XC7A15T-2CSG325C [XILINX]
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| 型号： | XC7A15T-2CSG325C |
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18
7 Series FPGAs Data Sheet: Overview
DS180 (v2.6) February 27, 2018
Product Specification
General Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,
cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
•
•
Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
•
Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
•
Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an
unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Summary of 7 Series FPGA Features
•
•
•
•
Advanced high-performance FPGA logic based on real 6-input look-
up table (LUT) technology configurable as distributed memory.
•
Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
•
•
•
•
•
•
A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
•
Table 1: 7 Series Families Comparison
Max. Capability
Logic Cells
Spartan-7
Artix-7
215K
Kintex-7
478K
Virtex-7
1,955K
102K
Block RAM(1)
4.2 Mb
13 Mb
34 Mb
68 Mb
DSP Slices
160
740
1,920
3,600
DSP Performance(2)
MicroBlaze CPU(3)
Transceivers
176 GMAC/s
929 GMAC/s
303 DMIPs
16
2,845 GMAC/s
438 DMIPs
32
5,335 GMAC/s
441 DMIPs
96
260 DMIPs
–
Transceiver Speed
Serial Bandwidth
PCIe Interface
Memory Interface
I/O Pins
–
6.6 Gb/s
211 Gb/s
x4 Gen2
1,066 Mb/s
500
12.5 Gb/s
800 Gb/s
x8 Gen2
1,866 Mb/s
500
28.05 Gb/s
2,784 Gb/s
x8 Gen3
1,866 Mb/s
1,200
–
–
800 Mb/s
400
I/O Voltage
1.2V–3.3V
1.2V–3.3V
1.2V–3.3V
1.2V–3.3V
Low-Cost, Wire-Bond,
Bare-Die Flip-Chip
Bare-Die Flip-Chip and High-
Performance Flip-Chip
Highest Performance
Flip-Chip
Package Options
Low-Cost, Wire-Bond
Notes:
1.
2.
3.
Additional memory available in the form of distributed RAM.
Peak DSP performance numbers are based on symmetrical filter implementation.
Peak MicroBlaze CPU performance numbers based on microcontroller preset.
© Copyright 2010–2018 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI Express is a trademark of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
1
7 Series FPGAs Data Sheet: Overview
Spartan-7 FPGA Feature Summary
Table 2: Spartan-7 FPGA Feature Summary by Device
(3)
CLB
Block RAM Blocks
Logic
Cells
DSP
XADC
Blocks
Total I/O
Max User
I/O
(4)
Device
Max
Distributed
RAM (Kb)
CMTs
PCIe
GT
(2)
(5)
Slices
Max
(Kb)
Banks
(1)
Slices
18 Kb
36 Kb
XC7S6
6,000
12,800
23,360
52,160
76,800
102,400
938
70
150
313
600
832
1,100
10
20
10
20
5
10
45
75
90
120
180
360
2
2
3
5
8
8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
2
2
3
5
8
8
100
100
150
250
400
400
XC7S15
XC7S25
XC7S50
XC7S75
XC7S100
2,000
3,650
80
90
1,620
2,700
3,240
4,320
8,150
120
140
160
150
180
240
12,000
16,000
Notes:
1.
2.
3.
4.
5.
Each 7 series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.
Each DSP slice contains a pre-adder, a 25 x 18 multiplier, an adder, and an accumulator.
Block RAMs are fundamentally 36 Kb in size; each block can also be used as two independent 18 Kb blocks.
Each CMT contains one MMCM and one PLL.
Does not include configuration Bank 0.
Table 3: Spartan-7 FPGA Device-Package Combinations and Maximum I/Os
Package
Size (mm)
Ball Pitch (mm)
Device
CPGA196
8 x 8
CSGA225
13 x 13
0.8
CSGA324
15 x 15
0.8
FTGB196
15 x 15
1.0
FGGA484
23 x 23
1.0
FGGA676
27 x 27
1.0
0.5
(1)
(1)
(1)
(1)
(1)
(1)
HR I/O
HR I/O
HR I/O
HR I/O
HR I/O
HR I/O
XC7S6
100
100
100
100
150
100
100
100
100
XC7S15
XC7S25
150
210
XC7S50
250
338
338
XC7S75
400
400
XC7S100
Notes:
1.
HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
2
7 Series FPGAs Data Sheet: Overview
Artix-7 FPGA Feature Summary
Table 4: Artix-7 FPGA Feature Summary by Device
Configurable Logic Blocks
(CLBs)
(3)
Block RAM Blocks
XADC
Blocks
Logic
Cells
DSP48E1
Total I/O
Max User
(4)
(5)
Device
CMTs
PCIe
GTPs
(2)
(6)
(7)
Max
Slices
Banks
I/O
Max
(Kb)
(1)
Slices
Distributed
RAM (Kb)
18 Kb
36 Kb
XC7A12T
XC7A15T
XC7A25T
XC7A35T
XC7A50T
XC7A75T
XC7A100T
XC7A200T
Notes:
12,800
16,640
23,360
33,280
52,160
75,520
101,440
215,360
2,000
2,600
3,650
5,200
8,150
11,800
15,850
33,650
171
200
40
45
40
50
20
25
720
900
3
5
1
1
1
1
1
1
1
1
2
4
1
1
1
1
1
1
1
1
3
5
150
250
150
250
250
300
300
500
313
80
90
45
1,620
1,800
2,700
3,780
4,860
13,140
3
4
3
400
90
100
150
210
270
730
50
5
4
5
600
120
180
240
740
75
5
4
5
892
105
135
365
6
8
6
1,188
2,888
6
8
6
10
16
10
1.
2.
3.
4.
5.
6.
7.
Each 7 series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.
Each DSP slice contains a pre-adder, a 25 x 18 multiplier, an adder, and an accumulator.
Block RAMs are fundamentally 36 Kb in size; each block can also be used as two independent 18 Kb blocks.
Each CMT contains one MMCM and one PLL.
Artix-7 FPGA Interface Blocks for PCI Express support up to x4 Gen 2.
Does not include configuration Bank 0.
This number does not include GTP transceivers.
Table 5: Artix-7 FPGA Device-Package Combinations and Maximum I/Os
(1)
(2)
(2)
(3)
(3)
Package
CPG236
10 x 10
CPG238
10 x 10
CSG324
15 x 15
CSG325
15 x 15
FTG256
17 x 17
SBG484
19 x 19
FGG484
FBG484
23 x 23
FGG676
FBG676
27 x 27
FFG1156
35 x 35
Size (mm)
23 x 23
1.0
27 x 27
1.0
Ball Pitch
(mm)
0.5
0.5
I/O
0.8
I/O
0.8
I/O
1.0
0.8
I/O
1.0
1.0
1.0
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GTP
GTP
GTP
GTP
GTP
GTP
GTP
(4)
GTP
GTP
GTP
GTP
Device
(4)
(4)
(4)
(4)
(4)
(4)
(5)
(5)
(5)
(5)
(5)
(5)
(5)
(5)
(5)
(5)
(5)
HR
HR
HR
HR
HR
HR
HR
HR
HR
HR
HR
XC7A12T
XC7A15T
XC7A25T
XC7A35T
XC7A50T
XC7A75T
XC7A100T
XC7A200T
2
112
2
4
4
4
4
150
150
150
150
150
2
106
0
210
0
170
4
250
2
112
2
2
106
106
0
0
0
0
210
210
210
210
0
0
0
0
170
170
170
170
4
4
4
4
250
250
285
285
8
8
300
300
4
285
4
285
8
400
16
500
Notes:
1.
