XA3S50-4VQ100Q [XILINX]

Field Programmable Gate Array, 192 CLBs, 50000 Gates, 125MHz, 1728-Cell, PQFP100, VQFP-100;
XA3S50-4VQ100Q
型号: XA3S50-4VQ100Q
厂家: XILINX, INC    XILINX, INC
描述:

Field Programmable Gate Array, 192 CLBs, 50000 Gates, 125MHz, 1728-Cell, PQFP100, VQFP-100

时钟 栅 可编程逻辑
文件: 总6页 (文件大小:106K)
中文:  中文翻译
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06  
Spartan-3 Automotive XA FPGA  
Family:  
Introduction and Ordering  
Advance Product Specification  
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DS314-1 (v1.1) December 20, 2004  
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622 Mb/s data transfer rate per I/O  
Introduction  
Seventeen single-ended signal standards  
Seven differential signal standards including LVDS  
Termination by Digitally Controlled Impedance  
Signal swing ranging from 1.14V to 3.45V  
Double Data Rate (DDR) support  
The Xilinx Automotive (XA) Spartan™-3 family of Field-Pro-  
grammable Gate Arrays is specifically designed to meet the  
needs of high volume, cost-sensitive automotive consumer  
electronic applications. The four-member family offers den-  
sities ranging from 50,000 to one million system gates, as  
shown in Table 1.  
Logic resources  
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Abundant logic cells with shift register capability  
Wide multiplexers  
Fast look-ahead carry logic  
Dedicated 18 x 18 multipliers  
JTAG logic compatible with IEEE 1149.1/1532  
XA devices are available in both the extended-temperature  
Q-grade (-40°C to +125°C) and industrial I-grade (-40°C to  
+100°C) and are qualified to the industry-recognized  
AEC-Q100 standard.  
The XA Spartan-3 family builds on the success of the earlier  
XA Spartan-IIE family by increasing the amount of logic  
resources, the capacity of internal RAM, the total number of  
I/Os, and the overall level of performance as well as by  
improving clock management functions. Numerous  
enhancements derive from state-of-the-art Virtex™-II tech-  
nology. These Spartan-3 enhancements, combined with  
advanced process technology, deliver more functionality  
and bandwidth per dollar than was previously possible, set-  
ting new standards in the programmable logic industry.  
SelectRAM™ hierarchical memory  
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Up to 432 Kbits of total block RAM  
Up to 120 Kbits of total distributed RAM  
Digital Clock Manager (up to four DCMs)  
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Clock skew elimination  
Frequency synthesis  
Fully supported by Xilinx ISE development system  
Synthesis, mapping, placement and routing  
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MicroBlaze™ processor, CAN, LIN, PCI, and other  
cores  
Because of their exceptionally low cost, Spartan-3 FPGAs  
are ideally suited to a wide range of advanced automotive  
electronics modules and systems ranging from the latest  
driver assistance and infotainment systems to reconfig-  
urable instrument clusters and ECU gateways.  
Pb-free packaging options  
Xilinx and all of our production partners are qualified to  
QS-9000, moving to TS16949 in 2005.  
Please refer to the Spartan-3 complete data sheet  
(DS099) for a full product description, AC and DC  
specifications, and package pinout descriptions.  
The Spartan-3 family is a superior alternative to mask pro-  
grammed ASICs. FPGAs avoid the high initial cost, the  
lengthy development cycles, and the inherent inflexibility of  
conventional ASICs. Also, FPGA programmability permits  
design upgrades in the field with no hardware replacement  
necessary, an impossibility with ASICs.  
Features  
AEC-Q100 device qualification and full PPAP support  
available in both extended temperature Q-grade and  
I-grade.  
Guaranteed to meet full electrical specification up to  
TJ=-40°C to +125°C.  
Revolutionary 90-nanometer process technology  
Very low cost, high-performance logic solution for  
high-volume, automotive applications  
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Three power rails: for core (1.2V), I/Os (1.2V to  
3.0V), and auxiliary purposes (2.5V)  
SelectIO™ signaling  
Up to 333 I/O pins  
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© 2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS314-1 (v1.1) December 20, 2004  
www.xilinx.com  
1
Advance Product Specification  
R
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information  
.
