AF162-FR-131R5L [YAGEO]

ANTI-SULFURATED CHIP RESISTORS;


型号：	AF162-FR-131R5L
厂家：	YAGEO CORPORATION
描述：	ANTI-SULFURATED CHIP RESISTORS
文件：	总8页 (文件大小：555K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

ANTI-SULFURATED CHIP RESISTORS

AF122 (4Pin/2R) / AF124 (8Pin/4R) /

AF162 (4Pin/ 2R)/ AF164 (8Pin/ 4R)

5%, 1%

sizes 2 × 0402, 4 x 0402, 2 x 0603, 4 x 0603

RoHS compliant

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

SCOPE

ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC

This specification describes

AF122/AF124/AF162/AF164

(convex)series chip resistor arrays

with lead-free terminations made

by thick film process.

Both part numbers are identified by the series, size, tolerance, packing

type, temperature coefficient, taping reel and resistance value.

YAGEO BRAND ordering code

(

)

GLOBAL PART NUMBER PREFERRED

AF XX X - X X X XX XXXX L

(1) (2) (3)(4) (5) (6)

(7)

APPLICATIONS

(1)

(2)

SIZE

 Terminal for SDRAM and

DDRAM

12 = 0402 x 2 (0404)

12 = 0402 x 4 (0408)

16 = 0603 x 2 (0606)

16 = 0603 x 4 (0612)

NUMBER OF RESISTORS

 High-end Computer &

Multimedia Electronics in high

sulfur environment

 Consume electronic

equipments: PDAs, PNDs

2 = 2 resistors

4 = 4 resistors

 Mobile phone, telecom…

(3) TOLERANCE

FEATURES

F = ±1%

 AEC-Q200 qualified

J = ±5% (for Jumper ordering, use code of J)

 RoHS compliant

(4) PACKAGING TYPE

 Reducing environmentally

hazardous wastes

R = Paper taping reel

 High component and equipment

reliability

(5) TEMPERATURE COEFFICIENT OF RESISTANCE

– = Base on spec

 Saving of PCB space

(6) TAPING REEL

 None forbidden-materials used

in products/production

07 = 7 inch dia. Reel

13 = 13 inch dia. Reel

 Halogen Free Epoxy

 Moisture sensitivity level: MSL 1

(7) RESISTANCE VALUE

There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need

to mention the last zero after R/K/M, e.g.1K2, not 1K20.

Detailed resistance rules show in table of “Resistance rule of global part number”.

Resistance rule of global part

number

ORDERING EXAMPLE

The ordering code of a AF122

convex chip resistor array, value

1,000Ω with ±5% tolerance,

supplied in 7-inch tape reel is:

AF122-JR-071KL.

Resistance code rule

Example

0R = Jumper

1R = 1 Ω

1R5 = 1.5 Ω

9R76 = 9.76 Ω

XRXX

(1 to 9.76 Ω)

NOTE

XXRX

(10 to 97.6 Ω)

10R = 10 Ω

97R6 = 97.6 Ω

1. All our R-Chip products meet RoHS

compliant. "LFP" of the internal 2D reel

label mentions "Lead Free Process"

XXXR

(100 to 976 Ω)

100R = 100 Ω

2. On customized label, "LFP" or specific

symbol printed and the optional "L" at

the end of GLOBAL PART NUMBER

XKXX

(1 to 9.76 KΩ)

1K = 1,000 Ω

9K76 = 9760 Ω

1M = 1,000,000 Ω

(1 MΩ)

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Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

MARKING

AF122 / 162

No marking

Fig. 1

AF124 / 164

I-Digit marking

Fig. 2 Value = 0Ω

1% E-24/E-96: R≧ 100Ω 4digits

First three digits for significant figure and 4th digit for number of zeros

3 60

Fig. 3 Value = 316KΩ

5% E-24: R≧ 10Ω

First two digits for significant figure and 3rd digit for number of zeros

Fig. 3 Value = 240KΩ

For further marking information, please refer to data sheet “Chip resistors marking”.

CONSTRUCTION

The resistor is constructed on top

of a high-grade ceramic body.

OUTLINES

Internal metal electrodes are added

on each end to make the contacts to

the thick film resistive element. The

composition of the resistive element

is a noble metal embedded into a

glass and covered by a glass. The

resistor is laser trimmed to the

rated resistance value. The resistor

is covered with a protective epoxy

coat, finally the external

Fig. 4 Chip resistor outlines

terminations (matte tin on Ni-

barrier) are added as shown in Fig.4.

DIMENSIONS

Table 1

For dimension, please refer to Table 1

AF122 / 162

TYPE

AF122

0.24±0.10

0.30+0.10/-0.05

---

AF124

0.25±0.15

0.45±0.05

0.30±0.05

0.50±0.05

2.00±0.10

0.45±0.10

0.30±0.15

1.00±0.10

AF162

0.35±0.10

0.30±0.10

AF164

0.35±0.15

0.65±0.05

0.50±0.15

0.80±0.05

3.20±0.15

0.60±0.10

0.30± 0.15

1.60±0.15

AF124 / 164

B (mm)

H (mm)

H₁(mm)

P (mm)

L (mm)

T (mm)

0.80±0.05

1.60±0.10

0.40±0.10

0.30±0.10

1.60±0.10

0.67±0.05

1.00±0.10

0.30±0.10

0.25±0.10

1.00±0.10

Fig. 5 AF122/124/162/164 series chip resistors dimension

W₁(mm)

W₂(mm)

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Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