2.
3.
4.
5.
All packages listed are Pb-free (SBG, FBG, FFG with exemption 15). Some packages are available in Pb option.
Devices in FGG484 and FBG484 are footprint compatible.
Devices in FGG676 and FBG676 are footprint compatible.
GTP transceivers in CP, CS, FT, and FG packages support data rates up to 6.25 Gb/s.
HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
3
7 Series FPGAs Data Sheet: Overview
Kintex-7 FPGA Feature Summary
Table 6: Kintex-7 FPGA Feature Summary by Device
Configurable Logic
(3)
Block RAM Blocks
Blocks (CLBs)
Max
Logic
Cells
DSP
XADC
Total I/O
(4)
(5)
Device
CMTs
PCIe
GTXs
User
(2)
(6)
Max
Distributed
RAM (Kb)
Slices
Blocks Banks
(7)
I/O
(1)
Slices
18 Kb
36 Kb
Max (Kb)
XC7K70T
65,600
162,240
326,080
356,160
406,720
416,960
477,760
10,250
25,350
50,950
55,650
63,550
65,150
74,650
838
240
600
270
650
135
325
445
715
795
835
955
4,860
11,700
16,020
25,740
28,620
30,060
34,380
6
8
1
1
1
1
1
1
1
8
1
1
1
1
1
1
1
6
8
300
400
500
300
500
400
400
XC7K160T
XC7K325T
XC7K355T
XC7K410T
XC7K420T
XC7K480T
Notes:
2,188
4,000
5,088
5,663
5,938
6,788
8
840
890
10
6
16
24
16
32
32
10
6
1,440
1,540
1,680
1,920
1,430
1,590
1,670
1,910
10
8
10
8
8
8
1.
2.
3.
4.
5.
6.
7.
Each 7 series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.
Each DSP slice contains a pre-adder, a 25 x 18 multiplier, an adder, and an accumulator.
Block RAMs are fundamentally 36 Kb in size; each block can also be used as two independent 18 Kb blocks.
Each CMT contains one MMCM and one PLL.
Kintex-7 FPGA Interface Blocks for PCI Express support up to x8 Gen 2.
Does not include configuration Bank 0.
This number does not include GTX transceivers.
Table 7: Kintex-7 FPGA Device-Package Combinations and Maximum I/Os
(1)
(2)
(2)
(3)
(3)
Package
FBG484
23 x 23
FBG676
27 x 27
FFG676
FBG900
FFG900
FFG901
31 x 31
FFG1156
Size (mm)
27 x 27
31 x 31
31 x 31
35 x 35
1.0
Ball Pitch
(mm)
1.0
1.0
1.0
1.0
1.0
1.0
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GTX
(4)
GTX
(4)
GTX
(4)
Device
GTX
GTX
GTX
GTX
(5)
(6)
(5)
(6)
(5)
(6)
(5)
(6)
(5)
(6)
(5)
(6)
(5)
(6)
HR
185
185
HP
100
100
HR
200
HP
HR
HP
HR
HP
HR
HP
HR
HP
HR
HP
XC7K70T
4
4
8
8
8
100
150
150
XC7K160T
XC7K325T
XC7K355T
XC7K410T
XC7K420T
XC7K480T
250
250
8
8
250
150
250
150
16
16
350
150
16
16
350
150
150
24
300
0
8
250
150
8
250
150
350
150
350
28
28
380
380
0
0
32
32
400
400
0
0
Notes:
1.
2.
3.
4.
All packages listed are Pb-free (FBG, FFG with exemption 15). Some packages are available in Pb option.
Devices in FBG676 and FFG676 are footprint compatible.
Devices in FBG900 and FFG900 are footprint compatible.
GTX transceivers in FB packages support the following maximum data rates: 10.3Gb/s in FBG484; 6.6Gb/s in FBG676 and FBG900. Refer to Kintex-7 FPGAs Data Sheet:
DC and AC Switching Characteristics (DS182) for details.
5.
6.
HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
HP = High-performance I/O with support for I/O voltage from 1.2V to 1.8V.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
4
7 Series FPGAs Data Sheet: Overview
Virtex-7 FPGA Feature Summary
Table 8: Virtex-7 FPGA Feature Summary
Configurable Logic
Blocks (CLBs)
(4)
Block RAM Blocks
Max
Logic
Cells
DSP
CMTs PCIe
XADC TotalI/O
(1)
(9)
Device
GTX GTH GTZ
User
SLRs
(3)
(5)
(6)
(7)
Max
Slices
Blocks Banks
(8)
Max
(Kb)
I/O
(2)
Slices
Distributed
RAM (Kb)
18 Kb
36 Kb
XC7V585T
582,720
91,050
6,938
21,550
4,388
1,260
2,160
1,120
2,160
2,800
2,880
3,600
3,600
3,360
1,680
2,520
1,590
2,584
1,500
1,760
2,060
2,360
2,940
3,000
3,760
1,880
2,820
795
1,292
750
28,620
46,512
27,000
31,680
37,080
42,480
52,920
54,000
67,680
33,840
50,760
18
24
14
12
14
20
20
18
24
12
18
3
4
2
2
4
2
3
3
4
2
3
36
36
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
17
24
14
12
14
16
20
18
22
12
6
850
1,200
700
N/A
4
XC7V2000T
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
XC7VX980T
1,954,560 305,400
0
326,400
412,160
485,760
554,240
693,120
979,200
51,000
64,400
75,900
86,600
108,300
153,000
28
48
0
0
N/A
N/A
N/A
N/A
N/A
N/A
4
6,525
880
0
0
600
8,175
1,030
1,180
1,470
1,500
1,880
940
56
0
0
700
8,725
80
80
72
96
48
72
0
600
10,888
13,838
17,700
8,850
0
0
1,000
900
0
0
XC7VX1140T 1,139,200 178,000
0
0
1,100
600
XC7VH580T
XC7VH870T
Notes:
580,480
876,160
90,700
0
8
2
136,900
13,275
1,410
0
16
300
3
1.
2.
3.
4.
5.
6.
EasyPath™-7 FPGAs are also available to provide a fast, simple, and risk-free solution for cost reducing Virtex-7 T and Virtex-7 XT FPGA designs
Each 7 series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.
Each DSP slice contains a pre-adder, a 25 x 18 multiplier, an adder, and an accumulator.
Block RAMs are fundamentally 36 Kb in size; each block can also be used as two independent 18 Kb blocks.
Each CMT contains one MMCM and one PLL.
Virtex-7 T FPGA Interface Blocks for PCI Express support up to x8 Gen 2. Virtex-7 XT and Virtex-7 HT Interface Blocks for PCI Express support up to x8 Gen 3, with the
exception of the XC7VX485T device, which supports x8 Gen 2.
7.
8.
9.
Does not include configuration Bank 0.
This number does not include GTX, GTH, or GTZ transceivers.