Table 1: Summary of Spartan-3 FPGA Attributes  
CLB Array  
(One CLB = Four Slices)  
Maximum  
Maximum Differential  
System  
Gates  
Logic  
Cells  
Distributed BlockRAM  
Dedicated  
Multipliers  
Device  
XA3S50  
Rows Columns Total CLBs RAM (bits1)  
(bits1)  
DCMs  
User I/O  
I/O Pairs  
50K  
200K  
400K  
1M  
1,728  
4,320  
8,064  
17,280  
16  
24  
32  
48  
12  
20  
28  
40  
192  
480  
12K  
30K  
72K  
4
2
4
4
4
63  
56  
XA3S200  
XA3S400  
XA3S1000  
Notes:  
216K  
288K  
432K  
12  
16  
24  
173  
76  
896  
56K  
173  
76  
1,920  
120K  
333  
149  
1. By convention, one Kb is equivalent to 1,024 bits.  
Architectural Overview  
The Spartan-3 family architecture consists of five funda-  
mental programmable functional elements:  
Multiplier blocks accept two 18-bit binary numbers as  
inputs and calculate the product.  
Digital Clock Manager (DCM) blocks provide  
self-calibrating, fully digital solutions for distributing,  
delaying, multiplying, dividing, and phase shifting clock  
signals.  
Configurable Logic Blocks (CLBs) contain RAM-based  
Look-Up Tables (LUTs) to implement logic and storage  
elements that can be used as flip-flops or latches.  
CLBs can be programmed to perform a wide variety of  
logical functions as well as to store data.  
These elements are organized as shown in Figure 1. A ring  
of IOBs surrounds a regular array of CLBs. The XA3S50  
has a single column of block RAM embedded in the array.  
Those devices ranging from the XA3S200 to the XA3S1000  
have two columns of block RAM. Each column is made up  
of several 18K-bit RAM blocks; each block is associated  
with a dedicated multiplier. The DCMs are positioned at the  
ends of the block RAM columns.  
Input/Output Blocks (IOBs) control the flow of data  
between the I/O pins and the internal logic of the  
device. Each IOB supports bidirectional data flow plus  
3-state operation. Twenty-four different signal  
standards,  
including  
seven  
high-performance  
differential standards, are available as shown in  
Table 2. Double Data-Rate (DDR) registers are  
included. The Digitally Controlled Impedance (DCI)  
feature provides automatic on-chip terminations,  
simplifying board designs.  
The Spartan-3 family features a rich network of traces and  
switches that interconnect all five functional elements,  
transmitting signals among them. Each functional element  
has an associated switch matrix that permits multiple con-  
nections to the routing.  
Block RAM provides data storage in the form of 18-Kbit  
dual-port blocks.  
2
6
www.xilinx.com  
DS314-1 (v1.1) December 20, 2004  
Advance Product Specification  
R
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information  
DS099-1_01_102204  
Notes:  
1. The XA3S50 has only the block RAM column on the far left.  
Figure 1: Spartan-3 Family Architecture  
DS314-1 (v1.1) December 20, 2004  
www.xilinx.com  
3
Advance Product Specification  
R
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information  
which includes the XCF00S PROMs for serial configuration  
and the higher density XCF00P PROMs for parallel or serial  
configuration.  
Configuration  
Spartan-3 FPGAs are programmed by loading configuration  
data into robust static memory cells that collectively control  
all functional elements and routing resources. Before pow-  
ering on the FPGA, configuration data is stored externally in  
a PROM or some other nonvolatile medium either on or off  
the board. After applying power, the configuration data is  
written to the FPGA using any of five different modes: Mas-  
ter Parallel, Slave Parallel, Master Serial, Slave Serial and  
Boundary Scan (JTAG). The Master and Slave Parallel  
modes use an 8-bit wide SelectMAP™ port.  
I/O Capabilities  
The SelectIO feature of Spartan-3 devices supports 17 sin-  
gle-ended standards and seven differential standards as  
listed in Table 2. Many standards support the DCI feature,  
which uses integrated terminations to eliminate unwanted  
signal reflections. Table 3 shows the number of user I/Os as  
well as the number of differential I/O pairs available for each  
device/package combination.  