SCHEMATIC

For dimension, please refer to Fig. 5 and Table 1

Fig. 6 Equivalent circuit diagram

ELECTRICAL CHARACTERISTICS

Table 2

AF122

AF124

AF162

AF164

CHARACTERISTICS

Operating Temperature

Rated Power

–55 °C to +155 °C

1/16 W

–55 °C to +155 °C

1/16W

1/16 W

25 V

Maximum Working Voltage

Maximum Overload Voltage

Dielectric Withstanding

50V

50 V

100V

100 V

50 V

100V

100 V

5% (E24) 1 Ω to 1 MΩ

1% (E24/E96) 10 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ

Resistance Range

Jumper < 50 mΩ

1 Ω ≤ R ≤ 10 Ω ±250 ppm/°C

10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C

Temperature Coefficient

Jumper Criteria

±250 ppm/°C

Rated Current 1.0A

Rated Current

Maximum Current

0.5 A

Rated Current

1.0 A

Rated Current

1.0 A

2.0 A

Maximum Current 2.0A

1.0 A Maximum Current

2.0 A Maximum Current

FOOTPRINT AND SOLDERING PROFILES

For recommended footprint and soldering profiles, please refer to data sheet

“Chip resistors mounting”.

PACKING STYLE AND PACKAGING QUANTITY

Table 3 Packing style and packaging quantity

PACKING STYLE

REEL DIMENSION

7" (178 mm)

AF122

10,000 units

50,000 units

AF124

10,000 units

40,000 units

AF162

AF164

5,000 units

20,000 units

Paper Taping Reel (R)

5,000 units

---

13" (330 mm)

NOTE

1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.

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Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

FUNCTIONAL DESCRIPTION

POWER RATING

AF122 / AF124 / AF162 / AF164 rated power at

70 °C is 1/16 W

RATED VOLTAGE

The DC or AC (rms) continuous working voltage

corresponding to the rated power is determined by

the following formula:

V= (P XR)

or max. working voltage whichever is less

Fig. 7 Maximum dissipation (P) in percentage of rated power as a

function of the operating ambient temperature (T

Where

)

amb

V=Continuous rated DC or

AC (rms) working voltage (V)

P=Rated power (W)

R=Resistance value (Ω)

www.yageo.com

Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

MIL-STD-202-method 108

IEC 60115-1 4.25

1,000 hours at 70± 2 °C applied RCWV

1.5 hours on, 0.5 hour off, still air required

±(2%+0.05 Ω )

Life/

Endurance

<100 mΩ for Jumper

MIL-STD-202-method 108

MIL-STD-202-method 106

1,000 hours at maximum operating

temperature depending on specification,

unpowered

±(1%+0.05 Ω)

<50 mΩ for Jumper

High Temperature

Exposure

Tolerances: 155±3 °C

Each temperature / humidity cycle is defined at ±(2%+0.05 Ω)

Moisture

8 hours (method 106G), 3 cycles / 24 hours

for 10d with 25 °C / 65 °C 95% R.H, without

steps 7a & 7b, unpowered

Resistance

<100 mΩ for Jumper

Parts mounted on test-boards, without

condensation on parts

Measurement at 24±2 hours after

test conclusion

MIL-STD-202-method 107

-55/+125 °C

±(1%+0.05 Ω)

Thermal Shock

Note: Number of cycles required is 300.

Devices mounted

<50 mΩ for Jumper

Maximum transfer time is 20 seconds. Dwell

time is 15 minutes. Air – Air

IEC60115-1 4.13

IEC60115-1 4.33

2.5 times RCWV or maximum overload

voltage whichever is less for 5 sec at room

temperature

±(2%+0.05 Ω)

Short Time

Overload

<50 mΩ for Jumper

No visible damage

Device mounted on PCB test board as

described, only 1 board bending required

±(1%+0.05 Ω)

Board Flex/

Bending

<50 mΩ for Jumper

No visible damage

3 mm bending

Bending time: 60±5 seconds

Ohmic value checked during bending

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Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

TEST

TEST METHOD

J-STD-002 test B

PROCEDURE

REQUIREMENTS

Solderability

- Wetting

Well tinned (≥95% covered)

No visible damage

Electrical Test not required

Magnification 50X

SMD conditions:

1^ststep: method B, aging 4 hours at 155 °C

dry heat

2^ndstep: leadfree solder bath at 245±3 °C

Dipping time: 3±0.5 seconds

J-STD-002 test D

IEC 60115-1 4.18

Leadfree solder, 260 °C, 30 seconds

immersion time

No visible damage

- Leaching

Condition B, no pre-heat of samples

±(1%+0.05Ω)

- Resistance to

Soldering Heat

MIL-STD-202 Method 215

Leadfree solder, 260 °C, 10 seconds

immersion time

<50 mΩ for Jumper

No visible damage

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

ASTM-B-809-95*

*Modified

±(4.0%+0.05Ω)

FOS

Sulfur 750 hours, 105℃, unpowered

<100mΩ for Jumper

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Jun. 28, 2016 V.4

Product specification

SERIES

122/124/162/164 (RoHS Compliant)

Chip Resistor Surface Mount

REVISION HISTORY

REVISION DATE

CHANGE NOTIFICATION DESCRIPTION

Version 4

Version 3

Version 2

Version 1

Version 0

Jun. 23, 2016

Nov. 17, 2015

May 29,2015

Aug. 15, 2014

Oct. 02, 2013

- AEC-Q200 qualified

- Add in AF162

- Add in AF164

- Update AF124 dimensions

- First issue of this specification

“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any

product change will be announced by PCN.”

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Jun. 28, 2016 V.4

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