Super logic regions (SLRs) are the constituent parts of FPGAs that use SSI technology. Virtex-7 HT devices use SSI technology to connect SLRs with 28.05 Gb/s
transceivers.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
5
7 Series FPGAs Data Sheet: Overview
Table 9: Virtex-7 FPGA Device-Package Combinations and Maximum I/Os
(1)
(2)
(2)
Package
FFG1157
35 x 35
1.0
FFG1761
FHG1761
45 x 45
1.0
FLG1925
45 x 45
1.0
Size (mm)
Ball Pitch
42.5 x 42.5
1.0
I/O
I/O
I/O
I/O
Device
GTX GTH
GTX GTH
GTX GTH
GTX
(3)
(4)
(3)
(4)
(3)
(4)
(3)
(4)
HR
HP
600
HR
HP
HR
HP
HR
HP
XC7V585T
20
0
0
36
0
0
28
0
100
750
650
700
850
XC7V2000T
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
XC7VX980T
36
0
0
850
16
0
1,200
0
0
20
20
0
0
0
0
600
600
600
50
0
20
28
0
0
20
0
600
36
0
XC7VX1140T
Notes:
1.
2.
3.
4.
All packages listed are Pb-free (FFG, FHG, FLG with exemption 15). Some packages are available in Pb option.
Devices in FFG1761 and FHG1761 are footprint compatible.
HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
HP = High-performance I/O with support for I/O voltage from 1.2V to 1.8V.
Table 10: Virtex-7 FPGA Device-Package Combinations and Maximum I/Os - Continued
(1)
(2)
(2)
(3)
(3)
(4)
(4)
Package
FFG1158
35 x 35
1.0
FFG1926
45 x 45
1.0
FLG1926
FFG1927
45 x 45
1.0
FFG1928
45 x 45
1.0
FLG1928
FFG1930
45 x 45
1.0
FLG1930
Size (mm)
Ball Pitch
45 x 45
1.0
45 x 45
1.0
45 x 45
1.0
I/O
I/O
HP
I/O
I/O
I/O
HP
I/O
I/O
I/O
Device
GTX GTH
GTX GTH
GTX GTH
GTX GTH
GTX GTH
GTX GTH
GTX GTH
GTX GTH
HP
(5)
HP
(5)
HP
(5)
HP
(5)
HP
(5)
HP
(5)
(5)
(5)
XC7V585T
XC7V2000T
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
XC7VX980T
0
48
0
48 350
350
0
56
0
48 600
600
0
0
24
0
700
48 350
48 350
80 600
80 600
0
0
0
64 720
64 720
0
0
0
24 1,000
24 900
0
72 480
XC7VX1140T
0
64 720
0
96 480
0
24 1,100
Notes:
1.
2.
3.
4.
5.
All packages listed are Pb-free (FFG, FLG with exemption 15). Some packages are available in Pb option.
Devices in FFG1926 and FLG1926 are footprint compatible.
Devices in FFG1928 and FLG1928 are footprint compatible.
Devices in FFG1930 and FLG1930 are footprint compatible.
HP = High-performance I/O with support for I/O voltage from 1.2V to 1.8V.
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7 Series FPGAs Data Sheet: Overview
Table 11: Virtex-7 HT FPGA Device-Package Combinations and Maximum I/Os
(1)
Package
FLG1155
35 x 35
1.0
FLG1931
45 x 45
1.0
FLG1932
45 x 45
1.0
Size (mm)
Ball Pitch
I/O
I/O
I/O
Device
GTH
GTZ
GTH
GTZ
GTH
GTZ
(2)
(2)
(2)
HP
400
HP
600
HP
XC7VH580T
24
8
48
8
XC7VH870T
72
16
300
Notes:
1.
2.
All packages listed are Pb-free with exemption 15. Some packages are available in Pb option.
HP = High-performance I/O with support for I/O voltage from 1.2V to 1.8V.
Stacked Silicon Interconnect (SSI) Technology
There are many challenges associated with creating high capacity FPGAs that Xilinx addresses with the SSI technology.
SSI technology enables multiple super logic regions (SLRs) to be combined on a passive interposer layer, using proven
manufacturing and assembly techniques from industry leaders, to create a single FPGA with more than ten thousand inter-
SLR connections, providing ultra-high bandwidth connectivity with low latency and low power consumption. There are two
types of SLRs used in Virtex-7 FPGAs: a logic intensive SLR used in the Virtex-7 T devices and a DSP/block
RAM/transceiver-rich SLR used in the Virtex-7 XT and HT devices. SSI technology enables the production of higher
capability FPGAs than traditional manufacturing methods, enabling the highest capacity and highest performance FPGAs
ever created to reach production more quickly and with less risk than would otherwise be possible. Thousands of super long
line (SLL) routing resources and ultra-high performance clock lines that cross between the SLRs ensure that designs span
seamlessly across these high-density programmable logic devices.
CLBs, Slices, and LUTs
Some key features of the CLB architecture include:
•
•
•
Real 6-input look-up tables (LUTs)
Memory capability within the LUT
Register and shift register functionality
The LUTs in 7 series FPGAs can be configured as either one 6-input LUT (64-bit ROMs) with one output, or as two 5-input
LUTs (32-bit ROMs) with separate outputs but common addresses or logic inputs. Each LUT output can optionally be
registered in a flip-flop. Four such LUTs and their eight flip-flops as well as multiplexers and arithmetic carry logic form a
slice, and two slices form a configurable logic block (CLB). Four of the eight flip-flops per slice (one per LUT) can optionally
be configured as latches.
Between 25–50% of all slices can also use their LUTs as distributed 64-bit RAM or as 32-bit shift registers (SRL32) or as two
SRL16s. Modern synthesis tools take advantage of these highly efficient logic, arithmetic, and memory features.
Clock Management
Some of the key highlights of the clock management architecture include:
•
•
•
High-speed buffers and routing for low-skew clock distribution
Frequency synthesis and phase shifting
Low-jitter clock generation and jitter filtering
Each 7 series FPGA has up to 24 clock management tiles (CMTs), each consisting of one mixed-mode clock manager
(MMCM) and one phase-locked loop (PLL).
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Mixed-Mode Clock Manager and Phase-Locked Loop
The MMCM and PLL share many characteristics. Both can serve as a frequency synthesizer for a wide range of frequencies
and as a jitter filter for incoming clocks. At the center of both components is a voltage-controlled oscillator (VCO), which
speeds up and slows down depending on the input voltage it receives from the phase frequency detector (PFD).
There are three sets of programmable frequency dividers: D, M, and O. The pre-divider D (programmable by configuration
and afterwards via DRP) reduces the input frequency and feeds one input of the traditional PLL phase/frequency
comparator. The feedback divider M (programmable by configuration and afterwards via DRP) acts as a multiplier because
it divides the VCO output frequency before feeding the other input of the phase comparator. D and M must be chosen
appropriately to keep the VCO within its specified frequency range. The VCO has eight equally-spaced output phases
(0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°). Each can be selected to drive one of the output dividers (six for the PLL,
O0 to O5, and seven for the MMCM, O0 to O6), each programmable by configuration to divide by any integer from 1 to 128.
The MMCM and PLL have three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode. Low-bandwidth
mode has the best jitter attenuation but not the smallest phase offset. High-bandwidth mode has the best phase offset, but
not the best jitter attenuation. Optimized mode allows the tools to find the best setting.
MMCM Additional Programmable Features
The MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one output path. Fractional
1
counters allow non-integer increments of /8 and can thus increase frequency synthesis capabilities by a factor of 8.