The recommended memory for storing the configuration  
data is the low-cost Xilinx Platform Flash PROM family,  
Table 2: Signal Standards Supported by the Spartan-3 Family  
Standard  
Category  
V
DCI  
Option  
CCO  
Description  
Gunning Transceiver Logic  
High-Speed Transceiver Logic  
(V)  
N/A  
1.5  
1.8  
Class  
Symbol  
Single-Ended  
GTL  
Terminated  
GTL  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
Plus  
GTLP  
HSTL  
I
III  
HSTL_I  
HSTL_III  
HSTL_I_18  
HSTL_II_18  
HSTL_III_18  
LVCMOS12  
LVCMOS15  
LVCMOS18  
LVCMOS25  
LVCMOS33  
LVTTL  
I
II  
III  
LVCMOS  
Low-Voltage CMOS  
1.2  
1.5  
1.8  
2.5  
3.3  
3.3  
3.0  
1.8  
2.5  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
33 MHz  
N/A  
I
Yes  
Yes  
Yes  
Yes  
No  
LVTTL  
PCI  
Low-Voltage Transistor-Transistor Logic  
Peripheral Component Interconnect  
Stub Series Terminated Logic  
PCI33_3  
No  
SSTL  
SSTL18_I  
SSTL2_I  
Yes  
Yes  
Yes  
II  
SSTL2_II  
Differential  
LDT  
(ULVDS)  
Lightning Data Transport  
(HyperTransport™)  
2.5  
N/A  
LDT_25  
No  
LVDS  
Low-Voltage Differential Signaling  
Standard  
Bus  
LVDS_25  
Yes  
No  
BLVDS_25  
LVDSEXT_25  
LVPECL_25  
Extended Mode  
N/A  
Yes  
No  
LVPECL  
RSDS  
Low-Voltage Positive Emitter-Coupled  
Logic  
2.5  
2.5  
Reduced-Swing Differential Signaling  
N/A  
RSDS_25  
No  
4
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www.xilinx.com  
DS314-1 (v1.1) December 20, 2004  
Advance Product Specification  
R
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information  
Table 3: Spartan-3 XA I/O Chart  
Available User I/Os and Differential (Diff) I/O  
Pairs  
VQG100  
PQG208 FTG256  
FGG456  
Device  
XA3S50  
User Diff User Diff User Diff User Diff  
63  
63  
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29  
29  
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124  
141  
141  
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56  
62  
62  
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XA3S200  
XA3S400  
XA3S1000  
Notes:  
173  
173  
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76  
76  
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333 149  
1. All device options listed in a given package column are  
pin-compatible.  
Ordering Information  
Spartan-3 FPGAs are available in Pb-free packaging options for all device/package combinations. The Pb-free packages  
include a special ’G’ character in the ordering code.  
Pb-Free Packaging  
For additional information on Pb-free packaging, see XAPP427: Xilinx Lead Free Packages.  
Example: XA3S50 -4 PQ G 208 Q  
Device Type  
Speed Grade  
Package Type  
Temperature Range:  
Q = Automotive Extended (T = -40  
˚
C to +125  
˚
C)  
I = Automotive Industrial (TJJ= -40  
˚
C to +100 C)  
˚
Number of Pins  
Pb-free  
DS099-1_02b_100804  
Device  
Speed Grade  
Package Type / Number of Pins  
Temperature Range (TJ)  
XA3S50  
-4 Standard Performance VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)  
I
Automotive Industrial  
(–40°C to +100°C)  
XA3S200  
PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP)  
Q Automotive Extended  
(–40°C to +125°C)  
XA3S400  
FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)  
FG(G)456 456-ball Fine-Pitch Ball Grid Array (FBGA)  
XA3S1000  
Revision History  
Date  
Version No.  
Description  
10/18/04  
12/20/04  
1.0  
1.1  
Initial Xilinx release.  
Multiple text edits throughout.  
DS314-1 (v1.1) December 20, 2004  
www.xilinx.com  
5
Advance Product Specification  
R
Spartan-3 Automotive XA FPGA Family: Introduction and Ordering Information  
The Spartan-3 Family Data Sheet  
DS099-1, Spartan-3 FPGA Family: Introduction and Ordering Information (Module 1)  
DS099-2, Spartan-3 FPGA Family: Functional Description (Module 2)  
DS099-3, Spartan-3 FPGA Family: DC and Switching Characteristics (Module 3)  
DS099-4, Spartan-3 FPGA Family: Pinout Descriptions (Module 4)  
6
6
www.xilinx.com  
DS314-1 (v1.1) December 20, 2004  
Advance Product Specification  

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