only be performed during initial testing
and after design or process changes (see 4.3.1c).
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replacability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.5 Approved sources of supply . Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-
103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-
VA.
SIZE
STANDARD
5962-88634
MICROCIRCUIT DRAWING
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
19
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN
DATE: 07-03-29
Approved sources of supply for SMD 5962-88634 are listed below for immediate acquisition information only and shall be added
to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the
addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been
submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103
and QML-38535. DSCC maintains an online database of all current sources of supply at
http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
Vendor
similar
number
1FN41
PIN 2/
5962-8863401UA
AT28HC256-12UM/883
3/
3/
TM28HC256-120
5962-8863401UC
5962-8863401XA
X28HC256KMB-12
AT28HC256-12DM/883
28HC256
1FN41
34371
3/
X28HC256DMB-12
DM28HC256-120
AT28HC256-12LM/883
X28HC256EMB-12
LM28HC256-120
3/
5962-8863401YA
1FN41
3/
3/
5962-8863401ZA
5962-8863401ZC
5962-8863402UA
5962-8863402XA
5962-8863402YA
5962-8863402ZA
5962-8863403UA
1FN41
3/
AT28HC256-12FM/883
FM28HC256-120
34371
3/
28HC256
X28HC256FMB-12
AT28HC256FL-12UM/883
TM28HC256-120
1FN41
3/
1FN41
3/
AT28HC256FL-12DM/883
DM28HC256-120
AT28HC256FL-12LM/883
LM28HC256-120
1FN41
3/
1FN41
3/
AT28HC256FL-12FM/883
FM28HC256-120
1FN41
3/
AT28HC256-90UM/883
TM28HC256-90
5962-8863403UC
5962-8863403XA
3/
X28HC256KMB-90
AT28HC256-90DM/883
28HC256
1FN41
34371
3/
X28HC256DMB-90
DM28HC256-90
3/
5962-8863403YA
1FN41
3/
AT28HC256-90LM/883
X28HC256EMB-90
LM28HC256-90
3/
1of 2
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
Vendor
similar
number
1FN41
PIN 2/
5962-8863403ZA
AT28HC256-90FM/883
3/
34371
3/
FM28HC256-90
5962-8863403ZC
5962-8863404UA
5962-8863404XA
5962-8863404YA
5962-8863404ZA
5962-8863405UA
5962-8863405XA
5962-8863405YA
5962-8863405ZA
28HC256
X28HC256FMB-90
AT28HC256F-90UM/883
TM28HC256-90
1FN41
3/
1FN41
3/
AT28HC256F-90DM/883
DM28HC256-90
1FN41
3/
AT28HC256F-90LM/883
LM28HC256-90
1FN41
3/
AT28HC256F-90FM/883
FM28HC256-90
1FN41
3/
AT28HC256-70UM/883
TM28HC256-70
1FN41
3/
AT28HC256-70DM/883
DM28HC256-70
1FN41
3/
AT28HC256-70LM/883
LM28HC256-70
1FN41
3/
AT28HC256-70FM/883
FM28HC256-70
1/ The lead finish shown for each PIN representing a hermetic package
is the most readily available from the manufacturer listed for that part.
If the desired lead finish is not listed contact the vendor to determine
its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to
this number may not satisfy the performance requirements of this drawing.
3/ No longer available from an approved source.
Vendor CAGE
number
Vendor name
and address
1FN41
ATMEL Corporation
2325 Orchard Parkway
San Jose, CA 95131 - 1034
34371
Intersil Corporation
1001 Murphy Ranch Road
Milpitas, CA 95035 - 5680
The information contained herein is disseminated for convenience only and
the Government assumes no liability whatsoever for any inaccuracies in this
information bulletin.
2 of 2
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