The MMCM can also provide fixed or dynamic phase shift in small increments that depend on the VCO frequency. At
1600 MHz, the phase-shift timing increment is 11.2 ps.
Clock Distribution
Each 7 series FPGA provides six different types of clock lines (BUFG, BUFR, BUFIO, BUFH, BUFMR, and the high-
performance clock) to address the different clocking requirements of high fanout, short propagation delay, and extremely low
skew.
Global Clock Lines
In each 7 series FPGA (except XC7S6 and XC7S15), 32 global clock lines have the highest fanout and can reach every flip-
flop clock, clock enable, and set/reset, as well as many logic inputs. There are 12 global clock lines within any clock region
driven by the horizontal clock buffers (BUFH). Each BUFH can be independently enabled/disabled, allowing for clocks to be
turned off within a region, thereby offering fine-grain control over which clock regions consume power. Global clock lines can
be driven by global clock buffers, which can also perform glitchless clock multiplexing and clock enable functions. Global
clocks are often driven from the CMT, which can completely eliminate the basic clock distribution delay.
Regional Clocks
Regional clocks can drive all clock destinations in their region. A region is defined as an area that is 50 I/O and 50 CLB high
and half the chip wide. 7 series FPGAs have between two and twenty-four regions. There are four regional clock tracks in
every region. Each regional clock buffer can be driven from any of four clock-capable input pins, and its frequency can
optionally be divided by any integer from 1 to 8.
I/O Clocks
I/O clocks are especially fast and serve only I/O logic and serializer/deserializer (SerDes) circuits, as described in the
I/O Logic section. The 7 series devices have a direct connection from the MMCM to the I/O for low-jitter, high-performance
interfaces.
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Block RAM
Some of the key features of the block RAM include:
•
•
•
Dual-port 36 Kb block RAM with port widths of up to 72
Programmable FIFO logic
Built-in optional error correction circuitry
Every 7 series FPGA has between 5 and 1,880 dual-port block RAMs, each storing 36 Kb. Each block RAM has two
completely independent ports that share nothing but the stored data.
Synchronous Operation
Each memory access, read or write, is controlled by the clock. All inputs, data, address, clock enables, and write enables are
registered. Nothing happens without a clock. The input address is always clocked, retaining data until the next operation. An
optional output data pipeline register allows higher clock rates at the cost of an extra cycle of latency.
During a write operation, the data output can reflect either the previously stored data, the newly written data, or can remain
unchanged.
Programmable Data Width
Each port can be configured as 32K × 1, 16K × 2, 8K × 4, 4K × 9 (or 8), 2K × 18 (or 16), 1K × 36 (or 32), or 512 × 72 (or 64).
The two ports can have different aspect ratios without any constraints.
Each block RAM can be divided into two completely independent 18 Kb block RAMs that can each be configured to any
aspect ratio from 16K × 1 to 512 × 36. Everything described previously for the full 36 Kb block RAM also applies to each of
the smaller 18 Kb block RAMs.
Only in simple dual-port (SDP) mode can data widths of greater than 18 bits (18 Kb RAM) or 36 bits (36 Kb RAM) be
accessed. In this mode, one port is dedicated to read operation, the other to write operation. In SDP mode, one side (read
or write) can be variable, while the other is fixed to 32/36 or 64/72.
Both sides of the dual-port 36 Kb RAM can be of variable width.
Two adjacent 36 Kb block RAMs can be configured as one cascaded 64K × 1 dual-port RAM without any additional logic.
Error Detection and Correction
Each 64-bit-wide block RAM can generate, store, and utilize eight additional Hamming code bits and perform single-bit error
correction and double-bit error detection (ECC) during the read process. The ECC logic can also be used when writing to or
reading from external 64- to 72-bit-wide memories.
FIFO Controller
The built-in FIFO controller for single-clock (synchronous) or dual-clock (asynchronous or multirate) operation increments
the internal addresses and provides four handshaking flags: full, empty, almost full, and almost empty. The almost full and
almost empty flags are freely programmable. Similar to the block RAM, the FIFO width and depth are programmable, but the
write and read ports always have identical width.
First word fall-through mode presents the first-written word on the data output even before the first read operation. After the
first word has been read, there is no difference between this mode and the standard mode.
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Digital Signal Processing — DSP Slice
Some highlights of the DSP functionality include:
•
•
•
25 × 18 two's complement multiplier/accumulator high-resolution (48 bit) signal processor
Power saving pre-adder to optimize symmetrical filter applications
Advanced features: optional pipelining, optional ALU, and dedicated buses for cascading
DSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP slices. All 7 series
FPGAs have many dedicated, full custom, low-power DSP slices, combining high speed with small size while retaining
system design flexibility.
Each DSP slice fundamentally consists of a dedicated 25 × 18 bit two's complement multiplier and a 48-bit accumulator,
both capable of operating up to 741 MHz. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a
single-instruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad 12-bit
add/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions of the two operands.
The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves performance in
densely packed designs and reduces the DSP slice count by up to 50%. The DSP also includes a 48-bit-wide Pattern
Detector that can be used for convergent or symmetric rounding. The pattern detector is also capable of implementing
96-bit-wide logic functions when used in conjunction with the logic unit.
The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and efficiency of many
applications beyond digital signal processing, such as wide dynamic bus shifters, memory address generators, wide bus
multiplexers, and memory-mapped I/O register files. The accumulator can also be used as a synchronous up/down counter.
Input/Output
Some highlights of the input/output functionality include:
•
•
•
High-performance SelectIO technology with support for 1,866 Mb/s DDR3
High-frequency decoupling capacitors within the package for enhanced signal integrity
Digitally Controlled Impedance that can be 3-stated for lowest power, high-speed I/O operation
The number of I/O pins varies depending on device and package size. Each I/O is configurable and can comply with a large
number of I/O standards. With the exception of the supply pins and a few dedicated configuration pins, all other package pins
have the same I/O capabilities, constrained only by certain banking rules. The I/O in 7 series FPGAs are classed as high
range (HR) or high performance (HP). The HR I/Os offer the widest range of voltage support, from 1.2V to 3.3V. The HP I/Os
are optimized for highest performance operation, from 1.2V to 1.8V.
HR and HP I/O pins in 7 series FPGAs are organized in banks, with 50 pins per bank. Each bank has one common V
CCO
output supply, which also powers certain input buffers. Some single-ended input buffers require an internally generated or an
externally applied reference voltage (V ). There are two V pins per bank (except configuration bank 0). A single bank
REF
REF
can have only one V
voltage value.
REF
Xilinx 7 series FPGAs use a variety of package types to suit the needs of the user, including small form factor wire-bond
packages for lowest cost; conventional, high performance flip-chip packages; and bare-die flip-chip packages that balance
smaller form factor with high performance. In the flip-chip packages, the silicon device is attached to the package substrate
using a high-performance flip-chip process. Controlled ESR discrete decoupling capacitors are mounted on the package
substrate to optimize signal integrity under simultaneous switching of outputs (SSO) conditions.
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I/O Electrical Characteristics
Single-ended outputs use a conventional CMOS push/pull output structure driving High towards V
or Low towards
CCO
ground, and can be put into a high-Z state. The system designer can specify the slew rate and the output strength. The input
is always active but is usually ignored while the output is active. Each pin can optionally have a weak pull-up or a weak pull-
down resistor.
Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin pairs can optionally be
terminated with a 100Ω internal resistor. All 7 series devices support differential standards beyond LVDS: RSDS, BLVDS,
differential SSTL, and differential HSTL.
Each of the I/Os supports memory I/O standards, such as single-ended and differential HSTL as well as single-ended SSTL
and differential SSTL. The SSTL I/O standard can support data rates of up to 1,866 Mb/s for DDR3 interfacing applications.
3-State Digitally Controlled Impedance and Low Power I/O Features
The 3-state Digitally Controlled Impedance (T_DCI) can control the output drive impedance (series termination) or can
provide parallel termination of an input signal to V
or split (Thevenin) termination to V
/2. This allows users to
CCO
CCO
eliminate off-chip termination for signals using T_DCI. In addition to board space savings, the termination automatically
turns off when in output mode or when 3-stated, saving considerable power compared to off-chip termination. The I/Os also
have low power modes for IBUF and IDELAY to provide further power savings, especially when used to implement memory
interfaces.
I/O Logic
Input and Output Delay
All inputs and outputs can be configured as either combinatorial or registered. Double data rate (DDR) is supported by all
inputs and outputs. Any input and some outputs can be individually delayed by up to 32 increments of 78 ps, 52 ps, or 39 ps
each. Such delays are implemented as IDELAY and ODELAY. The number of delay steps can be set by configuration and
can also be incremented or decremented while in use.
ISERDES and OSERDES
Many applications combine high-speed, bit-serial I/O with slower parallel operation inside the device. This requires a
serializer and deserializer (SerDes) inside the I/O structure. Each I/O pin possesses an 8-bit IOSERDES (ISERDES and
OSERDES) capable of performing serial-to-parallel or parallel-to-serial conversions with programmable widths of 2, 3, 4, 5,
6, 7, or 8 bits. By cascading two IOSERDES from two adjacent pins (default from differential I/O), wider width conversions
of 10 and 14 bits can also be supported. The ISERDES has a special oversampling mode capable of asynchronous data
recovery for applications like a 1.25 Gb/s LVDS I/O-based SGMII interface.
Low-Power Gigabit Transceivers
Some highlights of the Low-Power Gigabit Transceivers include:
•
High-performance transceivers capable of up to 6.6 Gb/s (GTP), 12.5 Gb/s (GTX), 13.1 Gb/s (GTH), or 28.05 Gb/s
(GTZ) line rates depending on the family, enabling the first single device for 400G implementations.
•
•
Low-power mode optimized for chip-to-chip interfaces.
Advanced Transmit pre and post emphasis, receiver linear equalization (CTLE), and decision feedback equalization
(DFE) for long reach or backplane applications. Auto-adaption at receiver equalization and on-chip Eye Scan for easy
serial link tuning.
Ultra-fast serial data transmission to optical modules, between ICs on the same PCB, over the backplane, or over longer
distances is becoming increasingly popular and important to enable customer line cards to scale to 100 Gb/s and onwards
to 400 Gb/s. It requires specialized dedicated on-chip circuitry and differential I/O capable of coping with the signal integrity
issues at these high data rates.
The transceiver count in the 7 series FPGAs ranges from up to 16 transceiver circuits in the Artix-7 family, up to 32
transceiver circuits in the Kintex-7 family, and up to 96 transceiver circuits in the Virtex-7 family. Each serial transceiver is a
combined transmitter and receiver. The various 7 series serial transceivers use either a combination of ring oscillators and
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LC tank or, in the case of the GTZ, a single LC tank architecture to allow the ideal blend of flexibility and performance while
enabling IP portability across the family members. The different 7 series family members offer different top-end data rates.
The GTP operates up to 6.6 Gb/s, the GTX operates up to 12.5 Gb/s, the GTH operates up to 13.1 Gb/s, and the GTZ
operates up to 28.05 Gb/s. Lower data rates can be achieved using FPGA logic-based oversampling. The serial transmitter
and receiver are independent circuits that use an advanced PLL architecture to multiply the reference frequency input by
certain programmable numbers up to 100 to become the bit-serial data clock. Each transceiver has a large number of user-
definable features and parameters. All of these can be defined during device configuration, and many can also be modified
during operation.
Transmitter
The transmitter is fundamentally a parallel-to-serial converter with a conversion ratio of 16, 20, 32, 40, 64, or 80. Additionally,
the GTZ transmitter supports up to 160 bit data widths. This allows the designer to trade-off datapath width for timing margin
in high-performance designs. These transmitter outputs drive the PC board with a single-channel differential output signal.
TXOUTCLK is the appropriately divided serial data clock and can be used directly to register the parallel data coming from
the internal logic. The incoming parallel data is fed through an optional FIFO and has additional hardware support for the
8B/10B, 64B/66B, or 64B/67B encoding schemes to provide a sufficient number of transitions. The bit-serial output signal
drives two package pins with differential signals. This output signal pair has programmable signal swing as well as
programmable pre- and post-emphasis to compensate for PC board losses and other interconnect characteristics. For
shorter channels, the swing can be reduced to reduce power consumption.
Receiver
The receiver is fundamentally a serial-to-parallel converter, changing the incoming bit-serial differential signal into a parallel
stream of words, each 16, 20, 32, 40, 64, or 80 bits. Additionally, the GTZ receiver supports up to 160 bit data widths. This
allows the FPGA designer to trade-off internal datapath width versus logic timing margin. The receiver takes the incoming
differential data stream, feeds it through programmable linear and decision feedback equalizers (to compensate for PC
board and other interconnect characteristics), and uses the reference clock input to initiate clock recognition. There is no
need for a separate clock line. The data pattern uses non-return-to-zero (NRZ) encoding and optionally guarantees
sufficient data transitions by using the selected encoding scheme. Parallel data is then transferred into the FPGA logic using
the RXUSRCLK clock. For short channels, the transceivers offers a special low power mode (LPM) to reduce power
consumption by approximately 30%.
Out-of-Band Signaling
The transceivers provide out-of-band (OOB) signaling, often used to send low-speed signals from the transmitter to the
receiver while high-speed serial data transmission is not active. This is typically done when the link is in a powered-down
state or has not yet been initialized. This benefits PCI Express and SATA/SAS applications.
Integrated Interface Blocks for PCI Express Designs
Highlights of the integrated blocks for PCI Express include:
•
Compliant to the PCI Express Base Specification 2.1 or 3.0 (depending of family) with Endpoint and Root Port
capability
•
•
Supports Gen1 (2.5 Gb/s), Gen2 (5 Gb/s), and Gen3 (8 Gb/s) depending on device family
Advanced configuration options, Advanced Error Reporting (AER), and End-to-End CRC (ECRC) Advanced Error
Reporting and ECRC features
•
Multiple-function and single root I/O virtualization (SR-IOV) support enabled through soft-logic wrappers or embedded
in the integrated block depending on family
All Artix-7, Kintex-7, and Virtex-7 devices include at least one integrated block for PCI Express technology that can be
configured as an Endpoint or Root Port, compliant to the PCI Express Base Specification Revision 2.1 or 3.0. The Root Port
can be used to build the basis for a compatible Root Complex, to allow custom FPGA-to-FPGA communication via the PCI
Express protocol, and to attach ASSP Endpoint devices, such as Ethernet Controllers or Fibre Channel HBAs, to the FPGA.
This block is highly configurable to system design requirements and can operate 1, 2, 4, or 8 lanes at the 2.5 Gb/s, 5.0 Gb/s,
and 8.0 Gb/s data rates. For high-performance applications, advanced buffering techniques of the block offer a flexible
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7 Series FPGAs Data Sheet: Overview
maximum payload size of up to 1,024 bytes. The integrated block interfaces to the integrated high-speed transceivers for
serial connectivity and to block RAMs for data buffering. Combined, these elements implement the Physical Layer, Data Link
Layer, and Transaction Layer of the PCI Express protocol.
Xilinx provides a light-weight, configurable, easy-to-use LogiCORE™ IP wrapper that ties the various building blocks (the
integrated block for PCI Express, the transceivers, block RAM, and clocking resources) into an Endpoint or Root Port
solution. The system designer has control over many configurable parameters: lane width, maximum payload size, FPGA
logic interface speeds, reference clock frequency, and base address register decoding and filtering.
Xilinx offers two wrappers for the integrated block: AXI4-Stream and AXI4 (memory mapped). Note that legacy TRN/Local
Link is not available in 7 series devices for the integrated block for PCI Express. AXI4-Stream is designed for existing
customers of the integrated block and enables easy migration to AXI4-Stream from TRN. AXI4 (memory mapped) is
designed for Xilinx Platform Studio/EDK design flow and MicroBlaze™ processor based designs.
More information and documentation on solutions for PCI Express designs can be found at:
http://www.xilinx.com/products/technology/pci-express.html.
Configuration
There are many advanced configuration features, including:
•
•
•
•
•
High-speed SPI and BPI (parallel NOR) configuration
Built-in MultiBoot and safe-update capability
256-bit AES encryption with HMAC/SHA-256 authentication
Built-in SEU detection and correction
Partial reconfiguration
Xilinx 7 series FPGAs store their customized configuration in SRAM-type internal latches. There are up to 450 Mb
configuration bits, depending on device size and user-design implementation options. The configuration storage is volatile
and must be reloaded whenever the FPGA is powered up. This storage can also be reloaded at any time by pulling the
PROGRAM_B pin Low. Several methods and data formats for loading configuration are available, determined by the three
mode pins.
The SPI interface (x1, x2, and x4 modes) and the BPI interface (parallel-NOR x8 and x16) are two common methods used
for configuring the FPGA. Users can directly connect an SPI or BPI flash to the FPGA, and the FPGA's internal configuration
logic reads the bitstream out of the flash and configures itself. The FPGA automatically detects the bus width on the fly,
eliminating the need for any external controls or switches. Bus widths supported are x1, x2, and x4 for SPI, and x8 and x16
for BPI. The larger bus widths increase configuration speed and reduce the amount of time it takes for the FPGA to start up
after power-on. Some configuration options such as BPI are not supported in all device-package combinations. Refer to
UG470, 7 Series FPGAs Configuration User Guide for details.
In master mode, the FPGA can drive the configuration clock from an internally generated clock, or for higher speed
configuration, the FPGA can use an external configuration clock source. This allows high-speed configuration with the ease
of use characteristic of master mode. Slave modes up to 32 bits wide are also supported by the FPGA that are especially
useful for processor-driven configuration.
The FPGA has the ability to reconfigure itself with a different image using SPI or BPI flash, eliminating the need for an
external controller. The FPGA can reload its original design in case there are any errors in the data transmission, ensuring
an operational FPGA at the end of the process. This is especially useful for updates to a design after the end product has
been shipped. Customers can ship their products with an early version of the design, thus getting their products to market
faster. This feature allows customers to keep their end users current with the most up-to-date designs while the product is
already in the field.
The dynamic reconfiguration port (DRP) gives the system designer easy access to the configuration and status registers of
the MMCM, PLL, XADC, transceivers, and integrated block for PCI Express. The DRP behaves like a set of memory-mapped
registers, accessing and modifying block-specific configuration bits as well as status and control registers.
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Encryption, Readback, and Partial Reconfiguration
In all 7 series FPGAs (except XC7S6 and XC7S15), the FPGA bitstream, which contains sensitive customer IP, can be
protected with 256-bit AES encryption and HMAC/SHA-256 authentication to prevent unauthorized copying of the design.
The FPGA performs decryption on the fly during configuration using an internally stored 256-bit key. This key can reside in
battery-backed RAM or in nonvolatile eFUSE bits.
Most configuration data can be read back without affecting the system's operation. Typically, configuration is an
all-or-nothing operation, but Xilinx 7 series FPGAs support partial reconfiguration. This is an extremely powerful and flexible
feature that allows the user to change portions of the FPGA while other portions remain static. Users can time-slice these
portions to fit more IP into smaller devices, saving cost and power. Where applicable in certain designs, partial
reconfiguration can greatly improve the versatility of the FPGA.
XADC (Analog-to-Digital Converter)
Highlights of the XADC architecture include:
•
•
•
•
•
Dual 12-bit 1 MSPS analog-to-digital converters (ADCs)
Up to 17 flexible and user-configurable analog inputs
On-chip or external reference option
On-chip temperature ( 4°C max error) and power supply ( 1% max error) sensors
Continuous JTAG access to ADC measurements
All Xilinx 7 series FPGAs (except XC7S6 and XC7S15) integrate a new flexible analog interface called XADC. When
combined with the programmable logic capability of the 7 series FPGAs, the XADC can address a broad range of data
acquisition and monitoring requirements. For more information, go to: http://www.xilinx.com/ams.
The XADC contains two 12-bit 1 MSPS ADCs with separate track and hold amplifiers, an on-chip analog multiplexer (up to
17 external analog input channels supported), and on-chip thermal and supply sensors. The two ADCs can be configured to
simultaneously sample two external-input analog channels. The track and hold amplifiers support a range of analog input
signal types, including unipolar, bipolar, and differential. The analog inputs can support signal bandwidths of at least
500 KHz at sample rates of 1MSPS. It is possible to support higher analog bandwidths using external analog multiplexer
mode with the dedicated analog input (see UG480, 7 Series FPGAs and Zynq-7000 All Programmable SoC XADC Dual
12-Bit 1 MSPS Analog-to-Digital Converter User Guide).
The XADC optionally uses an on-chip reference circuit ( 1%), thereby eliminating the need for any external active
components for basic on-chip monitoring of temperature and power supply rails. To achieve the full 12-bit performance of the
ADCs, an external 1.25V reference IC is recommended.
If the XADC is not instantiated in a design, then by default it digitizes the output of all on-chip sensors. The most recent
measurement results (together with maximum and minimum readings) are stored in dedicated registers for access at any
time via the JTAG interface. User-defined alarm thresholds can automatically indicate over-temperature events and
unacceptable power supply variation. A user-specified limit (for example, 100°C) can be used to initiate an automatic
powerdown.
EasyPath-7 FPGAs
EasyPath-7 FPGAs provide a fast, simple, and risk-free solution for cost reducing Kintex-7, Virtex-7 T, and Virtex-7 XT FPGA
designs. EasyPath-7 FPGAs support the same packages, speed grades, and match all Kintex-7 or Virtex-7 FPGA data
sheet specifications (in function and timing). With no re-engineering or re-qualification, EasyPath-7 FPGAs deliver the
lowest total product cost compared to any other FPGA cost-reduction solution.
DS180 (v2.6) February 27, 2018
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Product Specification
14
7 Series FPGAs Data Sheet: Overview
7 Series FPGA Ordering Information
Table 12 shows the speed and temperature grades available in the different device families. Some devices might not be available in every
speed and temperature grade.
Table 12: 7 Series Speed Grade and Temperature Ranges
Speed Grade, Temperature Range, and Operating Voltage
Device
Family
Devices
Commercial (C)
0°C to +85°C
Extended (E)
0°C to +100°C
Industrial (I)
–40°C to +100°C
Expanded (Q)
–40°C to +125°C
-2C (1.0V)
-2I (1.0V)
Spartan-7
All
All
-1C (1.0V)
-1I (1.0V)
-1Q (1.0V)
-1LI (0.95V)
-3E (1.0V)
-2C (1.0V)
-1C (1.0V)
-2I (1.0V)
Artix-7
-2LE (1.0V or 0.9V)
-1I (1.0V)
-1LI (0.95V)
-3E (1.0V)
-2LE (1.0V or 0.9V)
-3E (1.0V)
-2C (1.0V)
-1C (1.0V)
-2C (1.0V)
-1C (1.0V)
-2C (1.0V)
-2I (1.0V)
-1I (1.0V)
XC7K70T
Kintex-7
XC7K160T
XC7K325T
XC7K355T
XC7K410T
XC7K420T
XC7K480T
-2I (1.0V)
-2LI (0.95V)
-1I (1.0V)
-2LE (1.0V or 0.9V)
-3E (1.0V)
-2I (1.0V)
-1I (1.0V)
XC7V585T
-2LE (1.0V)
-1C (1.0V)
-2C (1.0V)
Virtex-7 T
-2GE (1.0V)
-2LE (1.0V)
XC7V2000T
-1C (1.0V)
-2C (1.0V)
-1I (1.0V)
-2I (1.0V)
-3E (1.0V)
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
-2LE (1.0V)
-1C (1.0V)
-2C (1.0V)
-1I (1.0V)
-1I (1.0V)
Virtex-7 XT
XC7VX980T
-2LE (1.0V)
-1C (1.0V)
-2C (1.0V)
-2GE (1.0V)
-2LE (1.0V)
XC7VX1140T
-1C (1.0V)
-2C (1.0V)
-1I (1.0V)
-2GE (1.0V)
-2LE (1.0V)
Virtex-7 HT
All
-1C (1.0V)
DS180 (v2.6) February 27, 2018
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Product Specification
15
7 Series FPGAs Data Sheet: Overview
The Spartan-7 FPGA ordering information is shown in Figure 1. Refer to the Package Marking section of UG475, 7 Series
FPGAs Packaging and Pinout for a more detailed explanation of the device markings.
X-Ref Target - Figure 1
Example:
X C 7 S 50 - 2 FG G A484 C
Device Type
Temperature Range
C: Commercial (Tj = 0°C to +85°C)
I: Industrial (Tj = –40°C to +100°C)
Q: Expanded (Tj = –40°C to +125°C)
Speed Grade
(-L1(1), -1, -2)
Package Designator and Pin Count
(Footprint Identifier)
Pb-Free
Package Type
1) -L1 is the ordering code for the lower power, -1L speed grade.
DS180_01_012517
Figure 1: Spartan-7 FPGA Ordering Information
The Artix-7, Kintex-7, and Virtex-7 FPGA ordering information, shown in Figure 2, applies to all packages including Pb-Free.
Refer to the Package Marking section of UG475, 7 Series FPGAs Packaging and Pinout for a more detailed explanation of
the device markings.
X-Ref Target - Figure 2
Example: X C 7 K 3 2 5 T - 2 F B G 9 0 0 C
Device Type
Temperature Range
C: Commercial (Tj = 0°C to +85°C)
E: Extended (Tj = 0°C to +100°C)
I: Industrial (Tj = –40°C to +100°C)
Speed Grade
(-L1(1), -L2(2), -G2(3), -1, -2, -3)
Number of Pins(4)
Pb-Free
V: RoHS 6/6
G (CPG, CSG, FTG, FGG): RoHS 6/6
G (FFG, FBG, SBG, FLG, FHG): RoHS 6/6 with Exemption 15
Package Type
1) -L1 is the ordering code for the lower power, -1L speed grade.
2) -L2 is the ordering code for the lower power, -2L speed grade.
3) -G2 is the ordering code for the -2 speed grade devices with higher performance transceivers.
4) Some package names do not exactly match the number of pins present on that package.
See UG475: 7 Series FPGAs Packaging and Pinout User Guide for package details.
DS180_01_061317
Figure 2: Artix-7, Kintex-7, and Virtex-7 FPGA Ordering Information
DS180 (v2.6) February 27, 2018
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Product Specification
16
7 Series FPGAs Data Sheet: Overview
Revision History
The following table shows the revision history for this document:
Date
Version
1.0
Description of Revisions
06/21/10
07/30/10
Initial Xilinx release.
1.1
Added SHA-256 to authentication information. Updated Table 5, Table 7, Virtex-7 FPGA Device-
Package Combinations and Maximum I/Os table (Virtex-7 T devices), and Table 9 with ball pitch
information and voltage bank information. Updated DSP and Logic Slice information in Table 8.
Updated Low-Power Gigabit Transceivers.
09/24/10
1.2
In General Description, updated 4.7 TMACS DSP to 5.0 TMACS DSP. In Table 1, added Note 1;
updated Peak DSP Performance for Kintex-7 and Virtex-7 families. In Table 4, updated CMT
information for XC7A175T and XC7A355T. In Table 6, replaced XC7K120T with XC7K160T and
replaced XC7K230T with XC7K325T—and updated corresponding information. Also added
XC7K355T, XC7K420T, and XC7K480T. In Table 7,replaced XC7K230T with XC7K325T. In Table 8,
updated XC7V450T Logic Cell, CLB, block RAM, and PCI information; updated XC7VX415T and
XC7VX690T PCI information; updated XC7V1500T, and XC7V2000T block RAM information; and
replaced XC7VX605T with XC7VX575T, replaced XC7VX895T with XC7VX850T, and replaced
XC7VX910T with XC7VX865T—and updated corresponding information. Updated Digital Signal
Processing — DSP Slice with operating speed of 640 MHz. Removed specific transceiver type from
Out-of-Band Signaling. In Virtex-7 FPGA Device-Package Combinations and Maximum I/Os table
(Virtex-7 T devices), replaced XC7VX605T with XC7VX575T and added table notes 2 and 3. In
Table 9, removed the FFG784 package for the XC7VX485T device; replaced XC7VX605T with
XC7VX575T; replaced XC7VX895T with XC7VX850T; and replaced XC7VX910T with XC7VX865T.
10/20/10
11/17/10
1.3
1.4
In Table 7, replaced XC7K120T with XC7K160T. Updated Digital Signal Processing — DSP Slice.
Updated maximum I/O bandwidth to 3.1 Tb/s in General Description. Updated Peak Transceiver Speed
for Virtex-7 FPGAs in Summary of 7 Series FPGA Features and in Table 1. Updated Peak DSP
Performance values in Table 1 and Digital Signal Processing — DSP Slice. In Table 7, updated
XC7K70T I/O information. In Table 8, added XC7VH290T, XC7VH580T, and XC7VH870T devices and
updated total I/O banks information for the XC7V585T, XC7V855T, XC7V1500T, and XC7VX865T
devices. In Table 9, updated XC7VX415T, XC7VX485T, XC7VX690T, XC7VX850T, and XC7VX865T
device information. Added Table 11. Updated Low-Power Gigabit Transceivers information, including
the addition of the GTZ transceivers.
02/22/11
1.5
Updated Summary of 7 Series FPGA Features and the Low-Power Gigabit Transceivers highlights and
section. In Table 1, updated Kintex-7 FPGA, Artix-7 FPGA information. In Table 4, updated XC7A175T.
Also, updated XC7A355T. Added three Artix-7 FPGA packages to Table 5: SBG325, SBG484, and
FBG485, changed package from FGG784 to FBG784, and updated package information for
XC7A175T and XC7A355T devices. In Table 6, updated XC7K160T and added three devices:
XC7K355T, XC7K420T, andXC7K480T. In Table 7, updatedXC7K70Tpackageinformationandadded
three devices: XC7K355T, XC7K420T, and XC7K480T. In Table 8, added note 1 (EasyPath FPGAs)
and updated note 7 to include GTZ transceivers. In Virtex-7 FPGA Device-Package Combinations and
Maximum I/Os table (Virtex-7 T devices), added two Virtex-7 FPGA packages: FHG1157 and
FHG1761, and updated XC7V1500T (no FFG1157) and XC7V2000T (no FFG1761) package
information and removed the associated notes. Added CLBs, Slices, and LUTs. Updated Input/Output.
Added EasyPath-7 FPGAs.
03/28/11
07/06/11
1.6
1.7
UpdatedGeneralDescription, Summaryof7 SeriesFPGAFeatures, Table 1,Table 4, Table 5, Table 6,
Table 7, Table 8, Table 9 (combinedVirtex-7 T and XT devices in one table), and Table 11. Updated the
Low-Power Gigabit Transceivers highlights and section. Updated Block RAM, Integrated Interface
Blocks for PCI Express Designs, Configuration, Encryption, Readback, and Partial Reconfiguration,
XADC (Analog-to-Digital Converter), 7 Series FPGA Ordering Information, and EasyPath-7 FPGAs.
UpdatedGeneralDescription, Summaryof7 SeriesFPGAFeatures, Table 1,Table 4, Table 6, Table 8,
Table 9andTable 11. AddedTable 10. AddedStackedSiliconInterconnect(SSI)Technology. Updated
Transmitter, Configuration, and XADC (Analog-to-Digital Converter). Updated Figure 1.
09/13/11
01/15/12
1.8
1.9
Updated General Description, Table 1, Table 4, Table 5, Table 8, CLBs, Slices, and LUTs,
Configuration, and 7 Series FPGA Ordering Information.
Updated General Description, Table 1, Table 4, Table 5, Table 6, Table 7, Table 8, Table 10, Table 11,
Block RAM, Digital Signal Processing — DSP Slice, Low-Power Gigabit Transceivers, Integrated
Interface Blocks for PCI Express Designs, Configuration, EasyPath-7 FPGAs, and 7 Series FPGA
Ordering Information.
DS180 (v2.6) February 27, 2018
www.xilinx.com
Product Specification
17
7 Series FPGAs Data Sheet: Overview
Date
Version
1.10
Description of Revisions
Updated General Description, Table 5, and Table 12.
03/02/12
05/02/12
1.11
Updated Table 7, Table 9, Table 10, Low-Power Gigabit Transceivers, and 7 Series FPGA Ordering
Information. Added 7 Series FPGA Ordering Information.
10/15/12
1.12
UpdatedoverviewwithArtix-7SLandSLTdevices.UpdatedTable 1,Table 4,Table 5,Table 8,Table 9,
Table 10, Table 11, and Table 12. Added Table 3. Updated Regional Clocks, Block RAM, Integrated
Interface Blocks for PCI Express Designs, Configuration, and 7 Series FPGA Ordering Information.
11/30/12
07/29/13
1.13
1.14
Updated notes in Table 4 and Table 12. Updated XADC (Analog-to-Digital Converter).
Removed SL and SLT devices. Updated General Description, Table 4, Table 5, notes in Table 6 and
Table 8, Regional Clocks, Input/Output, Low-Power Gigabit Transceivers, Integrated Interface Blocks
for PCI Express Designs, Configuration, and 7 Series FPGA Ordering Information. Removed previous
Table 3.
02/18/14
10/08/14
1.15
1.16
Changed document classification to Product Specification from Preliminary Product Specification.
Updated HR I/O information for XC7A35T and XC7A50T in Table 5. Updated XC7VH870T I/O
information in Table 8. Updated Table 11.
Added XC7A15T to Table 4 and Table 5. Removed HCG1931 and HCG1932 from Table 11. Updated
Input/Output Delay; Block RAM; Configuration; I/O Clocks; and Updated Table 12 and Figure 1.
12/17/14
05/27/15
09/27/16
1.16.1
1.17
2.0
Typographical edit.
Updated Table 5, Table 7, Table 9, Table 10, Table 11, and Figure 1.
Added Spartan-7 devices throughout document, including Table 1, Table 2, Table 3, and Table 12.
Added two Artix-7 devices XC7A12T and XC7A25T throughout document, including Table 4, Table 5,
and Table 12. Updated General Description; Figure 1, Table 7, Regional Clocks, Block RAM,
Integrated Interface Blocks for PCI Express Designs, Configuration, Encryption, Readback, and Partial
Reconfiguration, and XADC (Analog-to-Digital Converter).
10/20/16
12/15/16
03/17/17
03/28/17
08/01/17
02/27/18
2.1
2.2
2.3
2.4
2.5
2.6
Updated Table 5.
Updated Table 3.
Updated Table 1, Table 5, Table 7, Table 9, Table 10, Table 12, and I/O Electrical Characteristics.
Updated Table 7.
Updated Table 5 and Figure 2.
Added MicroBlaze CPU information to the Summary of 7 Series FPGA Features and Table 1.
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permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS,
EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR
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of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials),
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terms and conditions of Xilinx’s limited warranty, please refer to Xilinx’s Terms of Sale which can be viewed at www.xilinx.com/legal.htm#tos; IP cores may
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Automotive Applications Disclaimer
AUTOMOTIVE PRODUCTS (IDENTIFIED AS "XA" IN THE PART NUMBER) ARE NOT WARRANTED FOR USE IN THE DEPLOYMENT OF AIRBAGS
OR FOR USE IN APPLICATIONS THAT AFFECT CONTROL OF A VEHICLE ("SAFETY APPLICATION") UNLESS THERE IS A SAFETY CONCEPT OR
REDUNDANCY FEATURE CONSISTENT WITH THE ISO 26262 AUTOMOTIVE SAFETY STANDARD ("SAFETY DESIGN"). CUSTOMER SHALL,
PRIOR TO USING OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE PRODUCTS, THOROUGHLY TEST SUCH SYSTEMS FOR SAFETY
PURPOSES. USE OF PRODUCTS IN A SAFETY APPLICATION WITHOUT A SAFETY DESIGN IS FULLY AT THE RISK OF CUSTOMER, SUBJECT
ONLY TO APPLICABLE LAWS AND REGULATIONS GOVERNING LIMITATIONS ON PRODUCT LIABILITY.
DS180 (v2.6) February 27, 2018
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Product Specification
18
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